Package Information Vishay Siliconix MICRO FOOT: 6-BUMP (3 mm x 2 mm, 0.5 mm PITCH, 165 μm BUMP HEIGHT) 6 x Ø 0.150 ~ 0.229 Note b Solder Mask Ø ~ Pad Dia. + 0.1 0.5 Silicon 0.5 A2 A A1 Recommended Land Pattern Bump Note a Index-Bump A1 Note c 3 2 1 b Diameter A XXX 3003 E e B S S Top Side (Die Back) e D Notes (unless otherwise specified) a. Bump is Eutectic 63/57 Sn/Pb or lead (Pb)-free Sn/Ag/Cu. b. Non-solder mask defined copper landing pad. c. Laser mark on silicon die back; no coating. Shown is not actual marking; sample only. EUTECTIC (Sn/Pb) DIM. LEAD (Pb)-FREE (Sn/Ag/Cu) MILLIMETERSa INCHES MIN. MAX. MIN. MAX. A 0.610 0.685 0.0240 0.0270 A1 0.140 0.190 0.0055 A2 0.470 0.495 0.0185 b 0.180 0.250 D 1.490 E 0.990 e S MILLIMETERSa INCHES MIN. MAX. MIN. MAX. A 0.688 0.753 0.0271 0.0296 0.0075 A1 0.218 0.258 0.0086 0.0102 0.0195 A2 0.470 0.495 0.0185 0.0195 0.0071 0.0098 b 0.306 0.346 0.0120 0.0136 1.515 0.0587 0.0596 D 1.490 1.515 0.0587 0.0596 1.015 0.0390 0.0400 E 0.990 1.015 0.0390 0.0400 0.5 BASIC 0.245 DIM. 0.258 0.0197 BASIC 0.0096 Note a. Use millimeters as the primary measurement. 0.0101 e S 0.5 BASIC 0.245 0.258 0.0197 BASIC 0.0096 0.0101 Note a. Use millimeters as the primary measurement. ECN: S11-1065-Rev. A, 13-Jun-11 DWG: 6003 Document Number: 63270 Revision: 13-Jun-11 www.vishay.com 1 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000