PQFP SNPB160

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
Package:
Total Device Weight
August, 2008
% of Total
Pkg. Wt.
Weight (g)
Die
1.82%
0.102
Mold
87.06%
4.875
D/A Epoxy
0.12%
0.08%
0.005
Lead Plating
0.62%
0.034
10.30%
with SnPb Plating
% of Total
Weight (g)
Pkg. Wt.
Substance
CAS #
Silicon chip
7440-21-3
Die size: 7.4mm x 9.3mm
Mold Compound Density varies between 1.7 and 2.3 grams/cc
75 to 95% Silica Fused (LSC uses 87.7% in our calculation)
4 to 10% Epoxy Resin (LSC uses 7% in our calculation).
2 to 8% Phenol Resin (LSC uses 5% in our calculation).
0.1 to 0.5% Carbon black (LSC uses 0.3% in our calculation)
4.275
0.341
0.244
0.015
Silica Fused
Epoxy Resin
Phenol Resin
Carbon black
60676-86-0
1333-86-4
0.10%
0.02%
0.006
0.0014
Silver-filled Epoxy
Silver (Ag)
other
7440-22-4
-
Gold (Au)
7440-57-5
1.0 mil wire diameter; 1 wire for each package lead; wire length 3 mm
Die attach epoxy Density: 4 grams/cc
(silver content: 70-90%; LSC uses 80% in our calculation)
0.52%
0.09%
0.029
0.005
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Nominal: 85% Sn, 15% Pb
Thickness is 0.015mm
9.91%
0.31%
0.07%
0.02%
0.555
0.0173
0.004
0.0009
Copper (Cu)
Nickel (Ni)
Silicon (Si)
Magnesium (Mg)
7440-50-8
7440-02-0
7440-21-3
7439-95-4
Leadframe thickness is nominal (per Case Outline)
96.2% Cu
3.0% Ni
0.65% Si
0.15% Mg
0.577
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
www.latticesemi.com
Notes / Assumptions:
76.35%
6.09%
4.35%
0.26%
0.007
Wire
Leadframe
160 PQFP
5.60
Grams