IDT ICS843246BGI

ICS843246I
FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY
SYNTHESIZER W/INTEGRATED FANOUT BUFFER
GENERAL DESCRIPTION
FEATURES
The ICS843246I is a Crystal-to-3.3V LVPECL Clock
ICS
Synthesizer/Fanout Buffer designed for Fibre
HiPerClockS™
Channel and Gigabit Ethernet applications and is
a member of the HiperClockS™ family of High
Performance Clock Solutions from IDT. The output
frequency can be set using the frequency select pins and a
25MHz crystal for Ethernet frequencies, or a 26.5625MHz
crystal for a Fibre Channel. The low phase noise characteristics
of the ICS843246I make it an ideal clock for these demanding
applications.
• Six LVPECL outputs
• Crystal oscillator interface
• VCO range: 490MHz to 680MHz
• Crystal input frequency range: 25MHz to 33.333MHz
• RMS phase jitter at 125MHz, using a 25MHz crystal
(1.875MHz to 20MHz): 0.41ps (typical)
• Full 3.3V or 3.3V core, 2.5V output supply mode
Core/Output
3.3V/3.3V
3.3V/2.5V
• -40°C to 85°C ambient operating temperature
SELECT FUNCTION TABLE
Inputs
FB_SEL
• Available in both standard (RoHS 5) and lead-free (RoHS 6)
packages
Function
N_SEL1
N_SEL0
M Divide
N Divide
M/N
0
0
0
20
2
10
0
0
1
20
4
5
0
1
0
20
5
4
0
1
1
20
8
2.5
1
0
0
24
3
8
1
0
1
24
4
6
1
1
0
24
6
4
1
1
1
24
12
2
BLOCK DIAGRAM
Q0
nQ0
PLL_BYPASS
Pullup
Q1
1
XTAL_IN
OSC
PLL
0
nQ1
Output
Divider
XTAL_OUT
nQ2
Q3
Feedback
Divider
N_SEL0
VCCO
VCCO
nQ2
Q2
nQ1
Q1
nQ0
Q0
PLL_BYPASS
VCCA
VCC
FB_SEL
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
Q3
nQ3
Q4
nQ4
Q5
nQ5
N_SEL1
VEE
VEE
N_SEL0
XTAL_OUT
XTAL_IN
nQ3
ICS843246I
FB_SEL Pulldown
N_SEL1
Q2
PIN ASSIGNMENT
Q4
Pullup
nQ4
Pullup
Q5
24-Lead TSSOP, E-Pad
4.40mm x 7.8mm x 0.9mm
body package
G Package
Top View
nQ5
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
TABLE 1. PIN DESCRIPTIONS
Number
Name
1, 2
VCCO
3, 4
5, 6
Type
Description
Power
Output supply pins.
nQ2, Q2
Output
Differential output pair. LVPECL interface levels.
nQ1, Q1
Output
Differential output pair. LVPECL interface levels.
7, 8
nQ0, Q0
Output
9
PLL_BYPASS
Input
10
VCCA
Power
Differential output pair. LVPECL interface levels.
Selects between the PLL and crystal inputs as the input to the dividers.
When LOW, selects PLL. When HIGH, selects XTAL_IN, XTAL_OUT.
LVCMOS / LVTTL interface levels.
Analog supply pin.
11
VCC
Power
Core supply pin.
12
13,
14
15,
18
16, 17
FB_SEL
XTAL_IN,
XTAL_OUT
N_SEL0
N_SEL1
VEE
Input
19, 20
nQ5, Q5
Output
21, 22
nQ4, Q4
Output
Differential output pair. LVPECL interface levels.
23, 24
nQ3, Q3
Output
Differential output pair. LVPECL interface levels.
Input
Input
Pullup
Pulldown Feedback frequency select pin. LVCMOS/LVTTL interface levels.
Crystal oscillator interface. XTAL_IN is the input.
XTAL_OUT is the output.
Pullup
Output frequency select pins. LVCMOS/LVTTL interface levels.
Negative supply pins.
Differential output pair. LVPECL interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
CIN
Input Capacitance
4
pF
RPULLUP
Input Pullup Resistor
51
kΩ
RPULLDOWN
Input Pulldown Resistor
51
kΩ
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
Test Conditions
2
Minimum
Typical
Maximum
Units
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
TABLE 3. TYPICAL APPLICATION FREQUENCY FUNCTION TABLE
Inputs
XTAL (MHz)
FB_SEL
Function
N_SEL1
N_SEL0
M
VCO (MHz)
N
Output (MHz)
25
0
0
0
20
500
2
250
25
0
0
1
20
500
4
125
25
0
1
0
20
500
5
10 0
25
0
1
1
20
500
8
62.5
25
1
0
0
24
600
3
200
25
1
0
1
24
600
4
150
25
1
1
0
24
600
6
100
25
1
1
1
24
600
12
50
26.5625
0
1
0
20
531.25
5
106.25
26.5625
1
0
0
24
637.5
3
212.5
26.5625
1
0
1
24
637.5
4
159.375
26.5625
1
1
0
24
637.5
6
106.25
26.5625
1
1
1
24
637.5
12
53.125
30
0
0
0
20
600
2
300
30
0
0
1
20
600
4
150
30
0
1
0
20
600
5
12 0
30
0
1
1
20
600
8
75
31.25
0
0
0
20
625
2
312.5
31.25
0
0
1
20
62 5
4
156.25
31.25
0
1
0
20
62 5
5
12 5
31.25
0
1
1
20
625
8
78.125
33.3333
0
0
0
20
666.6667
2
333.3333
33.3333
0
0
1
20
666.6667
4
166.6667
33.3333
0
1
0
20
666.6667
5
133.3333
33.3333
0
1
1
20
666.6667
8
83.3333
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5V
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability.
Package Thermal Impedance, θJA 37°C/W (0 mps)
-65°C to 150°C
Storage Temperature, TSTG
TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VCC = VCCO = 3.3V±5%, VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
VCC
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
3.135
3. 3
3.465
V
VCCA
Analog Supply Voltage
VCC – 0.10
3. 3
VCC
V
VCCO
Output Supply Voltage
3.135
3.3
3.465
V
IEE
Power Supply Current
180
mA
ICCA
Analog Supply Current
10
mA
TABLE 4B. POWER SUPPLY DC CHARACTERISTICS, VCC = 3.3V±5%, VCCO = 2.5V±5%, VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
VCC
Core Supply Voltage
Test Conditions
Minimum
Typical
Maximum
Units
3.135
3. 3
3.465
V
VCCA
Analog Supply Voltage
VCC – 0.10
3.3
VCC
V
VCCO
Output Supply Voltage
2.375
2.5
2.625
V
IEE
Power Supply Current
180
mA
ICCA
Analog Supply Current
10
mA
TABLE 4C. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = 3.3V±5%, VCCO = 3.3V±5% OR 2.5V±5%, VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
VIH
Input High Voltage
VIL
Input Low Voltage
IIH
Input High Current
IIL
Input Low Current
Test Conditions
Minimum
2
-0.3
FB_SEL
PLL_BYPASS,
N_SEL0, N_SEL1
FB_SEL
PLL_BYPASS,
N_SEL0, N_SEL1
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
Typical
Maximum
Units
VCC + 0.3
V
0.8
V
VCC = VIN = 3.465V
150
µA
VCC = VIN = 3.465V
5
µA
VCC = 3.465V, VIN = 0V
-5
µA
VCC = 3.465V, VIN = 0V
-150
µA
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
TABLE 4D. LVPECL DC CHARACTERISTICS, VCC = 3.3V±5%, VCCO = 3.3V±5% OR 2.5V±5%, VEE = 0V, TA = -40°C TO 85°C
Symbol
Parameter
Maximum
Units
VOH
Output High Voltage; NOTE 1
Test Conditions
Minimum
VCCO - 1.4
Typical
VCCO - 0.9
V
VOL
Output Low Voltage; NOTE 1
VCCO - 2.0
VCCO - 1.7
V
VSWING
Peak-to-Peak Output Voltage Swing
0.6
1.0
V
NOTE 1: Outputs terminated with 50Ω to VCCO - 2V.
TABLE 5. CRYSTAL CHARACTERISTICS
Parameter
Test Conditions
Minimum
Mode of Oscillation
Typical Maximum
Units
Fundamental
Frequency
25
33.333
MHz
Equivalent Series Resistance (ESR)
50
Ω
Shunt Capacitance
7
pF
Maximum
Units
340
MHz
NOTE: Characterized using an 18pF parallel resonant crystal.
TABLE 6A. AC CHARACTERISTICS, VCC = VCCO = 3.3V±5%, VEE = 0V, TA = -40°C TO 85°C
Symbol Parameter
FOUT
t jit(Ø)
Test Conditions
Output Frequency
RMS Phase Jitter (Random)
t sk(o)
Output Skew; NOTE 1, 2
tR / tF
Output Rise/Fall Time
Minimum
Typical
40.833
125MHz, Integration Range:
1.875MHz - 20MHz
312.5MHz, Integration Range:
1.875MHz - 20MHz
20% to 80%
0.41
ps
0.47
ps
200
odc
Output Duty Cycle
45
See Parameter Measurement Information section.
NOTE 1: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential crossing points.
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.
40
ps
700
ps
55
%
Maximum
Units
340
MH z
TABLE 6B. AC CHARACTERISTICS, VCC = 3.3V±5%, VCCO = 2.5V±5%, VEE = 0V, TA = -40°C TO 85°C
Symbol Parameter
FOUT
t jit(Ø)
Test Conditions
Output Frequency
RMS Phase Jitter (Random)
t sk(o)
Output Skew; NOTE 1, 2
tR / tF
Output Rise/Fall Time
Minimum
Typical
40.833
125MHz, Integration Range:
1.875MHz - 20MHz
312.5MHz, Integration Range:
1.875MHz - 20MHz
20% to 80%
0.44
ps
0.46
ps
200
odc
Output Duty Cycle
45
See Parameter Measurement Information section.
NOTE 1: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential crossing points.
NOTE 2: This parameter is defined in accordance with JEDEC Standard 65.
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
5
40
ps
700
ps
55
%
ICS843246BGI REV. A AUGUST 2, 2007
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
➤
TYPICAL PHASE NOISE AT 125MHZ @ 3.3V
Gb Ethernet Filter
Raw Phase Noise Data
➤
➤
NOISE POWER dBc
Hz
125MHz
RMS Phase Jitter (Random)
1.875MHz to 20MHz = 0.41ps (typical)
Phase Noise Result by adding
Gb Ethernet Filter to raw data
OFFSET FREQUENCY (HZ)
➤
TYPICAL PHASE NOISE AT 312.5MHZ @ 3.3V
Gb Ethernet Filter
Raw Phase Noise Data
➤
➤
NOISE POWER dBc
Hz
312.5MHz
RMS Phase Jitter (Random)
1.875MHz to 20MHz = 0.47ps (typical)
Phase Noise Result by adding
Gb Ethernet Filter to raw data
OFFSET FREQUENCY (HZ)
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
PARAMETER MEASUREMENT INFORMATION
2.8V±0.04V
2V
2V
2.8V±0.04V
2V
VCC
VCC,
VCCO
Qx
SCOPE
Qx
VCCO
SCOPE
VCCA
VCCA
LVPECL
LVPECL
nQx
VEE
nQx
VEE
-0.5V ± 0.125V
-1.3V ± 0.165V
3.3V OUTPUT LOAD AC TEST CIRCUIT
3.3V/2.5V OUTPUT LOAD AC TEST CIRCUIT
Phase Noise Plot
Noise Power
nQx
Qx
nQy
Phase Noise Mask
Qy
tsk(o)
f1
Offset Frequency
f2
RMS Jitter = Area Under the Masked Phase Noise Plot
OUTPUT SKEW
RMS PHASE JITTER
nQ0:nQ5
80%
80%
Q0:Q5
VSW I N G
Clock
Outputs
t PW
20%
20%
tR
t
tF
odc =
PERIOD
t PW
x 100%
t PERIOD
OUTPUT RISE/FALL TIME
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
APPLICATION INFORMATION
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply pins
are vulnerable to random noise. The ICS843246I provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. V CC , V CCA and
VCCO should be individually connected to the power supply plane
through vias, and bypass capacitors should be used for each
pin. To achieve optimum jitter performance, power supply isolation is required. Figure 1 illustrates how a 10Ω resistor along
with a 10μF and a .01μF bypass capacitor should be connected
to each VCCA pin.
3.3V
VCC
.01μF
10Ω
VCCA
.01μF
10μF
FIGURE 1. POWER SUPPLY FILTERING
RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS
INPUTS:
OUTPUTS:
LVCMOS CONTROL PINS
All control pins have internal pull-ups or pull-downs; additional
resistance is not required but can be added for additional
protection. A 1kΩ resistor can be used.
LVPECL OUTPUTS
All unused LVPECL outputs can be left floating. We recommend
that there is no trace attached. Both sides of the differential output
pair should either be left floating or terminated.
CRYSTAL INPUT INTERFACE
below were determined using an 18pF parallel resonant
crystal and were chosen to minimize the ppm error.
The ICS843246I has been characterized with 18pF parallel
resonant crystals. The capacitor values shown in Figure 2
XTAL_OUT
C1
22p
X1
18pF Parallel Crystal
XTAL_IN
C2
22p
FIGURE 2. CRYSTAL INPUt INTERFACE
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
LVCMOS TO XTAL INTERFACE
impedance of the driver (Ro) plus the series resistance (Rs) equals
the transmission line impedance. In addition, matched termination
at the crystal input will attenuate the signal in half. This can be
done in one of two ways. First, R1 and R2 in parallel should equal
the transmission line impedance. For most 50Ω applications, R1
and R2 can be 100Ω. This can also be accomplished by removing
R1 and making R2 50Ω.
The XTAL_IN input can accept a single-ended LVCMOS signal
through an AC coupling capacitor. A general interface diagram is
shown in Figure X. The XTAL_OUT pin can be left floating. The
input edge rate can be as slow as 10ns. For LVCMOS inputs, it is
recommended that the amplitude be reduced from full swing to
half swing in order to prevent signal interference with the power
rail and to reduce noise. This configuration requires that the output
VDD
VDD
R1
Ro
.1uf
Rs
Zo = 50
Zo = Ro + Rs
XTAL_IN
R2
XTAL_OUT
FIGURE 3. GENERAL DIAGRAM FOR LVCMOS DRIVER TO XTAL INPUT
TERMINATION FOR 3.3V LVPECL OUTPUT
The clock layout topology shown below is a typical termination
for LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
drive 50Ω transmission lines. Matched impedance techniques
should be used to maximize operating frequency and minimize
signal distortion. Figures 3A and 3B show two different layouts
which are recommended only as guidelines. Other suitable
clock layouts may exist and it would be recommended that the
board designers simulate to guarantee compatibility across all
printed circuit and clock component process variations.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC current path to ground) or current sources
must be used for functionality. These outputs are designed to
3.3V
Zo = 50Ω
125Ω
FOUT
FIN
Zo = 50Ω
Zo = 50Ω
FOUT
50Ω
RTT =
125Ω
1
Z
((VOH + VOL) / (VCC – 2)) – 2 o
FIN
50Ω
Zo = 50Ω
VCC - 2V
RTT
84Ω
FIGURE 3A. LVPECL OUTPUT TERMINATION
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
84Ω
FIGURE 3B. LVPECL OUTPUT TERMINATION
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
TERMINATION FOR 2.5V LVPECL OUTPUT
Figure 4A and Figure 4B show examples of termination for 2.5V
LVPECL driver. These ter minations are equivalent to
terminating 50Ω to VCC - 2V. For VCC = 2.5V, the VCC - 2V is very
close to ground level. The R3 in Figure 4B can be eliminated
and the termination is shown in Figure 4C.
2.5V
2.5V
2.5V
VCCO=2.5V
VCCO=2.5V
R1
250
R3
250
Zo = 50 Ohm
Zo = 50 Ohm
+
+
Zo = 50 Ohm
Zo = 50 Ohm
-
-
2,5V LVPECL
Driv er
2,5V LVPECL
Driv er
R2
62.5
R1
50
R4
62.5
R2
50
R3
18
FIGURE 4B. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
FIGURE 4A. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
2.5V
VCCO=2.5V
Zo = 50 Ohm
+
Zo = 50 Ohm
2,5V LVPECL
Driv er
R1
50
R2
50
FIGURE 4C. 2.5V LVPECL DRIVER TERMINATION EXAMPLE
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
LAYOUT GUIDELINE
Figure 5 shows an example of ICS843246I application schematic. In this example, the device is operated at VCC = 3.3V. The
18pF parallel resonant 25MHz crystal is used. The C1 = 22pF
and C2 = 22pF are recommended for frequency accuracy. For
different board layout, the C1 and C2 may be slightly adjusted
for optimizing frequency accuracy. Two examples of LVPECL
termination are shown in this schematic. Additional termination
approaches are shown in the LVPECL Termination Application
Note.
3.3V
PLL_BY PASS
VCC
VCCA
R2
10
R3
133
R5
133
Zo = 50 Ohm
C3
10uF
C4
0.01u
+
Zo = 50 Ohm
Logic Control Input Examples
To Logic
Input
pins
To Logic
Input
pins
RD1
Not Install
R6
82.5
12
11
10
9
8
7
6
5
4
3
2
1
RU2
Not Install
R4
82.5
RD2
1K
U1
843246I
XTAL_IN
FB_SEL
XTAL_OUT
VCC
N_SEL0
VCCA
VEE
PLL_BYPASS
VEE
Q0
N_SEL1
nQ0
nQ5
Q1
Q5
nQ1
nQ4
Q2
Q4
nQ2
nQ3
VCCO
Q3
VCCO
RU1
1K
FB_SEL
Set Logic
Input to
'0'
VDD
-
VCCO
VCC=3.3V
VCCO=3.3V
13
14
15
16
17
18
19
20
21
22
23
24
Set Logic
Input to
'1'
VDD
VCC
Zo = 50 Ohm
VCC (U1-11)
+
X1
C2
22pF
C5
0.1uF
25MHz
18pF
Zo = 50 Ohm
C1
22pF
(U1-1)
VCCO
C6
0.1uF
N_SEL0
R7
50
R8
50
N_SEL1
(U1-2)
Optional
Y-Termination
C7
0.1uF
R9
50
FIGURE 5. SCHEMATIC OF RECOMMENDED LAYOUT
THERMAL RELEASE PATH
The expose metal pad provides heat transfer from the device
to the P.C. board. The expose metal pad is ground pad
connected to ground plane through thermal via. The exposed
pad on the device to the exposed metal pad on the PCB is
contacted through solder as shown in Figure 4. For further
information, please refer to the Application Note on Surface
Mount Assembly of Amkor’s Thermally /Electrically Enhance
Leadframe Base Package, Amkor Technology.
EXPOSED PAD
SOLDER M ASK
SOLDER
SIGNAL
TRACE
SIGNAL
TRACE
GROUND PLANE
Expose Metal Pad
THERM AL VIA
FIGURE 6. P.C. BOARD
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
FOR
(GROUND PAD)
EXPOSED PAD THERMAL RELEASE PATH EXAMPLE
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FEMTOCLOCKS™ CRYSTAL-TO-3.3V LVPECL FREQUENCY SYNTHESIZER W/FANOUT BUFFER
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS843246I.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS843246I is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
·
·
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 180mA = 623.7mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 6* 30mW = 180mW
Total Power_MAX (3.465V, with all outputs switching) = 623.7mW + 180mW = 803.7mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming no air
flow and a multi-layer board, the appropriate value is 37°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.804W * 37°C/W = 114.7°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 7. THERMAL RESISTANCE θJA FOR 24-PIN TSSOP, E-PAD FORCED CONVECTION
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
IDT ™ / ICS™ 3.3V LVPECL FREQUENCY SYNTHESIZER
0
1
2.5
37°C/W
31°C/W
30°C/W
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3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 7.
VCCO
Q1
VOUT
RL
50
VCCO - 2V
FIGURE 7. LVPECL DRIVER CIRCUIT
AND TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V – 2V.
CCO
•
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.9V
(VCCO_MAX – VOH_MAX) = 0.9V
•
For logic low, VOUT = VOL_MAX = VCCO_MAX – 1.7V
(VCCO_MAX – VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MAX – (VCCO_MAX – 2V))/R ] * (VCCO_MAX – VOH_MAX) = [(2V – (VCCO_MAX – VOH_MAX))/R ] * (VCCO_MAX – VOH_MAX) =
L
L
[(2V – 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(VOL_MAX – (VCCO_MAX – 2V))/R ] * (VCCO_MAX – VOL_MAX) = [(2V – (VCCO_MAX – VOL_MAX))/R ] * (VCCO_MAX – VOL_MAX) =
L
L
[(2V – 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
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PACKAGE OUTLINE - G SUFFIX FOR 24 LEAD TSSOP, E-PAD
TABLE 9. PACKAGE DIMENSIONS FOR 24 LEAD TSSOP, E-PAD
SYMBOL
Millimeters
Minimum
N
Nominal
Maximum
24
A
--
1.10
A1
0.05
0.15
A2
0.85
b
0.19
b1
0.19
c
0.09
c1
0.09
D
7. 7 0
E
E1
0.90
0.95
0.30
0.22
0.25
0.20
0.127
0.16
7.80
7.90
6.40 BASIC
4.30
e
4.40
4.50
0.65 BASIC
L
0.50
0.60
P
5.0
5.5
P1
3.0
3.2
α
0°
8°
aaa
0.076
bbb
0.10
0.70
Reference Document: JEDEC Publication 95, MO-153
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RELIABILITY INFORMATION
TABLE 8. θJAVS. AIR FLOW TABLE
FOR
24 LEAD TSSOP, E-PAD
θJA by Velocity (Meters per Second)
Multi-Layer PCB, JEDEC Standard Test Boards
0
1
2.5
37°C/W
31°C/W
30°C/W
TRANSISTOR COUNT
The transistor count for ICS843246I is: 3863
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TABLE 10. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
ICS843246BGI
ICS843246BGI
24 Lead TSSOP, E-Pad
tube
-40°C to 85°C
ICS843246BGIT
ICS843246BGI
24 Lead TSSOP, E-Pad
2500 tape & reel
-40°C to 85°C
ICS843246BGILF
ICS843246BGIL
24 Lead "Lead-Free" TSSOP, E-Pad
tube
-40°C to 85°C
ICS843246BGILFT
ICS843246BGIL
24 Lead "Lead-Free" TSSOP, E-Pad
2500 tape & reel
-40°C to 85°C
NOTE: Par ts that are ordered with an "LF" suffix to the par t number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology, Incorporated (IDT) assumes no responsibility for either its use or for
infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial and
industrial applications. Any other applications such as those requiring high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT
reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
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