Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight November, 2009 % of Total Pkg. Wt. Weight (g) Die 2.12% 0.0222 Mold 27.85% 0.2924 D/A Epoxy 0.22% 0.72% 0.0075 Solder Balls 23.71% 0.249 Foil 25.20% 20.18% with SnAgCu Solder Balls (90nm and 65nm products) MSL: 3 Peak Reflow Temp: 250°C % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 25.06% 0.84% 1.34% 0.06% 0.56% 0.2631 0.0088 0.0140 0.0006 0.0058 Silica (Fused or Amorphous) Epoxy resin Phenol resin Carbon black Other 60676-86-0 1333-86-4 - 0.18% 0.05% 0.0019 0.0005 Silver (Ag) Organic esters and resins 7440-22-4 - Gold (Au) 7440-57-5 0.0024 Wire Substrate 256 fpBGA 1.05 Grams Notes / Assumptions: Die size: 5.30 x 5.00 Mold Compound Density ranges between 1.85 and 2.15 grams/cc 85 to 95% Silica Fused or Amorphous (LSC uses 90% in our calculation) 0.5 to 5% Epoxy resin (LSC uses 3% in our calculation) 3 to 6% Phenol resin (LSC uses 4.8% in our calculation) approx. 0.2% approx. 2% Mold compound: Hitachi 9750HF10ALKU Die attach epoxy Density: 4 grams/cc 70 to 90% Silver (LSC uses 80% in our calculation) 10 to 30% Organic Esters and Resins (LSC uses 20% in our calculation) Die attach: Ablestik 2100A 0.0127 mm (radius); 1 wire per package lead 22.77% 0.83% 0.12% 0.239 0.0087 0.0012 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 Solder ball composition: Sn96.5/Ag3/Cu0.5 17.14% 8.06% 0.1799 0.0847 Glass fiber Resins 65997-17-3 - 60 to 75% glass fiber (LSC uses 68% in our calculation) Copper (Cu) 7440-50-8 0.265 0.212 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. B5