ROHM BU1523KV-E2

Image Correction ICs
Image Correction IC
for Panel
BU1523KV
No.11060EAT05
●Description
BU1523KV is an image quality adjustment IC for in-vehicle displays. It can control brightness, contrast, hue, intensity,
sharpness, etc. It is equipped with both RGB and YCbCr as input/output interfaces. It also incorporates LVDS output
capability with an embedded LVDS transmitter.
●Features
1) RGB input data format
Width of data bus 24bit
Vertical/horizontal synchronizing and data enable signal
2) RGB output data format
It is the same as the entry format
3) YCbCr input data format
ITU-R BT.656-4 or synchronization signal YCbCr
Width of data bus 8bit
Vertical/horizontal synchronizing and data field signal
Date range conform ITU-R BT.601 or full range
4) YCbCr output data format
The same as the entry format
Capable of processing BT.656 input to generate and output
synchronization signal from SAV/EAV
5) RGB IF Image quality adjustment
Contrast, Brightness, Hue, Chroma and Sharpness
Independent RGB gamma correction
6) YCbCr Image quality adjustment
Contrast, Brightness, Hue, Chroma and Sharpness
7) LVDS Transmitter
Built-in LVDS transmitter
Converts RGB24 bit, vertical/horizontal synchronization signal
and data enable inputs into 4ch LVDS data streams
8) 2-line serial interface slave function
The register in BU1523KV can be set
9) Package
VQFP100
●Applications
In-vehicle display etc.
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© 2011 ROHM Co., Ltd. All rights reserved.
1/22
2011.02 - Rev.A
Technical Note
BU1523KV
●Absolute maximum ratings
[Table 1]
Parameter
Symbol
Ratings
Unit
Supply voltage 1
VDDIO
-0.3~+4.0
V
Supply voltage 2
VDDI2C
-0.3~+4.0
V
Supply voltage 3
PVDD
-0.3~+4.0
V
Supply voltage 4
LVDD
-0.3~+4.0
V
Supply voltage 5
VDD
-0.3~+2.1
V
Input voltage range
VIN
-0.3~IO_LVL+0.3 *1
V
Storage temperature range
Tstg
-40~+125
℃
Power dissipation
PD
1000 *2, 1499 *3
mW
*1
*2
*3
*
*
IO_LVL is a generic name of VDDIO, VDDI2C
IC only. In the case exceeding 25℃, 10mW should be reduced at the rating 1℃.
When packaging a glass epoxy board of 70x70x1.6mm. If exceeding 25℃, 14.99mW should be reduced at the rating 1℃
Has not been designed to withstand radiation.
Operation is not guaranteed at absolute maximum ratings.
●Operating conditions
[Table 2]
Parameter
Symbol
Ratings
Min.
Typ.
Max.
Unit
Supply voltage1(IO)
VDDIO
3.0
3.3
3.6
V
Supply voltage2(IO)
VDDI2C
3.0
3.3
3.6
V
Supply voltage3(PLL)
PVDD
3.0
3.3
3.6
V
Supply voltage4(LVDS)
LVDD
3.0
3.3
3.6
V
Supply voltage5(CORE)
VDD
1.65
1.8
1.95
V
Input voltage range
VIN
0.0
-
IO_LVL*1
V
Operating temperature range
Topr
-40
-
+85
℃
*1 IO_LVL is a generic name of VDDIO, VDDI2C.
*
Please supply power source in order of VDD→ (VDDIO, VDDI2C, PVDD,LVDD).
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© 2011 ROHM Co., Ltd. All rights reserved.
2/22
2011.02 - Rev.A
Technical Note
BU1523KV
●Block Diagram
LPDNB
RGBMUTE
MIR_EN
RDI0~RDI7
GDI0~GDI7
BDI0~BDI7
RGBCKI
RGBHSI
RGBVSI
RGBDEI
CbCr
Y
RGB/
YCbCr
Convert
Hue
Adjust
YCbCr/
RGB
Convert
Chroma
Adjust
RGB
Gamma
Output
Data
Convert
TAP/TAN
TBP/TBN
TCP/TCN
TDP/TDN
LVDS
Transmitter
RGB
Contrast
Adjust
Brightness
Adjust
Sharpnes
Adjust
TCKP/TCKN
PLL
RGB IF Image quality adjustment part
YDI0~YDI7
YCKI
YHSI
YVSI
YFLDI
SAV/EAV
Detect
CbCr
Y
Hue
Adjust
Chroma
Adjust
Contrast
Adjust
Brightness
Adjust
Output
Data
Convert
YDO0~YDO7
YCKO
YHSO
YVSO
YFLDO
Sharpnes
Adjust
YCbCr IF Image quality adjustment part
SCL
SDA
I2CDEV
I2C IF
(slave)
Register
RESETB
TEST0
TEST1
The LVDS data output mode
LPDNB
RGBMUTE
MIR_EN
RDI0~RDI7
GDI0~GDI7
BDI0~BDI7
RGBCKI
RGBHSI
RGBVSI
RGBDEI
CbCr
Y
RGB/
YCbCr
conversion
Hue
Adjust
YCbCr/
RGB
Convert
Chroma
Adjust
RGB
Gamma
Output
Data
Convert
LVDS
Transmitter
RGB
Contrast
Adjust
Brightness
Adjust
Sharpnes
Adjust
PLL
RGB IF Image quality adjustment part
SCL
SDA
I2CDEV
I2C IF
(slave)
TAP/TAN
TBP/TBN
TCP/TCN
TDP/TDN
Register
TCKP/TCKN
RDO0~RDO7
GDO0~GDO7
BDO0~BDO7
RGBCKO
RGBHSO
RGBVSO
RGBDEO
RESETB
TEST0
TEST1
The RGB data output mode (YCbCr interface cannot be used.)
Terminal selection from register
*Change their modes with register setting.
Fig. 1 Block diagram
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© 2011 ROHM Co., Ltd. All rights reserved.
3/22
2011.02 - Rev.A
Technical Note
BU1523KV
●Terminal Functions・Equivalent circuit diagram
[Table 3 Terminal Functions (1/4)]
PIN
No.
PIN
Name
In/Out
Init
(*1)
(*2)
Function Description
PowerSupply
System
(*4)
I/O
Type
1
BDI4
I
-
RGB B Data [4] input
a
A
2
BDI5
I
-
RGB B Data [5] input
a
A
3
BDI6
I
-
RGB B Data [6] input
a
A
4
BDI7
I
-
RGB B Data [7] input
a
A
5
RGBHSI
I
-
RGB H Sync input
a
A
6
RGBVSI
I
-
RGB V Sync input
a
A
7
RGBDEI
I
-
RGB Data Enable input
a
A
8
GND
G
-
Ground
a,b
-
9
RGBCKI
I
-
RGB Clock input
a
B
10
VDDIO
P
-
IO power source
a
-
11
I2CVDD
P
-
2-line serial interface IO power source
b
-
12
SDA
I/O
In
2-line serial interface data input / output (*6)
b
G
13
SCL
I
-
2-line serial interface clock input
b
H
14
GND
G
-
Ground
a,b
-
15
VDDIO
P
-
IO power source
a
-
16
VDD
P
-
CORE power source
-
-
17
YDO7/RGBDEO
O
Low
BT601 YcbCr data [7] / RGB data output
a
D
18
YDO6/RGBVSO
O
Low
BT601 YcbCr data [6] / RGB V Sync output
a
D
19
YDO5/RGBHSO
O
Low
BT601 YcbCr data [5] / RGB H Sync output
a
D
20
YDO4/BDO7
O
Low
BT601 YcbCr data [4] / RGB B data [7] output
a
D
21
YDO3/BDO6
O
Low
BT601 YcbCr data [3] / RGB B data [6] output
a
D
22
YDO2/BDO5
O
Low
BT601 YcbCr data [2] / RGB B data [5] output
a
D
23
YDO1/BDO4
O
Low
BT601 YcbCr data [1] / RGB B data [4] output
a
D
24
YDO0/BDO3
O
Low
BT601 YcbCr data [0] / RGB B data [3] output
a
D
25
YFLDO/BDO2
O
Low
BT601 Field output / RGB B data [2] output
a
D
*
*1)
*2)
*4)
*6)
Fix an unused input pin to GND or VDDIO (Fix SDA and SCL to I2CVDD. TEST0 and TEST1 are excluded.) .
“I” shows the input, “O” shows the output, “I/O” shows the bidirection, “P” shows the power supply, and “G” shows GND.
“PD” shows the pull-down, “In” shows the input mode, and “Low” shows the Low level output.
"a" in the column in the power supply system shows VDDIO, "b" shows I2CVDD, "c" shows LVDD, and "d" shows PVDD.
“SDA” is output at "L" level when usually using it or is in the state of high impedance, and "H" level is not output.
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© 2011 ROHM Co., Ltd. All rights reserved.
4/22
2011.02 - Rev.A
Technical Note
BU1523KV
[Table 3 Terminal Functions (2/4) ]
PIN
No.
PIN
Name
In/Out
Init
(*1)
(*2)
Power Supply
System
Function Description
(*4)
I/O
Type
26
YVSO/BDO1
O
Low
BT601 YcbCr data [1] / RGB V Sync output
a
D
27
YHSO/BDO0
O
Low
BT601 YcbCr data [0] / RGB H Sync output
a
D
28
GND
G
-
a,b
-
29
YCKO/RGBCKO
O
Low
BT601 Clock output / RGB Clock output
a
D
30
VDDIO
P
-
IO power source
a
-
31
GDO7
O
Low
RGB G data [7] output
a
D
32
GDO6
O
Low
RGB G data [6] output
a
D
33
GDO5
O
Low
RGB G data [5] output
a
D
34
GDO4
O
Low
RGB G data [4] output
a
D
35
VDDIO
P
-
IO power source
a
-
36
YCKI/GDO3
I/O
In
BT656 Clock input / RGB G data [3] output
a
F
37
GND
G
-
Ground
a,b
-
38
YHSI/GDO2
I/O
In
BT656 H Sync input / RGB G data [2] output
(*5)
a
E
39
YVSI/GDO1
I/O
In
BT656 V Sync input / RGB G data [1] output (*5)
a
E
40
YFLDI/GDO0
I/O
In
BT601 Field input / RGB G data [0] output
a
E
41
VDD
P
-
CORE power source
-
-
42
YDI0/RDO7
I/O
In
BT656 Y data [0] input / RGB R data [7] output (*5)
a
E
43
YDI1/RDO6
I/O
In
BT656 Y data [1] input / RGB R data [6] output (*5)
a
E
44
YDI2/RDO5
I/O
In
BT656 Y data [2] input / RGB R data [5] output (*5)
a
E
45
VDDIO
P
-
IO power source
a
-
46
YDI3/RDO4
I/O
In
BT656 Y data [3] input / RGB R data [4] output
(*5)
a
E
47
YDI4/RDO3
I/O
In
BT656 Y data [4] input / RGB R data [3] output (*5)
a
E
48
YDI5/RDO2
I/O
In
BT656 Y data [5] input / RGB R data [2] output (*5)
a
E
49
YDI6/RDO1
I/O
In
BT656 Y data [6] input / RGB R data [7] output (*5)
a
E
50
YDI7/RDO0
I/O
In
BT656 Y data [7] input / RGB R data [0] output (*5)
a
E
*
*1)
*2)
*4)
*5)
Ground
(*5)
Fix an unused input pin to GND or VDDIO (Fix SDA and SCL to I2CVDD. TEST0 and TEST1 are excluded.) .
“I” shows the input, “O” shows the output, “I/O” shows the bidirection, “P” shows the power supply, and “G” shows GND.
“PD” shows the pull-down, “In” shows the input mode, and “Low” shows the Low level output.
"a" in the column in the power supply system shows VDDIO, "b" shows I2CVDD, "c" shows LVDD, and "d" shows PVDD.
36-50 pins direction depends on the modes.
the RGB data output mode: output
the LVDS data output mode: input
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© 2011 ROHM Co., Ltd. All rights reserved.
5/22
2011.02 - Rev.A
Technical Note
BU1523KV
[Table 3 Terminal Functions (3/4) ]
PIN
No.
PIN
Name
In/Out
Init
(*1)
(*2)
Function Description
Power Supply
System
(*4)
51
GND
G
-
Ground
52
I2CDEV
I
-
53
RGBMUTE
I
54
MIR_EN
55
I/O
Type
a,b
-
2
I C device address setting
a
A
-
MUTE signal : High active
a
B
I
-
LVDS data mirror enable : High active
a
A
TEST0
I
PD
Test pin 0
(*3)
(Connect to GND)
a
C
56
TEST1
I
PD
Test pin 1
(*3)
(Connect to GND)
a
C
57
RESETB
I
-
Logic reset signal: Low active
a
B
58
LPDNB
I
-
LVDS reset signal: Low active
a
B
59
VDDIO
P
-
IO power source
a
-
60
PGND
G
-
PLL ground
d
-
61
PVDD
P
-
PLL ground
d
-
62
LGND
G
-
LVDS ground
c
-
63
TDP
O
-
LVDS data output D ch P
c
I
64
TDN
O
-
LVDS data output D ch N
c
I
65
TCKP
O
-
LVDS clock output P
c
I
66
TCKN
O
-
LVDS clock output N
c
I
67
TCP
O
-
LVDS data output C ch P
c
I
68
TCN
O
-
LVDS data output C ch N
c
I
69
LGND
G
-
LVDS ground
c
-
70
LVDD
P
-
LVDS power source
c
-
71
TBP
O
-
LVDS data output B ch P
c
I
72
TBN
O
-
LVDS data output B ch N
c
I
73
TAP
O
-
LVDS data output A ch P
c
I
74
TAN
O
-
LVDS data output A ch N
c
I
75
LGND
G
-
LVDS ground
c
-
*
*1)
*2)
*3)
*4)
Fix an unused input pin to GND or VDDIO (Fix SDA and SCL to I2CVDD. TEST0 and TEST1 are excluded.) .
“I” shows the input, “O” shows the output, “I/O” shows the bidirection, “P” shows the power supply, and “G” shows GND.
“PD” shows the pull-down, “In” shows the input mode, and “Low” shows the Low level output.
Fix TEST0 and TEST1 to GND (The opening is a prohibition of use)
"a" in the column in the power supply system shows VDDIO, "b" shows I2CVDD, "c" shows LVDD, and "d" shows PVDD.
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© 2011 ROHM Co., Ltd. All rights reserved.
6/22
2011.02 - Rev.A
Technical Note
BU1523KV
[Table 3 Terminal Functions (4/4) ]
PIN
No.
PIN
Name
In/Out
Init
(*1)
(*2)
Function Description
Power Supply
System
(*4)
76
GND
G
-
Ground
77
RDI0
I
-
78
RDI1
I
79
RDI2
80
I/O
Type
a,b
-
RGB R data [0] input
a
A
-
RGB R data [1] input
a
A
I
-
RGB R data [2] input
a
A
RDI3
I
-
RGB R data [3] input
a
A
81
RDI4
I
-
RGB R data [4] input
a
A
82
RDI5
I
-
RGB R data [5] input
a
A
83
RDI6
I
-
RGB R data [6] input
a
A
84
RDI7
I
-
RGB R data [7] input
a
A
85
VDDIO
P
-
IO power source
a
-
86
GDI0
I
-
RGB G data [0] input
a
A
87
GDI1
I
-
RGB G data [1] input
a
A
88
GND
G
-
GND
a,b
-
89
GDI2
I
-
RGB G data [2] input
a
A
90
GDI3
I
-
RGB G data [3] input
a
A
91
GDI4
I
-
RGB G data [4] input
a
A
92
GDI5
I
-
RGB G data [5] input
a
A
93
GDI6
I
-
RGB G data [6] input
a
A
94
GDI7
I
-
RGB G data [7] input
a
A
95
VDD
P
-
CORE power source
-
-
96
BDI0
I
-
RGB B data [0] input
a
A
97
BDI1
I
-
RGB B data [1] input
a
A
98
BDI2
I
-
RGB B data [2] input
a
A
99
BDI3
I
-
RGB B data [3] input
a
A
100
VDDIO
P
-
IO power source
a
-
*
*1)
*2)
*4)
Fix an unused input pin to GND or VDDIO (Fix SDA and SCL to I2CVDD. TEST0 and TEST1 are excluded.) .
“I” shows the input, “O” shows the output, “I/O” shows the bidirection, “P” shows the power supply, and “G” shows GND.
“PD” shows the pull-down, “In” shows the input mode, and “Low” shows the Low level output.
"a" in the column in the power supply system shows VDDIO, "b" shows I2CVDD, "c" shows LVDD, and "d" shows PVDD.
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© 2011 ROHM Co., Ltd. All rights reserved.
7/22
2011.02 - Rev.A
Technical Note
BU1523KV
[Table 4 (1/2)]
Type
Equivalent circuit configuration
Type
Equivalent circuit configuration
VDDIO
VDDIO
VDDIO
To internal
A
B
To internal
GND
GND
GND
Input terminal
Input terminal with schmitt
VDDIO
VDDIO
VDDIO
VDDIO
Internal signal
To internal
Internal signal
D
C
GND
GND
GND
GND
GND
Output terminal
Input terminal with pull down
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
VDDIO
To internal
To internal
Internal signal
Internal signal
GND
E
Internal signal
GND
GND
F
Internal signal
GND
Internal signal
Input/Output terminal
GND
Internal signal
Input/Output terminal with schmitt
I2CVDD
I2CVDD
I2CVDD
I2CVDD
To internal
Internal signal
To internal
GND
G
H
Internal signal
GND
GND
Internal signal
GND
Input/Output terminal
(2-line serial I/F)
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© 2011 ROHM Co., Ltd. All rights reserved.
Input terminal with schmitt
(2-line serial I/F)
8/22
2011.02 - Rev.A
Technical Note
BU1523KV
[Table 4 (2/2)]
Type
Equivalent circuit configuration
LVDD
LVDD
Internal signal
Internal signal
Internal signal
T*P
I
T*N
Internal signal
Internal signal
Internal signal
GND
GND
Output terminal (LVDS)
[51] GND
[52] I2CDEV
[53] RGBMUTE
[54] MIR_EN
[55] TEST0
[56] TEST1
[57] RESETB
[58] LPDNB
[59] VDDIO
[60] PGND
[61] PVDD
[62] LGND
[63] TDP
[54] TDN
[65 ]TCKP
[66] TCKN
[67] TCP
[68] TCN
[69] LGND
[70] LVDD
[71] TBP
[72] TBN
[73] TAP
[74] TAN
[75] LGND
●Pin configurations
GND [76]
[50] YDI7/RDO0
RDI0 [77]
[49] YDI6/RDO1
RDI1 [78]
[48] YDI5/RDO2
RDI2 [79]
[47] YDI4/RDO3
RDI3 [80]
[46] YDI3/RDO4
RDI4 [81]
[45] YDDIO
RDI5 [82]
[44] YDI2/RDO5
RDI6 [83]
[43] YDI1/RDO6
RDI7 [84]
[42] YDI0/RDO7
VDDIO [85]
[41] YDD
GDI0 V [86]
[40] YFLDI/GDO0
GDI1 [87]
[39] YVSI/GDO1
GND [88]
[38] YHSI/GDO2
GDI2 [89]
[37] GND
GDI3 [90]
[36] YCKI/GDO3
GDI4 [91]
[35] YDDIO
GDI5 [92]
[34] GDO4
GDI6 [93]
[33] GDO5
GDI7 [94]
[32] GDO6
VDD [95]
[31] GDO7
BDI0 [96]
[30] VDDIO
BDI1 [97]
[29] YCKO/RGBCKO
BDI2 [98]
[28] GND
1PIN MARK
BDI3 [99]
[27] YHSO/BDO0
VDDIO [100]
YFLDO/BDO2 [25]
YDO0/BDO3 [24]
YDO1/BDO4 [23]
YDO2/BDO0 [22]
YDO3/BDO6 [21]
YDO4/BDO7 [20]
YDO5/RGBHSO [19]
YDO6/RGBVSO [18]
YDO7/RGBDEO [17]
VDD [16]
VDDIO [15]
GND [14]
SCL [13]
SDA [12]
I2CVDD [11]
VDDIO [10]
RGBCKI [9]
GND [8]
RGBDEI [7]
RGBVSI [6]
RGBHSI [5]
BDI7 [4]
BDI6 [3]
BDI5 [2]
BDI4 [1]
[26] YVSO/BDO1
[Pin No.] Pin Name
Fig.2 Pin configurations
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© 2011 ROHM Co., Ltd. All rights reserved.
9/22
2011.02 - Rev.A
Technical Note
BU1523KV
●Electrical characteristics (DC)
[Table 5]
Unless otherwise specified, VDD=1.80V, VDDIO=3.3V, I2CVDD=3.3V, PVDD=3.3V, LVDD=3.3V, GND=0.0V, Ta=25℃, fIN=36MHz
Limits
Parameter
Symbol
Unit
Condition
Min.
Typ.
Max.
Input frequency 1
FIN1
8.0
-
36.0
MHz
RGBCKI
Input frequency 2
FIN2
8.0
-
55.0
MHz
YCKI
Input clock duty
DCKI
45
50
55
%
RGBCKI, YCKI
Operational current
IDD1
-
16
-
mA
36MHz (VDD)
LVDS supply current
ILVDD1
-
55
-
mA
LVDS supply current
ILVDD2
-
38
-
mA
Leakage current
IDDst1
-
-
50
μA
Input ”H” current
IIH
-10
-
10
μA
VIH=IO_LVL
Input ”L” current
IIL
-10
-
10
μA
VIL=GND
Pull-down current
IPD
25
50
100
μA
VIH=IO_LVL
Input ”H” voltage 1
VIH1
IO_LVL
x0.8
-
Input ”L” voltage 1
VIL1
-0.3
-
Input ”H” voltage 2
VIH2
IO_LVL
x0.85
-
Input ”L” voltage 2
VIL2
-0.3
-
Output ”H” voltage
VOH
IO_LVL
-0.4
-
IO_LVL
V
Output ”L” voltage
VOL
0.0
-
0.4
V
250
350
450
mV
120
200
300
mV
ΔVOD
-
-
35
mV
VOC
1.125
1.25
1.375
V
ΔVOC
-
-
35
mV
Output short circuit current
IOS
-
-
-24
mA
VOUT(*2)=0V, RL=100Ω
Output TRI-STATE current
IOZ
-
-
±10
μA
LPDNB=GND
VOUT(*2)=GND to LVDD
IO_LVL
+0.3
IO_LVL
x 0.2
IO_LVL
+0.3
IO_LVL
x 0.15
V
V
V
V
36MHz, LVDS_RS = 1 (LVDD, PVDD)
Input toggle pattern (Fig.4)
36MHz, LVDS_RS = 0 (LVDD, PVDD)
Input toggle pattern (Fig.4)
Release reset , input pin =GND
(VDD)
Normal input
(Including input mode of I/O terminal)
Normal input
(Including input mode of I/O terminal)
Hysteresis input
(RESETB, RGBCKI, YCKI, LPDNB, SCL, RGBMUTE)
Hysteresis input
(RESETB, RGBCKI, YCKI, LPDNB, SCL, RGBMUTE)
IOH=-1.0mA(DC)
(including output mode of I/O terminal)
IOL=1.0mA(DC)
(including output mode of I/O terminal)
LVDS Transmitter
Differential output voltage
Change in VOD between
complementary output states
Common mode voltage
Change in VOC between
complementary output states
VOD
RL=100Ω
Normal Swing
LVDS_RS(*1) = 1
Reduced Swing
(*1)
LVDS_RS = 0
RL=100Ω
*
IO_LVL is a generic name of VDDIO, VDDI2C.
(*1) LVDS_RS is a register name controlled with 2-line serial interface.
(*2) VOUT=TAN/P, TBN/P, TCN/P, TDN/P, TCKN/P
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10/22
2011.02 - Rev.A
Technical Note
BU1523KV
RL
RL
Fig.3 LVDS Transmitter characteristic diagram
CLKIN
Tx0
Tx1
Tx2
Tx3
Tx4
Tx5
Tx6
X=A,B,C,D
※Input waveform to the LVDS transmitter block
※Tx0-7 are the data before being serialized by the LVDS transmitter.
Refer to Fig.8 for the serialized data sequence.
Fig.4 Input toggle pattern
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11/22
2011.02 - Rev.A
Technical Note
BU1523KV
●Electric Characteristics (AC)
1. Image quality adjustment data input interface timing
RGB(Y)VSI / RGB(Y)HSI
RGBDEI / YFLDI
R(G,B,Y)DI[7:0]
tCKI
RGB(Y)CKI
(RGB(Y)CK_POL=1)
RGB(Y)CKI
(RGB(Y)CK_POL=0)
tCMS tCMH
Fig.5 Data input interface timing
[Table 6]
Unless otherwise specified, VDD=1.80V, VDDIO=3.3V, I2CVDD=3.3V, PVDD=3.3V, LVDD=3.3V, GND=0.0V, Ta=25℃
Description
Symbol
Min.
Typ.
Max.
Unit
tCKI1
RGBCKI Clock Cycle
27.7
-
125
ns
tCKI2
YCKI Clock Cycle
18.1
-
125
ns
dCKI
RGB(Y)CKI Clock Duty
45
50
55
%
tCMS
RGB(Y)CKI Rise / Fall set-up Time
6
-
-
ns
tCMH
RGB(Y)CKI Rise / Fall Hold Time
5
-
-
ns
* RGB(Y)CK_POL is an internal register of BU1523KV to determine the polarity of RGB(Y)CKI.
* Ensure to make the total number of 1 line input pixels to YCbCr interface to be even (multiple of 4, in case of cycles).
2. Image quality adjustment data output interface timing
tCKO
RGB(Y)CKO
(R(Y) CK_POL=1)
tOHH
tOHL
RGB(Y)VSO
/ RGB(Y)HSO
RENO / YFLDO
tODV
R(G,B,Y)DO
Fig.6 Data output interface timing
[Table 7]
Unless otherwise specified, VDD=1.80V, VDDIO=I2CVDD=PVDD=LVDD=3.3V, GND=0.0V, Ta=25℃
Symbol
Description
Min.
Typ.
Max.
Unit
tCKO1
RGBCKO Clock Cycle
27.7
-
125
ns
tCKO2
YCKO Clock Cycle
18.1
-
125
ns
dCKO1
RGBCKO Clock Duty
40
50
60
%
dCKO2
YCKO Clock Duty
35
50
65
%
tODV
Output delay R(G, B,Y)DO
-
-
5
ns
tOHL, tOHH
Output delay RGB(Y)VSO, RGB(Y)HSO, RENO/YFLDO
-
-
5
ns
* The above figure shows the waveform when RGB(Y)CK_POL= “1” is set. When RGB(Y)CK_POL= “0” is set, RGB(Y)VSO, RGB(Y)HSO and
RGB(Y)DO are output at the falling edge of RGB(Y)CKO.
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12/22
2011.02 - Rev.A
Technical Note
BU1523KV
3. LVDS transmitter switching characteristic
[Table 8]
Unless otherwise specified, VDD=1.80V, VDDIO=I2CVDD=PVDD=LVDD=3.3V, GND=0.0V, Ta=25℃, fIN=36MHz
Symbol
Description
MIN
TYP
MAX
Unit
tLVT
LDVS Transition Time
-
0.6
1.5
ns
tTOP1
Output Data Position 0
-1.2
0.0
+1.2
ns
tTOP0
Output Data Position 1
tCKI
-1.2
7
tCKI
7
tCKI
+1.2
7
ns
tTOP6
Output Data Position 2
2
tCKI
-1.2
7
2
tCKI
7
2
tCKI
+1.2
7
ns
tTOP5
Output Data Position 3
3
tCKI
-1.2
7
3
tCKI
7
3
tCKI
+1.2
7
ns
tTOP4
Output Data Position 4
4
tCKI
-1.2
7
4
tCKI
7
4
tCKI
+1.2
7
ns
tTOP3
Output Data Position 5
5
tCKI
-1.2
7
5
tCKI
7
5
tCKI
+1.2
7
ns
tTOP2
Output Data Position 6
6
tCKI
-1.2
7
6
tCKI
7
6
tCKI
+1.2
7
ns
tPLL
Phase Locked Loop Set Time
-
-
ms
10.0
LVDS Output
Vdiff=(TxP)-(TxN)
TxP
Vdiff
CL
80%
80%
20%
RL
20%
TxN
tLVT
LVDS Output Load
tLVT
Fig.7 LVDS Output AC Timing diagram 1
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13/22
2011.02 - Rev.A
Technical Note
BU1523KV
TCKP/N OUT
(Differential)
TAP/N
TA6
TA5
TA4
TA3
TA2
TA1
TA0
TBP/N
TB6
TB5
TB4
TB3
TB2
TB1
TB0
TCP/N
TC6
TC5
TC4
TC3
TC2
TC1
TC0
TDP/N
TD6
TD5
TD4
TD3
TD2
TD1
TD0
Next Cycle
Previous Cycle
tTOP1
tTOP0
tTOP6
tTOP5
tTOP4
tTOP3
tTOP2
Fig.8 LVDS Output AC Timing diagram 2
LPDNB
POWER
tPLL
CLKIN
TCKP/N
* POWER shows VDDIO, I2CVDD, VDD, LVDD, PVDD
* CLKIN is a clock input to the LVDS transmitter.
Fig.9 LVDS Phase Locked Loop Set Time
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14/22
2011.02 - Rev.A
Technical Note
BU1523KV
4. 2-line serial interface timing
SDA
t SU;DAT
t LOW
t BUF
t HD;ST
A
SCL
t HD;STA
t HD;DAT
t HIGH
t SU;STA
t SU;STO
Fig.10 2-line serial interface timing
[Table 9]
Unless otherwise specified, VDD=1.80V, VDDIO=3.3V, I2CVDD=3.3V, PVDD=3.3V, LVDD=3.3V, GND=0.0V, Ta=25℃
Symbol
Description
MIN
TYP
MAX
Unit
0
-
400
kHz
fSCL
SDL clock frequency
tHD;STA
Holding time(Repetition) ”START” Condition
After this period, the first clock pulse is generated.
0.6
-
-
µs
tLOW
Low period of SDL clock
1.3
-
-
µs
tHIGH
High period of SDL clock
0.6
-
-
µs
tSU;STA
Setup time of repetition ”START” condition
0.6
-
-
µs
tHD;DAT
Data hold time
0
tSU;DAT
Data setup time
100
-
-
ns
tSU;STO
Setup time of 'STOP' condition
0.6
-
-
µs
tBUF
'Bus free time between STOP' condition and 'START' condition
1.3
-
-
µs
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15/22
µs
2011.02 - Rev.A
Technical Note
BU1523KV
●Operation explanation of each block
1. Image quality adjustment of RGB interface
It adjusts image quality input through 24-bit RGB interface.
The supported I/O interface consists of 24-bit data, vertical synchronization signal, horizontal synchronization signal and
data enable signal. It converts 24-bit RGB into YCbCr444 and makes adjustment on the contrast, brightness, sharpness,
hue and intensity in the YCbCr space. The contrast, brightness and sharpness are adjusted against the luminance (Y)
component and the hue and intensity are adjusted against the color difference (CbCr) component. In addition to the
image quality adjustment in the YCbCr space, it is also equipped with the RGB independent gamma correction capability
in the RGB space. Converting YCbCr444 to 24-bit RGB, gamma correction is made to each of the RGB components.
16 gamma curve points can be set and the intervals between those set points are linearly interpolated. When the
RGBMUTE terminal is set to “High” level, the RGB output data will be all “0” from the next frame.
2. Image quality adjustment of YUV
It adjusts image quality input through YCbCr422 interface.
The supported I/O interfaces are ITU-R BT.656-4 and YCbCr with synchronization signal (complied with ITU-R BT.601).
When the input is ITU-R BT.656-4, the output can be selected from ITU-R BT.656-4 and YCbCr with synchronization
signal. However, when the input is YCbCr with synchronization signal, the output can only be YCbCr with synchronization
signal. It makes adjustment on the contrast, brightness, sharpness, hue and intensity in the YCbCr space. The contrast,
brightness and sharpness are adjusted against the luminance (Y) component and the hue and intensity are adjusted
against the color difference (CbCr) component.
3. LVDS transmitter
It outputs high-speed serial data for image quality adjustment of RGB interface in LVDS format. The data mapping to be
output in the LVDS format can be changed by the register setting. When the LPDNB terminal is set to “Low” level, the
LVDS transmitter part will go into power down mode. The LVDS output will become Hi-Z status.
4. 2-line serial interface
2-line serial interface slave function is embedded. The registers are accessed through this interface. The slave address is
46h (in 7-bit notation) when I2CDEV=0 and 47h (in 7-bit notation) when I2CDEV=1. The sub address is automatically
incremented when consecutively accessed twice or more in read or write operation. * Slave address of 46h and 47h are in
hexadecimal. * Fig.11 depicts the status when I2CDEV=0.
SDA
SCL
S
START
condition
1-7
8
9
Slave
address
R/W
ACK
1-7
8
9
Sub address
1-7
ACK
8
Data
9
ACK
P
STOP
condition
Data sending and receiving waveform
Write
sequence
Read
sequence
S
Slave address
(46h)
W
(0)
A(S) Sub address A(S)
S
Slave address
(46h)
W
(0)
A(S) Sub address A(S) S
Write data
Write data
A(S)
Slave address
(46h)
R
(1)
A(S)
A(S)
Read data
Write data
A(M)
S = START condition
A(S) = acknowledge by slave
A(S) = not acknowledge by slave
P = STOP condition
A(M) = acknowledge by master
A(M) = not acknowledge by master
A(S)/
P
A(S)
Read data
A(M)/
P
A(M)
Fig.11 2-line serial interface format
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16/22
2011.02 - Rev.A
Technical Note
BU1523KV
●Example of application circuit
VDD
(1.8V System)
VDD
(3.3V System)
F.Bead*1
VDDIO
VDD
0.1uF
0.01uF
Main CPU
(Graphic LSI)
LGND
LGND
PVDD
PVDD
PGND
GND
0.1uF
0.01uF
0.1uF
0.01uF
PGND
GND
[RGB Data]
RGBCKI, RGBVSI,
RGBHSI, RGBDEI,
RDI0~7, GDI0~7, BDI0~7
[BT.601 Data]
TAN
RA-
TAP
RA+
TBN
RB-
TBP
RB+
TCN
RC-
TCP
RC+
YCKO,YFLDO,
YVSO, YHSO,
YDO0~7
BU1523KV
VDD
(3.3V System)
SDA
SCL
TCLK
RCLK-
TCLK
RCLK+
TDN
RD-
TDP
RD+
LPDB
RMUTE
[BT.656 Data]
YCKI,YFLDI,
YVSI, YHSI,
DVD,
Digital TV Encoder,
Camera etc.
RCKO
open
BDO4
open
BDO3
open
BDO2
open
YDI0~7
Reset IC
0.1uF
0.01uF
0.1uF
0.01uF
0.1uF
0.01uF
I2CVDD
VDD
LVDD
LVDD
0.1uF
0.01uF
0.1uF
0.01uF
VDD
(3.3V System)
F.Bead*1
BU16002KVT
CLKOUT
RA0
RA1
RA2
RA3
RA4
RA5
RA6
RB0
RB1
RB2
RB3
RB4
RB5
RB6
RC0
RC1
RC2
RC3
RC4
RC5
RC6
RD0
RD1
RD2
RD3
RD4
RD5
RD6
RE0
RE1
RE2
RE3
RE4
RE5
RE6
PD
100Otwist
Pair Cable
or
PCB trace
CLKOUT
R4
R5
R6
R7
R8
R9
G4
G5
G6
G7
G8
G9
B4
B5
B6
B7
B8
B9
TC4
TC5
TC6
TD0
TD1
TD2
TD3
TD4
TD5
OPEN
R0
R1
G0
G1
B0
B1
OPEN
PD
OE
DK
R/F
RESETB
I2CDEV
TEST0,1,2
PCB(Transmitter)
PCB(Receiver)
*1: Recommended Parts: F.Bead: BLM18A-Series (Murata Manufacturing)
*2: If LVDS_RS is tied to “1”, LVDS swing is 350m V. If LVDS_RS is tied to “0”, LVDS swing is 200m V.
Fig.12 BU1523KV System connection Diagram
The above figure is an example of system connection for reference only and not intended to guarantee operation.
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17/22
2011.02 - Rev.A
Technical Note
BU1523KV
●Procedure for turning on power supply
Follow the power-on sequence of VDD→(VDDIO, I2CVDD, PVDD, LVDD) as depicted in Fig.13. The timing for power-on
sequence is shown in Table 10 however, it is recommended to make the intervals of tPWUV2, tPWUV and tPWUVL as short as
possible. Until after voltage is applied to all the power sources, the levels of all the input pins are fixed and the low level is
input onto RESETB, the internal status and pins remain unstable. Remove the reset after inputting the clock (RGBCKI,
YCKI). When the clock (RGBCKI, YCKI) is to be temporarily halted during the operation, apply the reset after the clock
(RGBCKI, YCKI) stopped to fix the operation, then follow the power-on sequence and remove the reset after inputting the
clock (RGBCKI, YCKI). 2-line serial interface is enabled for communication after the reset (RESETB) is removed. However,
racing may be caused if the rising edge of the reset (RESETB) signal and the signal change of 2-line serial interface occur
at the same time. Ensure not to allow the rising edge of the reset (RESETB) signal and the signal change of 2-line serial
interface to occur at the same time. Design the system to avoid racing and system malfunction when the internal status and
pins are unstable.
* The reset is also possible by the software reset (SRST_R_IP, SRST_Y_IP, SRST_LVDS).
Min Level Voltage
VDD
Min Level Voltage
I2CVDD
tPWUV2
VDDIO
tPWUV
PVDD
LVDD
tPWUVL
Min Level Voltage
Min Level Voltage
Clock Stop
Clock Input
※Use PVDD and LVDD together.
Clock Input
RGBCKI
YCKI
Reset after the clock stops.
tCR
RESETB
LPDNB
tCR
Release reset after inputting the clock.
I2CVDD
All input
terminals of
group
Release reset after inputting the clock.
tUNCV2
Regulations from start of I2CVDD
VDDIO
All input
terminals of
group
tUNCV
tRR
tRR
Regulations from start of I2CVDD
The state of the terminal is invalid.
Reset State
Reset State
Fig.13 Power supply input procedure (Min level is power-supply voltage lower bound of recommended range.)
[Table 10 Recommended value at time to turn on power supply]
Item
Min.
Max.
Unit
tPWUV2
0
50
ms
tPWUV
0
50
ms
tPWUVL
0
50
ms
tUNCV2
0
1
ms
tUNCV
0
1
ms
tRR
1
-
ms
tCR
0.1
-
ms
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2011.02 - Rev.A
Technical Note
BU1523KV
The power-off sequence is reverse of the power-on sequence, in the order of (VDDIO, I2CVDD, PVDD, LVDD)→VDD as
depicted in Fig.14. The timing for power-off sequence is shown in Table 11, however, it is recommended to make the
intervals of tPWDV2m, tPWDV and tPWDVL as short as possible.
Note that turning off from the VDD (Power to the internal CORE) makes the internal status and pin status unstable.
Min Level Voltage
VDD
Min Level Voltage
I2CVDD
tPWDV
Min Level Voltage
VDDIO
tPWD
Min Level Voltage
PVDD
LVDD
※Use PVDD and LVDD together.
tPWDV
Operation Stop
Operation State
Fig.14 Power-off procedure (Min level is power-supply voltage lower bound of recommended range of motion.)
[Table 11 Power-off time recommended value]
Item
Min.
Max.
Unit
tPWDV2
0
50
ms
tPWDV
0
50
ms
tPWDVL
0
50
ms
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19/22
2011.02 - Rev.A
Technical Note
BU1523KV
●PCB Design Guideline for LVDS
・Interconnecting media between Transmitter and Receiver ( i.e.PCB trace, connector, and cable) should be well balanced.
(Keep all these differential impedance and the length of media as same as possible.).
・Locate by –pass capacitors adjacent to the device pins as close as possible.
・Minimize the distance between traces of a pair. (S1) to maximize common mode rejection.
See following figure.
・Place adjacent LVDS trace pair at least twice (>2 x S1) as far away.
・Avoid 90 degree bends.
・Minimize the number of VIA on LVDS traces.
・Match impedance of PCB trace, connector, media (cable) and termination to minimize reflections (emissions)
for cabled applications (typically 100Ω Differential mode characteristic impedance).
GND
+Signal
-Signal
S1
GND
>2 x S1
+
Driver
100Ω
Driver
+
Driver
+ Receiver
-
Receiver
Driver
-
100Ω
+
Receiver
-
Point-to-point configuration
+
+
Receiver
-
+Receiver
-
Receiver
-
+
Multi-drop configuration
Good
No Good
Monitor Pad
Stub
Layer1
Layer2
GND
GND
Signal Via
GND Via
Fig.15 PCB Design Guideline for LVDS
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20/22
2011.02 - Rev.A
Technical Note
BU1523KV
●Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Recommended Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected.
The electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown
due to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply
terminal.
(4) Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,
for the digital block power supply and the analog block power supply, even though these power supplies has the same
level of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressing
the diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.
For the GND line, give consideration to design the patterns in a similar manner. Furthermore, for all power supply
terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use an
electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem
including the occurrence of capacity dropout at a low temperature, thus determining the constant.
(5) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(6) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can
break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or between
the terminal and the power supply or the GND terminal, the ICs can break down.
(7) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8) Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.
Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the set
PCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to the
jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig. In
addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to
the transportation and the storage of the set PCB.
(9) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the
input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminals
a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltage
to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is
applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10) Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND
pattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so that
resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the
small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.
(11) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(12) Rush current
For ICs with more than one power supply, it is possible that rush current may flow instantaneously due to the internal
powering sequence and delays. Therefore, give special consideration to power coupling capacitance, power wiring, width
of GND wiring, and routing of wiring.
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21/22
2011.02 - Rev.A
Technical Note
BU1523KV
●Ordering part number
B
U
1
Part No.
5
2
3
K
Part No.
V
-
Package
KV:VQFP100
E
2
Packaging and forming specification
E2: Embossed tape and reel
VQFP100
<Tape and Reel information>
16.0±0.2
14.0±0.1
51
75
0.5±0.15
1.0
26
1
E2
direction is the 1pin of product is at the upper left when you hold
( The
)
reel on the left hand and you pull out the tape on the right hand
25
+0.05
0.145 -0.03
1PIN MARK
+6°
4°−4°
0.08 S
0.1±0.05
1.0
1.0±0.2
14.0±0.1
16.0±0.2
500pcs
Direction
of feed
100
1.6MAX
Embossed carrier tape (with dry pack)
Quantity
50
76
1.4±0.05
Tape
+0.05
0.2 -0.04
0.08
M
1pin
0.5±0.1
(Unit : mm)
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Reel
22/22
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2011.02 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
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The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
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More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
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R1120A