Package Information

Package Information
Vishay Siliconix
MICRO FOOT: 10-BUMP (4 mm x 3 mm, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)
10 X Ø 0.150 ~ 0.229
Note b
Solder Mask Ø ~ Pad Diameter + 0.1
Silicon
0.5
A2
A
A1
Bump
Note a
0.5
3
4
Recommended Land Pattern
2
1
b Diameter
A
e
Index-Bump A1
Note c
B
E
e
XXX
3535
C
S
S
e
e
e
Top Side (Die Back)
D
Notes
(unless otherwise specified)
a. Bump is lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.
DIM.
MILLIMETERSa
INCHES
MIN.
MAX.
MIN.
MAX.
A
0.688
0.753
0.0271
0.0296
A1
0.218
0.258
0.0086
0.0102
A2
0.470
0.495
0.0185
0.0195
0.0136
b
0.306
0.346
0.0120
D
1.980
2.020
0.0780
0.0795
E
1.480
1.520
0.0583
0.0598
e
S
0.5 BASIC
0.230
0.0197 BASIC
0.270
0.0091
0.0106
Note
a. Use millimeters as the primary measurement.
ECN: S11-1065-Rev. A, 13-Jun-11
DWG: 6001
Document Number: 63272
Revision:13-Jun-11
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