Package Information

Package Information
Vishay Siliconix
MICRO FOOT: 6-BUMP (3 mm x 2 mm, 0.5 mm PITCH, 165 μm BUMP HEIGHT)
6 x Ø 0.150 ~ 0.229
Note b
Solder Mask Ø ~ Pad Dia. + 0.1
0.5
Silicon
0.5
A2
A
A1
Recommended Land Pattern
Bump
Note a
Index-Bump A1
Note c
3
2
1
b Diameter
A
XXX
3003
E
e
B
S
S
Top Side (Die Back)
e
D
Notes
(unless otherwise specified)
a. Bump is Eutectic 63/57 Sn/Pb or lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser mark on silicon die back; no coating. Shown is not actual marking; sample only.
EUTECTIC (Sn/Pb)
DIM.
LEAD (Pb)-FREE (Sn/Ag/Cu)
MILLIMETERSa
INCHES
MIN.
MAX.
MIN.
MAX.
A
0.610
0.685
0.0240
0.0270
A1
0.140
0.190
0.0055
A2
0.470
0.495
0.0185
b
0.180
0.250
D
1.490
E
0.990
e
S
MILLIMETERSa
INCHES
MIN.
MAX.
MIN.
MAX.
A
0.688
0.753
0.0271
0.0296
0.0075
A1
0.218
0.258
0.0086
0.0102
0.0195
A2
0.470
0.495
0.0185
0.0195
0.0071
0.0098
b
0.306
0.346
0.0120
0.0136
1.515
0.0587
0.0596
D
1.490
1.515
0.0587
0.0596
1.015
0.0390
0.0400
E
0.990
1.015
0.0390
0.0400
0.5 BASIC
0.245
DIM.
0.258
0.0197 BASIC
0.0096
Note
a. Use millimeters as the primary measurement.
0.0101
e
S
0.5 BASIC
0.245
0.258
0.0197 BASIC
0.0096
0.0101
Note
a. Use millimeters as the primary measurement.
ECN: S11-1065-Rev. A, 13-Jun-11
DWG: 6003
Document Number: 63270
Revision: 13-Jun-11
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