Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: 44 TQFP (1.0mm) with SnPb Plating Total Device Weight 0.28 Grams August, 2008 % of Total Pkg. Wt. Weight (g) Die 1.52% 0.004 Mold 72.29% 0.202 D/A Epoxy 0.23% 0.46% 0.0013 Lead Plating 2.72% 0.008 22.78% Substance CAS # Notes / Assumptions: Silicon chip 7440-21-3 Die size: 2.1 x 3.0 mm 61.44% 3.61% 3.61% 0.43% 0.43% 2.75% 0.172 0.010 0.010 0.0012 0.0012 0.008 Silica Fused Epoxy Resin Phenol Resin Antimony Trioxide Carbon black Other (trade secret) 60676-86-0 1309-64-4 1333-86-4 - Mold Compound Density between 1.7 and 2.1 grams/cc 80 to 90% Silica Fused (LSC uses 85% in our calculation) 3 to 10% Epoxy Resin (LSC uses 5% in our calculation). 2 to 10% Phenol Resin (LSC uses 5% in our calculation). 0.1 to 1% Antimony Trioxide (LSC uses 0.6% in our calculation) 0.1 to 1% Carbon black (LSC uses 0.6% in our calculation) 0 to 5% Other (LSC uses 3.8% in our calculation) 0.18% 0.05% 0.0010 0.0001 Silver-filled epoxy Silver (Ag) other 7440-22-4 - Die attach epoxy Density: 4 grams/cc (silver content: 70-90%; LSC uses 80% in our calculation) Gold (Au) 7440-57-5 0.8 to1.0 mil diameter; 1 wire per package lead; wire length 3 mm Plating is 85% Sn, 15% Pb; thickness is 0.015mm 0.001 Wire Leadframe % of Total Weight (g) Pkg. Wt. MSL: 3 Peak Reflow Temp: 240°C 2.32% 0.41% 0.006 0.0011 Tin (Sn) Lead (Pb) 7440-31-5 7439-92-1 22.21% 0.09% 0.02% 0.05% 0.05% 0.34% 0.02% 0.062 0.00026 0.00006 0.00013 0.00013 0.0010 0.00006 Copper (Cu) Silicon (Si) Zinc (Zn) Tin (Sn) Chromium (Cr) Nickel (Ni) Magnesium (Mg) 7440-50-8 7440-21-3 7440-66-6 7440-31-5 7440-47-3 7440-02-0 7439-95-4 0.064 Leadframe thickness is nominal (per Case Outline) Cu (LSC uses 97.5% in our calculation) 0 to 0.65% Si (LSC uses 0.4% in our calculation) 0 to 0.2% Zn (LSC uses 0.1% in our calculation) 0 to 0.25% Sn (LSC uses 0.2% in our calculation) 0 to 0.3% Cr (LSC uses 0.2% in our calculation) 0 to 3% Ni (LSC uses 1.5% in our calculation) 0 to 0.15% Mg (LSC uses 0.1% in our calculation) Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. D1