Handling Instructions for VINco E3 packages This document is valid for all type of VINco E3 modules: Solder & Press-fit pin versions Date: 08.06.2015 Revision: Created by: M. Géczy Rev. 01 Proprietary data, company confidential. All rights reserved. Table of Contents 1 General instructions ................................................................................................. 5 2 Specification for the driver PCB ................................................................................ 5 2.1 Specification for modules with Press-fit pins ........................................................ 6 2.2 Specification for modules with solder pins ........................................................... 7 2.3 Specification for modules with Press-fit pins that are soldered to the PCB ............... 7 3 Specifications for baseplate ...................................................................................... 7 4 Specifications for heat sink ...................................................................................... 8 5 Specifications for thermal interface materials .......................................................... 8 5.1 OPTION 1: Thermal paste ................................................................................. 9 5.2 OPTION 2: Pre applied thermal interface material ................................................ 9 6 Specifications for fastening screws to the heat sink ................................................. 9 7 Screw specification for fastening main terminals to bus bars ................................. 10 8 Press in process of modules with Press-fit pins ...................................................... 11 8.1 Press-in construction .......................................................................................11 8.1.1 Press-in tool for modules without thermal interface material ................................12 8.1.2 Modules with thermal interface material ............................................................12 8.1.3 Supporting tool ..............................................................................................12 8.2 Press-fit process control parameters .................................................................13 8.3 Disassembling a driver PCB ..............................................................................14 8.3.1 PCB larger than Module ...................................................................................14 8.3.2 PCB not larger than Module ..............................................................................15 9 Recommendation for soldering ............................................................................... 16 9.1 Wave soldering of modules with solder pins .......................................................16 9.2 Hand soldering parameters ..............................................................................16 10 ESD protection ........................................................................................................ 17 11 Environmental conditions ....................................................................................... 17 11.1 Storage and transportation conditions ...............................................................17 11.1.1 Climatic conditions ..........................................................................................17 11.1.2 Biological conditions ........................................................................................18 11.1.3 Chemically active substances ...........................................................................18 11.1.4 Mechanically active substances .........................................................................18 11.1.5 Mechanical Conditions .....................................................................................19 12 Disclaimer .............................................................................................................. 19 08.06.2015 M. Géczy Rev. 01 page 2 Table of Figures Figure 1: Module with driver PCB and heat sink ................................................................. 5 Figure 2: Height of the module ........................................................................................ 5 Figure 3: Recommended hole and cutout sizes on the driver PCB ........................................ 6 Figure 4: Chemical tin plating (for illustration only, no real proportions) ............................... 6 Figure 5: Solder pin dimensions ...................................................................................... 7 Figure 6: Scratch dimensions .......................................................................................... 8 Figure 7 (left to right): Polished surface; Discoloration; Fingerprint ..................................... 8 Table 1: Thermal paste thickness .................................................................................... 9 Table 2: Phase change material thickness ......................................................................... 9 Figure 8: Screw positions in sequence ............................................................................ 10 Figure 9: Recommended setup for press-fitting ............................................................... 11 Figure 10: Module with PC-TIM (left); Press-in tool for modules with PC-TIM (right) ............ 12 Figure 11: Recommended dimensions for the press-in supporting tool ............................... 13 Figure 12: Typical press-in diagram of a module with 18 pins ........................................... 14 Figure 13: Recommended setup for disassembly ............................................................. 15 Figure 14: Cutting edge ............................................................................................... 15 Figure 15: Plated through hole, well soldered .................................................................. 16 Figure 16: Typical profile for wave soldering ................................................................... 16 08.06.2015 M. Géczy Rev. 01 page 3 Revision History Date Revision Level 08.06.2016 01 Description Page Number(s) Preliminary release 08.06.2015 M. Géczy Rev. 01 page 4 1 General instructions Figure 1 shows the basic structure of the VINco E3 type module. It is attached to a flat heat sink with thermal interface material in between. A driver PCB is mounted on the top of the module with screws. Electrical connections between the module and driver PCB are soldered or press-fitted. The main terminals are fastened to bus bars using the screw types specified in section 7. Main terminals PCB Module Module backside Heat sink Figure 1: Module with driver PCB and heat sink The distance between the heat sink surface and the driver PCB is defined by module height which is 17 mm ±0.2 mm centered on the pinhead as shown in Figure 2. Figure 2: Height of the module During PCB assembly, do not pull or push auxiliary press-fit or soldered pins more than ±0.2 mm, nor exert a force greater than 35 N except when press-fitting pins. After mounting, pin tension may not exceed ±5 N at a maximum substrate temperature of 100°C. 2 Specification for the driver PCB Printed board material must comply with IEC 61249-2-7. There is no limit as to the maximum number of conductive layers. The driver PCB attaches to the module with four BN82428 type screws (D=2.5 mm and L=6 mm). The recommended mounting torque is 0.4 Nm. Figure 3 shows the recommended holes and cutouts on the driver PCB. 08.06.2015 M. Géczy Rev. 01 page 5 Figure 3: Recommended hole and cutout sizes on the driver PCB 2.1 Specification for modules with Press-fit pins Printed circuit board thickness must not be less than 1.6 mm. PCB should be covered with solder mask on both sides. Plated through-hole specifications for Press-fit pin: o Plated hole final diameter: Ø1 mm +0.09 mm / 0.06 mm o Thickness of the Cu PTH wall > 25 μm Cu o Minimum Cu land width > 0.2 mm o Through hole position accuracy: ±0.1 mm Plating material: o Chemical Tin (Sn) plating: 0.5 µm to 10 µm. o HAL Tin (Sn) plating: 0.5 µm to 50 µm o Chemical Gold (Au), Silver (Ag) and Organic Solderability Preservative (OSP) are not generally released, individual release of PCB system required Figure 4: Plating (for illustration only, no real proportions) 08.06.2015 M. Géczy Rev. 01 page 6 2.2 The PCB can be disassembled and reused 2 more times Minimum distance between edge of the PCB and the centre of the pin hole: 4 mm Minimum distance between centre of the pin hole and components on the PCB: 4 mm For additional requirements the IEC 60352-5 standard should be considered. Specification for modules with solder pins After mounting the module to the PCB all pins must be soldered. The hole diameters on the PCB has to be designed according to the soldering pin dimensions, see Figure 5 below. For further dimensions or 3D model please contact your local sales manager. Figure 5: Solder pin dimensions 2.3 Specification for modules with Press-fit pins that are soldered to the PCB In cases where the Press-fit pins are soldered instead of pressed into the PCB the recommended PCB hole diameter is 1.45 mm ± 0.1 mm. In these cases, the annular ring must be designed according to the standards for through hole components to ensure proper soldering of the Press-fit pins. Please read section 9 Recommendation for soldering also. 3 Specifications for baseplate The thermal properties are not affected if the dimensions of the surface imperfections are within the following values. Polishing is allowed on the whole nickel plated surface if copper doesn’t become visible. If copper becomes visible, the unit is scratched and following acceptance criteria should be used. The depth and width of the scratch can’t exceed 200 μm and 800 μm, respectively. The length of the scratch does not matter but the total area of scratches must not exceed 5 % of the total substrate surface. Discolorations and fingerprints are only surface imperfections and do not affect the module's functionality. Substrate surface imperfections can be seen on Figure 6 and Figure 7. 08.06.2015 M. Géczy Rev. 01 page 7 Figure 6: Scratch dimensions Figure 7 (left to right): Polished surface; Discoloration; Fingerprint 4 Specifications for heat sink The whole heat sink surface under the module must be plane, clean and free of particles. 5 The flatness tolerance should be: <50 µm in general. (A flatness tolerance specifies a tolerance zone defined by two parallel planes within which the surface must lie.) The surface roughness should be less than: Rz < 10 µm. Heat sink surface imperfections should be within the values described for the module baseplate surface (please refer to section 3 Specifications for baseplate). Specifications for thermal interface materials The recommended means of applying paste is screen printing. Thermal resistance ( Rth) increases if the paste is thicker than recommended. Modules are also available with phase change material (OPTION 2), whereby the Rthc-h is given, provided that the heat sink specification remains unchanged. 08.06.2015 M. Géczy Rev. 01 page 8 5.1 OPTION 1: Thermal paste A. The advised technology for paste application is screen printing. Applying an inhomogeneous layer of thermal conductive paste in a honeycomb pattern is the preferred solution. For the drawing of the honeycomb pattern please contact your local sales representative. Module type Thermal paste (Wacker P12) VINco E3 TBD Table 1: Thermal paste thickness B. Alternatively a roller or spatula can be used to apply a homogeneous layer of thermal conductive paste over the whole backside of the module, Any different paste application technology or type of thermal paste should be tested additionally. The mounting procedure for modules is the same as the standard mounting process; screws to the heat sink can be fastened and tightened in one single step. 5.2 OPTION 2: Pre applied thermal interface material The VINco E3 may have already been pre-printed with phase change thermal interface material. Once the compound is applied, it is dried to a solid phase change material. The material will only flow above the phase change temperature of 45 °C when pressure is applied. No burn-in is necessary to melt the phase change material. Upon flow, air is expelled from the interface and the material conforms to the surface features of the heat sink and power module. Reducing thermal impedance, the material performs as a highly efficient thermal transfer material. The mounting procedure is the same as the standard mounting process; screws to the heat sink can be fastened and tightened in one single step. The phase change material is solid at room temperature, so screws can be tightened immediately without having to give the material any relaxation time. Further information about using modules with pre-applied TIM see the application note for “Power modules with Phase-Change Material” on Vincotech’s website In case of modules with Press-fit pins a unique press-in tool (see Figure 10) has to be used. This way the module can be mounted to the heat sink after it has been pressed into the PCB. It is also possible to mount the module to the heat sink and then press the PCB onto the assembly. Module type Phase change (Loctite PSX-Pm) VINco E3 TBD Table 2: Phase change material thickness 6 Specifications for fastening screws to the heat sink Screws M5 (recommended screw type DIN 7984) Flat washer D=max. 10 mm ISO 7092 (DIN 433) Spring washer D=max. 10 mm DIN127 or DIN 128 Mounting torque: 4 Nm < Ma < 6 Nm Thread length into the heat sink: min. 9 mm (depending on the material properties of the heat sink and screw) Tighten screws in the sequence given below and shown in Figure 8. 08.06.2015 M. Géczy Rev. 01 page 9 1) Attach the module loosely with two diagonal screws e.g. 1 & 4. 2) Tighten screws with 0.5 Nm torque in the following sequence: 1 – 4 – 2 – 3. 3) Tighten the screws with 4-6 Nm torque in the same sequence. Figure 8: Screw positions in sequence 7 Screw specification for fastening main terminals to bus bars M6 screw: The threaded hole's depth in the module is max. 12 mm from the main terminal's topside. (See the package drawing for detailed dimensions.) Mounting torque: 2.5 Nm < Ma < 5 Nm Flat washer: ISO 7092 (DIN 433) Spring washer: DIN127 or DIN 128 08.06.2015 M. Géczy Rev. 01 page 10 8 Press in process of modules with Press-fit pins 8.1 Press-in construction We recommend pressing the driver PCB onto the module from the top down as shown in Figure 9. Press-in tool Module PCB Press-fit pin Supporting tool Figure 9: Recommended setup for press-fitting The preferred process method is to press the module into the PCB from the top (as Figure 9 shows) alternatively the PCB can be pressed onto the module from the top (the module is below the PCB). The former method will be discussed in this document. In any case the tool has to ensure the correct leveling of the module and PCB to avoid mechanical stresses during assembly. The minimum distance for components from the pressing tool on the PCB is 4 mm. inserting multiple modules into one PCB can be done one by one, or all at once. Pressing multiple modules at the same time requires a press-in tool according to the above detailed single tool. Assembly steps explained: 1) Put the printed circuit board on the supporting tool. 2) Temporarily set the Module on the PCB and position the tip of the press-fit pins to the location of the through holes. 3) Apply the required press-in force on the module with the press-in tool. The applied force should be limited not to put overload on the PCB. Refer to Section 8.2. 4) The position should be controlled and the motion of the tool should be stopped when the PCB touches the standoffs of the Module. The correct leveling of the modules can also be achieved with a position-controlled press-in machine. The press-in process has to be controlled according to the requirements stated in section 8.2. 08.06.2015 M. Géczy Rev. 01 page 11 8.1.1 Press-in tool for modules without thermal interface material Recommended material for the press-in tool: 8.1.2 Tempered aluminum alloy grade 7075-T6 with 430 MPa yield strength and 160 HB hardness or Steel-grade 21 MnCr 5 with 660 MPa yield strength and 330 HB or better hardness Modules with thermal interface material A unique press-in top shown in Figure 10 is needed to prevent significant damage to the phase change material during the press-in process. Requirements for the press-in tool: Material: tool steel grade 21 MnCr 5 with yield strength of 660 MPa and hardness of 330 HB or better. Maintenance: Due to inherent contamination from process and product tolerance differences, it is recommended to clean the press-in tool regularly. The desired cleaning interval is once every 100 modules with soft wipes soaked in Isopropyl alcohol. For more information or a 3D model please contact your local sales manager. Figure 10: Module with PC-TIM (left); Press-in tool for modules with PC-TIM (right) 8.1.3 Supporting tool The support plate positions and supports the module during press-fitting. The recommended material for the support plate is ESD-proof POM (polyoxymethylene) or any metal alloy. The recommended diameter of holes/ cutouts for the pins is 1.7 mm to 4 mm, depending on positioning accuracy, as shown on Figure 11. Allow for at least 1.7 mm supporting space around the pin. The PCB and module must also be positioned. The size and position of holes and cutouts is determined by the components on the PCB. Cutouts for pins should be 6 mm deep. 08.06.2015 M. Géczy Rev. 01 page 12 Figure 11: Recommended dimensions for the press-in supporting tool 8.2 Press-fit process control parameters The total press-in force depends on the number of pins, hole diameter and plating (type/quality) of the PCB. Press-in force: 70 N / pin – 120 N / pin Press-in speed: 40 mm / min If the press machine is equipped with the possibility to record the force-stroke values during the process, the following quality relevant values should be taken into consideration. Figure 12 shows a normal press-in diagram. Three different sections can be seen on the diagram: First, raising section (blue): The heads of the Press-fit pins slide into the holes and deform to fit in the holes. This section ends with a local maximum. Second section (green): The pin slides in the holes to reach the final position. The centre of the pin heads are inside the holes and do not deform any longer. This section ends with a local minimum. Third, raising section (red): press-in tool touches the PCB and the sliding of the pins is stopped. As the tool abuts on the PCB the force raises sharply. Possible process control parameter settings are as follows: The local maximum value (end of blue section) of the force-stroke diagram has to be: o higher than the lower limit insertion force times the number of the pins and, o smaller than the upper limit insertion force times the number of the pins. In order to avoid any damage to the PCB the press-in force of the tool has to be controlled to stop the process during the third, raising section. The force control should stop at the upper limit insertion force times x number of the pins. If the press-in force does not fit in the interval defined above, it can indicate faulty plating, or improper diameter of the holes. 08.06.2015 M. Géczy Rev. 01 page 13 Figure 12 (Prelimenary): Typical press-in diagram of a module with 15 pins 8.3 Disassembling a driver PCB 8.3.1 PCB larger than Module An automatic press machine or a hand press can be used to disassemble the module and driver PCB. The recommended tooling and setup of the tools and module can be seen on Figure 13: Recommended setup for disassembly. Disassembly steps: 1) Screw down the module to the fixed jig using M5 screws recommended in Section 6. 2) Apply the required press-out force on the module with the press-jig. 3) The nail part of the jig will push the PCB and remove it from the Module. The position of the nail parts should be as close to the pins as possible. 08.06.2015 M. Géczy Rev. 01 page 14 Figure 13: Recommended setup for disassembly The total press-out force depends on the number of pins, hole diameter and plating (type/quality) of the PCB: Press-out force: min. 50 N / pin Press-in speed: max. 12 mm / min 8.3.2 PCB not larger than Module If the driver PCB is no larger than the module, the PCB cannot be disassembled by pressing it out. In this case, the only way to remove the PCB is to cut the pin ends. Manual disassembly with pliers is an option if the Press-fit pinhead is overlapped by the PCB so that the eye-of-theneedle end projects out of the PCB. Ensure you cut at plane indicated in Figure 14 below where the two parts of the pinhead come together. Remove the driver PCB from the module after clipping off all pinheads. Figure 14: Cutting edge 08.06.2015 M. Géczy Rev. 01 page 15 9 Recommendation for soldering Figure 15: Plated through hole, well soldered Plated through holes should exhibit a vertical solder fill of 75 %, with a fully formed fillet on the solder side and evidence of 75 % wetting on the component side lead, barrel and pad. 9.1 Wave soldering of modules with solder pins T T3 T2 T1 t1 t2 t3 t4 t Figure 16: Typical profile for wave soldering Soldering of certain modules with Press-fit pins is also possible using wave soldering process. Wave soldering cannot be performed on all type of Press-fit modules. 9.2 Hand soldering parameters Max. solder iron temperature: 350 °C Max. contact time with component lead: 10 s Number of heat cycles: 3 08.06.2015 M. Géczy Rev. 01 page 16 10 ESD protection Modules are sensitive to electrostatic discharge which can damage or destroy sensitive semiconductors. All modules are ESD protected in the shipment box by semi conductive plastic trays. During the handling and assembly of the modules it is recommended to wear a conductive grounded wrist band and ensure a conductive grounded working place. Please take into consideration the following standards for handling electrostatic-sensitive devices: EN61340-5-1, ANSI S20.20 11 Environmental conditions The modules can be subjected to environmental conditions characterized by the following classes: Storage: 1K2 / 1B1 / 1C1 / 1S2 / 1M2 Transportation: 2K2 / 2B1 / 2C1 / 2S1 / 2M2 These classes are defined in the IEC 60721-3-1 and IEC 60721-3-2 standards. The modules with Press-fit pins have 2 years shelf life with the given storage conditions. Flammability classification of the plastic materials for all VINco E3 are V-0 and 5-VA (selfextinguishing, no dripping of flaming particles) according to UL 94, IEC 60695-11-10 and IEC 60695-11-20 test methods. 11.1 Storage and transportation conditions The parameters detailed below are for informative purposes only. This section does not substitute the above mentioned standards. Please read the IEC 60721-3-1 and IEC 60721-3-2 standards for the description of the environment classes. 11.1.1 Climatic conditions 1K2 Air temperature: Humidity: Rate of change of temperature: Air pressure: Solar radiation: Movement of surrounding air: Condensation: Precipitation: Water from other sources than rain: Formation of ice and frost: 5 °C to 40 °C 5 % to 85 % RH but max. 1 g/m3 to 25 g/m3 absolute 0.5 °C/min 70 kPa to 106 kPa 700 W/m2 1 m/s No No No No 2K2 Temperature: Change of temperature air/air: -25 °C to 60 °C ±25 °C Relative humidity not combined with rapid temperature changes: max. 75 % (at 30 °C temperature) Relative humidity combined with rapid temperature changes: No 08.06.2015 M. Géczy Rev. 01 page 17 Low air pressure: Change of air pressure: Solar radiation: Movement of surrounding air: Precipitation: Heat radiation: Water from other sources than rain: Wetness: 11.1.2 70 kPa No 700 W/m2 No No No No No Biological conditions 1B1 Flora and fauna: Negligible 2B1 Flora and fauna: 11.1.3 No Chemically active substances 1C1 Sea and road salts: Sulphur dioxide: Hydrogen sulphide: Chlorine: Hydrogen chloride: Hydrogen fluoride: Ammonia: Ozone: Nitrogen oxides: No (Salt mist may present in sheltered locations of coastal areas.) 0.1 mg/m3 0.01 mg/m3 0.01 mg/m3 0.01 mg/m3 0.003 mg/m3 0.3 mg/m3 0.01 mg/m3 0.1 mg/m3 (Expressed in equivalent values of Nitrogen dioxide.) 2C2 Sea salts: Sulphur dioxide: Hydrogen sulphide: Nitrogen oxides: Ozone: Hydrogen chloride: Hydrogen fluoride: Ammonia: 11.1.4 none 0.1 mg/m3 0.01 mg/m3 0.1 mg/m3 (Expressed in equivalent values of Nitrogen dioxide.) 0.01 mg/m3 0.1 mg/m3 0.003 mg/m3 0.3 mg/m3 Mechanically active substances 1S2 Sand: Dust (suspension): Dust (sedimentation): 30 mg/m3 0.2 mg/m3 1.5 mg/(m2*h) 2S1 Sand in air: Dust (sedimentation): No No 08.06.2015 M. Géczy Rev. 01 page 18 11.1.5 Mechanical Conditions 1M2 Stationary vibration, sinusoidal Frequency range: displacement amplitude: Frequency range: peak acceleration: 2 Hz to 9 Hz 1.5 mm 9 Hz to 200 Hz 5 m/s2 Non stationary vibration, including shock Shock response spectrum type L peak acceleration: 40 m/s2 Static load: 5 kPa 2M2 Stationary vibration, sinusoidal Frequency range: displacement amplitude: Frequency range: peak acceleration: Frequency range: peak acceleration: 2 Hz to 9 Hz 3.5 mm 9 Hz to 200 Hz 10 m/s2 200 Hz to 500 Hz 15 m/s2 Stationary vibration, random Acceleration spectral density: Frequency range: 1 m2/s3 10 Hz to 200 Hz and Acceleration spectral density: 0.3 m2/s3 Frequency range: 200 Hz to 2000 Hz The later range can be neglected transporting with vehicles with high damping. Non stationary vibration, including shock Shock response spectrum type I. peak acceleration: 100 m/s2 , and Shock response spectrum type II. peak acceleration: 300 m/s2 Free fall: Internal standard F23047-A1004-S000-01-76 Toppling: Around any of the edges. Rolling, pitching Angle: ±35° Period: 8s 35° may occur for short time periods but 22.5° may persist permanently. Acceleration Static load 12 20 m/s2 10 kPa Disclaimer The information and recommendations in this document are based on standards and common engineering practices. Customer specific applications and specifications may require additional processes and tests that may supersede those recommended in this document. 08.06.2015 M. Géczy Rev. 01 page 19