VSMY3940X01 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 940 nm, Surface Emitter Technology FEATURES • Package type: surface mount • Package form: PLCC-2 • Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75 • AEC-Q101 qualified • Peak wavelength: λp = 940 nm • High reliability • High radiant power • High radiant intensity • Angle of half intensity: ϕ = ± 60° 948553 • Suitable for high pulse current operation • Floor life: 168 h, MSL 3, acc. J-STD-020 • Lead (Pb)-free reflow soldering • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION As part of the SurfLightTM portfolio, the VSMY3940X01 is an infrared, 940 nm emitting diode based on surface emitter technology with high radiant intensity, high optical power and high speed, molded in a PLCC-2 package for surface mounting (SMD). RELEASED FOR APPLICATIONS Infrared radiation source for operation with CMOS cameras (illumination) • High speed IR data transmission • IR touch panels • 3D TV • Light curtain PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λP (nm) tr (ns) VSMY3940X01 15 ± 60 940 10 Note • Test conditions see table “Basic Characteristics” ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY3940X01-GS08 Tape and reel MOQ: 7500 pcs, 1500 pcs/reel PLCC-2 VSMY3940X01-GS18 Tape and reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2 Note • MOQ: minimum order quantity Rev. 1.2, 25-Jun-14 Document Number: 84220 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3940X01 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current Pulse peak forward current IF 100 mA tp/T = 0.5, tp = 100 μs IFM 200 mA tp = 100 μs IFSM 1 A PV 190 mW Surge forward current Power dissipation Junction temperature Operating temperature range Tj 100 °C Tamb -40 to +85 °C Storage temperature range Soldering temperature Thermal resistance junction/ambient Tstg -40 to +100 °C acc. figure 10, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W 120 180 IF - Forward Current (mA) PV - Power Dissipation (mW) 200 160 140 120 100 80 RthJA = 250 K/W 60 40 20 0 100 80 60 RthJA = 250 K/W 40 20 0 0 20 40 60 80 0 100 20 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF TEST CONDITION SYMBOL TYP. MAX. UNIT IF = 100 mA, tp = 20 ms VF 1.44 1.9 V IF = 1 A, tp = 100 μs VF 2.2 V IF = 100 mA TKVF -1.6 mV/K IR not designed for reverse operation μA Reverse current Junction capacitance Radiant intensity VR = 0 V, f = 1 MHz, E = 0 Cj IF = 100 mA, tp = 20 ms Ie MIN. 125 8 15 pF 24 mW/sr IF = 1 A, tp = 100 μs Ie 120 IF = 100 mA, tp = 20 ms φe 55 mW IF = 100 mA TKφe -0.25 %/K Peak wavelength IF = 20 mA λp Spectral bandwidth IF = 30 mA Δλ 40 nm Radiant power Temperature coefficient of φe ϕ Angle of half intensity mW/sr ± 60 920 940 deg 960 nm Temperature coefficient of λp IF = 100 mA TKλp 0.25 nm/K Rise time IF = 100 mA tr 10 ns Fall time IF = 100 mA tf 10 ns Rev. 1.2, 25-Jun-14 Document Number: 84220 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3940X01 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1000 Ie - Radiant Intensity (mW/sr) IF - Forward Current (mA) 1000 tp = 100 μs 100 10 1 tp = 100 μs 100 10 1 0.1 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 1 VF - Forward Voltage (V) IF = 100 mA tp = 20 ms 1.55 1.50 1.45 1.40 1.35 1.30 0 20 40 60 80 120 IF = 100 mA tp = 20 ms 110 100 90 80 100 -60 -40 -20 115 IF = 100 mA tp = 20 ms 105 100 95 90 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 5 - Relative Forward Voltage vs. Ambient Temperature Rev. 1.2, 25-Jun-14 20 40 60 80 100 Fig. 7 - Relative Radiant Intensity vs. Ambient Temperature Ie, rel - Relative Radiant Intensity (%) VF, rel - Relative Forward Voltage (%) Fig. 4 - Forward Voltage vs. Ambient Temperature -60 -40 -20 0 Tamb - Ambient Temperature (°C) Tamb - Ambient Temperature (°C) 110 1000 Fig. 6 - Radiant Intensity vs. Forward Current Ie, rel - Relative Radiant Intensity (%) VF - Forward Voltage (V) 1.65 -60 -40 -20 100 IF - Forward Current (mA) Fig. 3 - Forward Current vs. Forward Voltage 1.60 10 100 IF = 20 mA 90 80 70 60 50 40 30 20 10 0 800 850 900 950 1000 1050 λ - Wavelength (nm) Fig. 8 - Relative Radiant Intensity vs. Wavelength Document Number: 84220 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3940X01 www.vishay.com 10° 20° 30° ϕ - Angular Displacement Ie, rel - Relative Radiant Intensity 0° Vishay Semiconductors 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 0.6 0.4 0.2 0 Fig. 9 - Relative Radiant Intensity vs. Angular Displacement PACKAGE DIMENSIONS in millimeters technical drawings according to DIN specifications 0.9 1.75 ± 0.1 3.5 ± 0.2 Mounting Pad Layout Pin identification 4 C area covered with solder resist 2.6 (2.8) A 2.2 2.8 ± 0.15 1.2 4 Ø 2.4 1.6 (1.9) 3 + 0.15 Drawing-No.: 6.541-5067.02-4 Issue: 4; 19.07.10 20767 Rev. 1.2, 25-Jun-14 Document Number: 84220 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3940X01 www.vishay.com Vishay Semiconductors SOLDER PROFILE 3.5 3.1 2.2 2.0 300 Temperature (°C) 5.75 5.25 max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 3.6 3.4 200 4.0 3.6 8.3 7.7 max. 30 s 1.85 1.65 150 1.6 1.4 max. 100 s max. 120 s 4.1 3.9 100 0.25 4.1 3.9 2.05 1.95 94 8668 max. ramp up 3 °C/s max. ramp down 6 °C/s 50 Fig. 12 - Tape Dimensions in mm for PLCC-2 0 0 50 19841 100 150 200 250 300 Time (s) Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. MISSING DEVICES A maximum of 0.5 % of the total number of components per reel may be missing, exclusively missing components at the beginning and at the end of the reel. A maximum of three consecutive components may be missing, provided this gap is followed by six consecutive components. De-reeling direction 94 8158 FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, acc. to J-STD-020. DRYING > 160 mm Tape leader In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. 40 empty compartments min. 75 empty compartments Carrier leader Carrier trailer Fig. 13 - Beginning and End of Reel The tape leader is at least 160 mm and is followed by a carrier tape leader with at least 40 empty compartments. The tape leader may include the carrier tape as long as the cover tape is not connected to the carrier tape. The least component is followed by a carrier tape trailer with a least 75 empty compartments and sealed with cover tape. 10.0 9.0 120° Adhesive tape 4.5 3.5 2.5 1.5 Blister tape Component cavity Fig. 11 - Blister Tape 94 8670 Identification Label: Vishay type group tape code production code quantity 13.00 12.75 63.5 60.5 180 178 14.4 max. 94 8665 Fig. 14 - Dimensions of Reel-GS08 Rev. 1.2, 25-Jun-14 Document Number: 84220 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY3940X01 www.vishay.com Vishay Semiconductors COVER TAPE REMOVAL FORCE 10.4 8.4 120° 4.5 3.5 2.5 1.5 The removal force lies between 0.1 N and 1.0 N at a removal speed of 5 mm/s. In order to prevent components from popping out of the blisters, the cover tape must be pulled off at an angle of 180° with regard to the feed direction. 13.00 12.75 62.5 60.0 Identification Label: Vishay type group tape code production code quantity 321 329 14.4 max. 18857 Fig. 15 - Dimensions of Reel-GS18 Rev. 1.2, 25-Jun-14 Document Number: 84220 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000