Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 (503) 268-8000 [email protected] Package: Total Device Weight November, 2010 % of Total Pkg. Wt. Weight (g) Die 3.58% 0.0790 Mold 25.07% 0.554 D/A Epoxy 0.50% 0.64% 0.0142 Solder Balls 21.30% 0.471 Foil 19.19% 29.72% with SnAgCu Solder Balls Halogen Free (90nm and 65nm products) MSL: 3 Peak Reflow Temp: 250°C % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Die size: 9.63 x 11.36 mm Notes / Assumptions: 22.56% 0.75% 1.20% 0.05% 0.50% 0.499 0.0166 0.0266 0.0011 0.0111 Silica (Fused or Amorphous) Epoxy resin Phenol resin Carbon black Other 60676-86-0 1333-86-4 - Mold Compound composition: 85 to 95% Silica Fused or Amorphous (LSC uses 90% in our calculation) 0.5 to 5% Epoxy resin (LSC uses 3% in our calculation) 3 to 6% Phenol resin (LSC uses 4.8% in our calculation) approx. 0.2% Carbon black approx. 2% Other 0.40% 0.10% 0.0089 0.0022 Silver (Ag) Organic esters and resins 7440-22-4 - Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) Gold (Au) 7440-57-5 0.8 to 1.0 mil diameter; 1 wire per solder ball 0.0111 Wire Substrate 484 fpBGA 2.21 Grams 20.45% 0.75% 0.11% 0.452 0.0165 0.0024 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Solder ball composition Sn96.5/Ag3/Cu0.5 (SAC305) 13.05% 6.14% 0.288 0.136 Glass fiber BT Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.424 0.657 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. A