FPBGA Pbfree Cuwire672_9065nmprods

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124 USA
[email protected]
Package:
Total Device Weight
December, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
1.48%
0.0489
Mold
37.15%
1.226
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
0.21%
0.18%
19.89%
18.87%
22.23%
672 fpBGA
3.30
Grams
% of Total
Weight (g)
Pkg. Wt.
with SnAgCu Solder Balls
(90nm and 65nm products)
Copper Bond Wire version
MSL: 3
Peak Reflow Temp: 250°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 8.11 x 8.34 mm
Mold Compound Density between 1.8 and 2.1 grams/cc
75 to 95% Silica (LSC uses 87.6% in our calculation)
5 to 10% Epoxy Resin (LSC uses 7% in our calculation)
3 to 8% Phenol Resin (LSC uses 5% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.4% in our calculation)
32.54%
2.60%
1.86%
0.15%
1.0738
0.0858
0.0613
0.0049
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
60676-86-0
Trade secret
Trade secret
1333-86-4
0.17%
0.04%
0.0055
0.0014
Silver
Esters & resins
7440-22-4
-
Die attach epoxy Density: 4 grams/cc
70 to 90% Silver (LSC uses 80% in our calculation)
1 to 10% Esters & resins (LSC uses 20% in our calculation)
0.17%
0.00%
0.0057
0.0001
Copper
Palladium
7440-50-8
7440-05-3
0.8 mil diameter; 1 wire per solder ball
98.5%
1.5%
19.19%
0.60%
0.10%
0.6333
0.0197
0.0033
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
12.83%
6.04%
0.424
0.199
Glass fiber
BT Resins
65997-17-3
-
Copper (Cu)
7440-50-8
0.0069
0.0058
0.656
Qualified Solder ball compositions:
Sn96.5/Ag3/Cu0.5
0.623
0.734
60 to 75% glass fiber (LSC uses 68% in our calculation)
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. E