Package Information Vishay Siliconix MICRO FOOT: 10-BUMP (4 mm x 3 mm, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT) 10 X Ø 0.150 ~ 0.229 Note b Solder Mask Ø ~ Pad Diameter + 0.1 Silicon 0.5 A2 A A1 Bump Note a 0.5 3 4 Recommended Land Pattern 2 1 b Diameter A e Index-Bump A1 Note c B E e XXX 3535 C S S e e e Top Side (Die Back) D Notes (unless otherwise specified) a. Bump is lead (Pb)-free Sn/Ag/Cu. b. Non-solder mask defined copper landing pad. c. Laser mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only. DIM. MILLIMETERSa INCHES MIN. MAX. MIN. MAX. A 0.688 0.753 0.0271 0.0296 A1 0.218 0.258 0.0086 0.0102 A2 0.470 0.495 0.0185 0.0195 0.0136 b 0.306 0.346 0.0120 D 1.980 2.020 0.0780 0.0795 E 1.480 1.520 0.0583 0.0598 e S 0.5 BASIC 0.230 0.0197 BASIC 0.270 0.0091 0.0106 Note a. Use millimeters as the primary measurement. ECN: S11-1065-Rev. A, 13-Jun-11 DWG: 6001 Document Number: 63272 Revision:13-Jun-11 www.vishay.com 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000