Handling Instructions for flow 0 packages This document is valid for all type of flow 0 modules: 12 mm & 17 mm housing, 2 & 4 clips versions, 4 tower version, with solder & Press-fit pins Date: 08.12.2015 Rev ision: Created by: Zs. Gy imóthy Rev. 08 Table of Contents 1 General assembly instructions........................................................................... 6 2 Specification for PCBs ...................................................................................... 7 2.1 Specification for modules with Press-fit pins ........................................................ 7 2.2 Specification for modules with solder pins ........................................................... 8 2.3 Specification for modules with Press-fit pins that are soldered to the PCB ................. 8 2.4 Required PCB cutouts for module with 2-clips ...................................................... 9 2.4.1 For modules with 2-clips and solder pins ............................................................. 9 2.4.2 For modules with 2-clips and Press-fit pins ........................................................ 10 2.4.3 For modules with 4-clips and solder pins ........................................................... 11 3 Specification for module backside surface ......................................................... 12 4 Specification for heat sink .............................................................................. 13 5 Specification for thermal interface materials ...................................................... 14 5.1 OPTION 1: Thermal paste .............................................................................. 14 5.2 OPTION 2: Thermal foil: ................................................................................ 14 5.3 OPTION 3: Pre-applied thermal interface material .............................................. 15 6 Specification for fastening screws to the heat sink .............................................. 16 6.1 Screw with pre-assembled washers .................................................................. 16 6.2 Mounting with automatic screwdriver ............................................................... 17 7 Mounting options of modules with Press-fit pins ................................................. 18 8 Press-in process of modules with Press-fit pins .................................................. 18 8.1 Press-in construction ..................................................................................... 18 8.1.1 Press-in tool ................................................................................................ 19 8.1.1.1 Module without thermal interface material ....................................................... 19 8.1.1.2 Modules with thermal interface material .......................................................... 20 8.1.2 Supporting tool ............................................................................................ 21 8.2 Press-in process parameters ........................................................................... 22 8.2.1 Basic requirements for the press-in process....................................................... 23 8.3 Process control parameters ............................................................................ 23 9 Press-out process for modules w ith Press-fit pins ............................................... 25 9.1 Press-out tool .............................................................................................. 26 9.2 Press-out process characteristics ..................................................................... 27 9.2.1 Press-out process parameters ......................................................................... 28 9.3 Disassembling by hand .................................................................................. 28 10 Mounting options of modules with solder pins .................................................... 29 10.1 Modules with 4 towers ................................................................................... 29 10.1.1 Using screws to fix the module to the PCB......................................................... 29 08.12.2015 Zs. Gyimóthy Rev. 08 page 2 Table of Contents 10.1.2 Using soldering jig (without using screws) ......................................................... 29 10.2 Modules with 2 clips ...................................................................................... 30 10.2.1 Mounting by hand ......................................................................................... 30 10.2.2 Mounting with clip-in tool ............................................................................... 31 10.3 Modules with 4 clips ...................................................................................... 32 10.3.1 Mounting by hand ......................................................................................... 32 10.3.2 Mounting with clip-in tool ............................................................................... 33 11 Permitted deformations of the clips and springs ................................................. 34 12 Recommendation for soldering ........................................................................ 35 12.1 Wave soldering of modules w ith solder pins ....................................................... 35 12.2 Hand soldering parameters ............................................................................. 35 13 ESD protection ............................................................................................. 36 14 Environmental conditions ............................................................................... 37 14.1 Vibration resistance ...................................................................................... 37 14.2 Parameters of environment classes .................................................................. 37 14.2.1 Climatic conditions ........................................................................................ 37 14.2.2 Biological conditions ...................................................................................... 38 14.2.3 Chemically active substances .......................................................................... 38 14.2.4 Mechanically active substances ....................................................................... 39 14.2.5 Mechanical Conditions ................................................................................... 39 15 Disclaimer ................................................................................................... 40 08.12.2015 Zs. Gyimóthy Rev. 08 page 3 Table of Figures 1. Figure: Module with PCB and heat sink .......................................................................6 2. Figure: Chemical tin plating (for illustration only, no real proportions) .............................7 3. Figure: HAL tin plating (for illustration only, no real proportions) ....................................7 4. Figure: Solder pin diameter ......................................................................................8 5. Figure: PCB cutouts for two-clip modules with solder pins ..............................................9 6. Figure: PCB cutouts for two-clip modules with Press-fit pins ......................................... 10 7. Figure: PCB cutouts for modules w ith 4 clips ............................................................. 11 8. Figure: Scratch and etching hole dimensions ............................................................. 12 9. Figure: Polished surface......................................................................................... 12 10. Figure: Discoloration of substrate .......................................................................... 13 11. Figure: Fingerprint on the surface .......................................................................... 13 12. Figure: Thermal paste honeycomb pattern .............................................................. 14 13. Figure: Recommended thermal foil dimensions ........................................................ 15 14. Figure: Recommended torque and speed curve ........................................................ 17 15. Figure: Recommended construction for the press-in process....................................... 18 16. Figure: Press-in tools closed, module is pressed-in ................................................... 19 17. Figure: Recommended press-in tool for modules without thermal interface material ....... 20 18. Figure: Recommended press-in tool for modules with thermal interface material ............ 21 19. Figure: The recommended hole and cutout dimensions for supporting tool .................... 22 20. Figure: Press-in depth in PCB................................................................................ 23 21. Figure: Typical press-in diagram of a 20 pin module ................................................. 24 22. Figure: Exploded view of the press-out tool ............................................................. 25 23. Figure: Working position of the press-out tool.......................................................... 25 24. Figure: Recommended dimensions of the upper tool ................................................. 26 25. Figure: Recommended dimensions of the lower tool .................................................. 27 26. Figure: Force-path diagram of the press-out process................................................. 28 27. Figure: Cutting edge ........................................................................................... 28 28. Figure: Assembly illustration ................................................................................. 29 29. Figure: Hand mounting steps ................................................................................ 30 30. Figure: Clip-in tool .............................................................................................. 31 31. Figure: Mounting operation provided by the clip-in tool.............................................. 31 32. Figure: Hand mounting operation for 4 clip module ................................................... 32 33. Figure: Clip-in tool .............................................................................................. 33 34. Figure: Permitted deformation of the clips and springs .............................................. 34 35. Figure: Platedthrough hole, good soldering .............................................................. 35 36. Figure: Typical prof ile for wave soldering ................................................................ 35 08.12.2015 Zs. Gyimóthy Rev. 08 page 4 Revision History Date Rev ision Level Page Numbe r(s) 08.12.2015 08 Update in chapter: 1; 2.1; 6.2; 7; 8.1; 8.1.2; 8.2; 8.3; 10.1; 10.2; 10,3; 12; 13; 14.2.5 24.04.2015 07 Inserting Flow0-4T, Section order modification, Soldering curve 25.02.2015 06 Update in the chapter: 2.1; 4; 6; 8.1.1; 8.3;10.1.2;14; 15 17.02.2014 05 Hole diameter for soldered Press-fit 15.11.2013 04 Heat sink flatness, thermal paste thickness 21.10.2013 03 Wire pin diameter 09.05.2013 02 Press-fit shelf life, vibration resistance 26.02.2013 01 New document Description 08.12.2015 Zs. Gyimóthy 6, 7, 16, 17, 20, 21, 22, 23, 29, 30, 32, 35, 36, 39 18,29,35 Rev. 08 page 5 1 General assembly instructions The flow 0 type modules have to be mounted to a PCB. The electrical connections between module and the PCB can be made by soldering or by using Press-fit technology. In applications where the module is attached to a heat sink, the PCB must also be attached to this heat sink. Figure 1 shows how this attachment can be achieved with threaded spacers. PCB Module Module backside Heat sink 1. Figure: Module with PCB and heat sink The distance between the top surface of the heat sink and the bottom plane of the PCB is defined by the module type, which can be 12 mm or 17 mm. PCB spacers can be used to obtain the correct spacing. The number and the position of the fixing points depend on the design of the circuit, the location of different masses like capacitors or inductors and the environment of the system. General recommendation cannot be given. For recommended heights of these spacers see the sections of mounting options (7, 10). Typical (recommended) assembly sequence: 1. Attach module to the PCB 2. Position and fix the assembled PCB with spacers to the heat sink 3. Fix the module to the heat sink During the assembly process, a single pin is not allowed to be drawn or pushed more than ±0.2 mm or loaded with a force greater than 35 N (exc ept during pressing-in of Press-fit pins). The special design of the Press-fit pins prevents higher than 0.1 mm deformation of pins during the pressing-in process. The tension of the pin must not exceed ±5 N at a maximu m substrate temperature of 100 °C. 08.12.2015 Zs. Gyimóthy Rev. 08 page 6 2 Specification for PCBs 2.1 Printed board material meets the requirements of IEC 61249-2-7. The maximum number of conductive layers is not limited. Specification for modules with Press-fit pins Printed board thic kness must not be less than 1.6 mm (thinner PCBs require additional testing and w ill be performed upon request). PCB should be covered with solder mask on both sides. Plated through-hole specifications for Press-fit pin: o Hole diameter before plating: 1.6 mm ± 0.025 mm o Thickness of the PTH wall > 25 μm Cu o Plated hole final dimension: 1.45 mm +0.09 mm / -0.06 mm o Minimum Cu width of the annular ring > 0.1 mm o Through hole position accuracy ±0.1 mm Plating material: o for chemical tin plating (Sn): 0.5 μm to 10 μm The PCB can be disassembled and reused 2 more times. 2. Figure: C hemical tin plating (for illustration only, no real proportions) o for HAL tin plating (Sn): 0.5 μm to 50 μm The PCB can be disassembled and reused 2 more times. 3. Figure: HAL tin plating (for illustration only, no real proportions) o Au: not generally released; individual release of PCB system required Minimum distance between the edge of the PCB and the centre of the pin hole: 4 mm Minimum distance between the centre of the pin hole and the component on the PCB: 4 mm For any other requirements IEC 60352-5 standard should be considered 08.12.2015 Zs. Gyimóthy Rev. 08 page 7 2.2 Specification for modules with solder pins The module is attached to the PCB by clipping or screwing it into the appropriate holes. The role of the clips is to hold the module in the PCB at a proper position before and during soldering process. For details see section 2.4. After clipping or screwing the module, all pins must be soldered into the PCB. The hole diameters on the PCB have to be designed according to the soldering pin diameter which is Ø 1 mm ± 0.05 mm. For further dimensions or a 3D model please contact your local sales manager. 4. Figure: Solder pin diameter 2.3 Specification for modules with Press-fit pins that are soldered to the PCB In cases where the Press-fit pins are soldered instead of pressed into the PCB the recommended PCB hole diameter is 1.85 mm ± 0.1 mm. In these cases, the annular ring must be designed according to the standards for through hole components to ensure proper soldering of the Press-fit pins. Please read section 122 Recommendation for soldering also. 08.12.2015 Zs. Gyimóthy Rev. 08 page 8 2.4 Required PCB cutouts for module with 2-clips The drawings below show the required PCB-cutouts defined for different PCB thicknesses. 2.4.1 For modules with 2-clips and solder pins 5. Figure: PCB cutouts for two-clip modules with solder pins 08.12.2015 Zs. Gyimóthy Rev. 08 page 9 2.4.2 For modules with 2-clips and Press-fit pins 6. Figure: PCB cutouts for two-clip modules with Press-fit pins The clips have no function in the case of Press-fit modules since the module is held by the Press-fit pins in the PCB. The press-in depth (position) is controlled by the press-in tool. The clip-in function in a Press-fit module is unnecessary because it would provide too strict positioning tolerance. Large cutouts prevent the clip-in function of the clips (see 6. Figure: PCB cutouts for two-clip modules with Press-fit pins). 08.12.2015 Zs. Gyimóthy Rev. 08 page 10 2.4.3 For modules with 4-clips and solder pins PCB thickness in mm d1/mm l1/mm 1.4 < x < 1.8 without holes 3.1 1.8 < x < 2.2 2.3 3.6 2.2 < x < 2.8 3.6 4.6 7. Figure: PCB cutouts for modules with 4 clips 08.12.2015 Zs. Gyimóthy Rev. 08 page 11 3 Specification for module backside surface The thermal properties are not affected if the dimensions of the surface imperfections are within the following values. Polishing is allowed on the whole nickel plated surface if copper doesn’t become visible. If copper becomes visible, the unit is scratched and following acceptance criteria should be used. The depth and width of the scratch can’t exceed 200 μm and 800 μm, respectively. The length of the scratch does not matter but the total area of scratches must not exceed 5 % of the total substrate surface. The diameter and depth of etching holes have to be below 1000 μm and 200 μm, respectively. Discolorations and f ingerprints are only surface imperfections and do not affect the module 's functionality. Substrate surface imperfections can be seen on the figures below. 8. Figure: Scratch and etching hole dimensions 9. Figure: Polished surface 08.12.2015 Zs. Gyimóthy Rev. 08 page 12 10. Figure: Discoloration of substrate 11. Figure: Fingerprint on the surface 4 Specification for heat sink The whole heat sink surface under the module must be plane, clean and free of particles. The flatness tolerance should be: < 25 µm in general. In case the thermal paste is thicker than 50 µm the flatness tolerance can be < 50 µm. (A flatness tolerance specifies a tolerance zone defined by two parallel planes w ithin which the surface must lie.) The surface roughness sho uld be less than: Rz < 10 µm. Heat sink surface imperfections should be within the values described for the module backside surface (please refer to section 3). 08.12.2015 Zs. Gyimóthy Rev. 08 page 13 5 Specification for thermal interface materials 5.1 OPTION 1: Thermal paste A. Apply a homogeneous layer of thermal conductive paste over the whole backside of the module, w ith a roller or spatula. B. Apply thermal paste in a honeycomb pattern. T he preferred technology for paste application is screen printing. For a drawing of the pattern please contact your local sales representative. 12. Figure: Thermal paste honeycomb pattern The recommended thermal paste thickness is 45 µm ± 15 µm in both cases. Thermal paste thicker than recommended will increase thermal resistance ( Rth). 5.2 OPTION 2: Thermal foil: A thermal foil comprising of an aluminium core layer and two outer layers of phase change material should be used. The total thickness of the foil has to be less than 80 µm. Thicker foils could cause the ceramic substrate to break and increase the thermal resistance. Recommended foil type: Kunze Folien KU-ALC5 or ALF5 Recommended foil dimensions: see 13. Figure: on next page. 08.12.2015 Zs. Gyimóthy Rev. 08 page 14 13. Figure: Recommended thermal foil dimensions 5.3 OPTION 3: Pre-applied thermal interface material The modules may have already been pre-printed with thermal interface material. o For modules with Press-fit pins a unique press-in tool (see section 8.1.1) has to be used or the module has to be mounted first to the heat sink and then pressed into the PCB. o Further information about using modules w ith pre-applied TIM see the application note for “ Power modules w ith Phase-Change Material” on Vincotech’s website 08.12.2015 Zs. Gyimóthy Rev. 08 page 15 6 Specification for fastening screws to the heat sink Screws M4 (recommended screw type DIN 7984) Min. depth of the screw in the heat sink: 6 mm Flat washer ISO 7092 (DIN 433) - size of outer diameter Ø 8 mm can be fitted into the module. Spring washer DIN127 or DIN 128 Mounting torque: 1.6 Nm < Ms < 2 Nm For modules with AlN DCB: tighten both screws with half torque first, and then tighten both screws with max. torque afterwards A torque wrench shall be used to t ighten the mounting screws at the specified torque as excessive torque may result in damage or degradation of the device. The inaccuracy of torque wrench tightening method can range up to ±12 %. This has to be taken into account to prevent over-tightening the fastener. Due to excessive temperature fluctuations washers should be used to prevent the loosening of the screws. After accurate tightening of the screws the spring washer exerts a constant force on the joint. The flat washer distributes this force on the plastic surface. 6.1 Screw with pre-assembled washers Screws with pre-assembled washers (SEMS or kombi screws) combine the screw and the washers into a single component. These screws eliminate the need to slip the washers into place by hand, boosting the speed and efficiency of the assembly process. The specifications of these screws are provided below: Screw size M4 according to DIN 6900 (ISO 10644; JIS B1188) Flat washer according to DIN 6902 Type C (ISO 10673 Type S; JIS B1256) Size of outer diameter Ø 8 mm can be fitted into the module. Split lock spring washer according to DIN 6905 (JIS B1251) Mounting torque range: 1.6 Nm < Ms < 2 Nm 08.12.2015 Zs. Gyimóthy Rev. 08 page 16 6.2 Mounting with automatic screwdriver For a fast, reliable and repeatable screwing process an automatic screwdriver with two stage tightening method is recommended. The screwdriver starts fast in the first stage and slows down after the first target torque is reached to accurately tighten the screw to the final target. For torque and speed recommendations see below the curves (14. Figure) and values: Torque - Cycle start: First target: Final tq min.: Final target: Final tq max.: 0.3 Nm 0.5 Nm 1.6 Nm 1.8 Nm 2 Nm Soft start speed: Step 1 speed: Step 2 speed: 96 rpm max. 650 rpm max. 12 rpm Speed - 14. Figure: Recommended torque and speed curve 08.12.2015 Zs. Gyimóthy Rev. 08 page 17 7 Mounting options of modules with Press-fit pins In the case of modules w ith Press-fit pins, the usage of the mounting by clipping or screwing to the PCB of the module is not recommended. Recommended spacer height: - 12.1- 0 .1 mm in the case of 12mm type modules - 17.1- 0 .1 mm in the case of 17mm type modules 8 Press-in process of modules with Press-fit pins 8.1 Press-in construction 15. Figure: Recommended construction for the press-in process 08.12.2015 Zs. Gyimóthy Rev. 08 page 18 16. Figure: Press-in tools closed, module is pressed-in The module can be pressed into the PCB from the top (as 15. Figure: & 16. Figure: shows) or the PCB can be pressed onto the module f rom the top (the module is below the PCB). The preferred method is to press the module into the PCB from the top. This method will be discussed in this document. Pressing multiple modules into one PCB can be done one by one (subsequently) or all at once. Pressing multiple modules at the same time requires a press-in tool according to the above detailed single tool. The tool has to ensure the correct leveling of the modules and PCB to avoid mechanical stress. The “U-shape” tool (16. Figure:) is only because to keep the distance between the PCB and the module. Depending on the PCB layout the geometry and the position of this distance keeper can be different. Minimum distance between tool and the components on the PCB: 4 mm 8.1.1 Press-in tool The press-in tool protects the module from being over pressed. 8.1.1.1 Module without thermal interface material Material requirements for the press-in tool: Tool steel grade 21 MnCr 5 w ith yield stre ngth of 660 MPa and hardness of 330 HB or better. Maintenance: Due to inherent contamination f rom process and product tolerance differences, it is recommended to clean the press-in tool regularly. The dimension marked w ith ‘x’ on the draw ing (17. Figure:) depends on module height: 12.1+0 .05 mm in the case of 12mm type modules 17.1+0 .05 mm in the case of 17mm type modules 08.12.2015 Zs. Gyimóthy Rev. 08 page 19 17. Figure: Recommended press-in tool for modules without thermal interface material 8.1.1.2 Modules with thermal interface material A unique press-in top tool show n in 18. Figure: is needed to prevent significant damage to the phase change material during the press-in process. Small damages (max: Ø 0.6 mm) are allowed. Requirements for the press-in tool: Tool steel grade 21 MnCr 5 w ith yield strength of 660 MPa and hardness of 330 HB or better. Maintenance: Due to inherent contamination from process and product tolerance differences, it is recommended to clean the press-in tool regularly. The desired cleaning interval is once every 100 modules w ith soft wipes soaked in Isopropyl alcohol. The dimension marked w ith ‘x’ on the draw ing (18. Figure:) is depends on module height: 12.1+0 .05 mm in the case of 12mm type modules 17.1+0 .05 mm in the case of 17mm type modules For more information or a 3D model please contact your local sales manager. 08.12.2015 Zs. Gyimóthy Rev. 08 page 20 18. Figure: Recommended press-in tool for modules with thermal interface material 8.1.2 Supporting tool The supporting tool supports the PCB during the press-in process. The size and position of the holes and cut-outs depends on the components on the PCB. 19. Figure: shows the recommended hole and cut-out dimensions for the Press-fit pins. The recommended diameter of the holes / cut-outs for the pins in the supporting tool is between 1.7 mm and 4 mm (depending on the positioning accuracy). The minimal supporting place around the hole is 2 mm (the min. distance of PCB components from the PCB pinhole should be also considered here). If the pins are close to each other then it is possible to make a lengthwise cut -out for more pins as well. It is necessary to position the PCB and the module as well. The depth of the cut-outs for the pins is 6 mm. The module can be positioned with pins from the bottom tool through the fixing holes of the modules. Material of the supporting tool: POM (Polyoxymethylene) ESD proof or any metal alloy. The thickness of the supporting tool has to be at least 20 mm. 08.12.2015 Zs. Gyimóthy Rev. 08 page 21 19. Figure: The recommended hole and cutout dimensions for supporting tool 8.2 Press-in process parameters The total press-in force depends on the number of the pins the hole-diameter and the plating (type/quality) of the PCB. Press-in force: 70 N/pin to 160 N/pin Press-in speed: 5 mm/s to 10 mm/s 08.12.2015 Zs. Gyimóthy Rev. 08 page 22 8.2.1 Basic requirements for the press-in process The Press-fit pins have to be pressed to the correct depth into the holes of the PCB. The center of the Press-fit pin head has to be at least 0.5 mm below the top surface and at least 0.5 mm above the bottom surface of the PCB. (20. Figure:). 20. Figure: Press-in depth in PCB This condition is automatically fulfilled w ith the use of the recommended press -in tool. 16. Figure: shows the closed press-in tool with the module. 8.3 Process control parameters If the press machine is equipped with the possibility to record the force -stroke values during the process, the following quality relevant values should be taken into consideration. 21. Figure: shows a normal press-in diagram. Three different sections c an be seen on the diagram: First raising section (blue): The heads of the Press-fit pins slide into the holes and deform to fit in the holes. This section ends with a local maximum. Second section (green): The pin slides in the holes to reach the final pos ition. The centre of the pin heads are inside the holes and do not deform any longer. This section ends with a local minimum. Second raising section (red): press-in tool touches the PCB and the sliding of the pins is stopped. The press-in tool starts to bend the PCB. The pressing-in has to be stopped at the beginning of the second raising section, not exceeding the actual max force of the first rising section, to avoid damaging the PCB or the deformation of the plastic housing. The press-in force or the motion stroke of the tool has to be controlled to stop at the beginning of the second raising section. Possible process control parameter settings are as follows: The local maximum value (end of blue section) of the force-stroke diagram has to be: o higher than 70 N x number of the pins, o smaller than 160 N x number of the pins. These limits are marked on the diagram. If the press-in force does not fit in the interval defined above, it can indicate faulty plating, or improper diameter of the holes. 08.12.2015 Zs. Gyimóthy Rev. 08 page 23 21. Figure: Typical press-in diagram of a 20 pin module 08.12.2015 Zs. Gyimóthy Rev. 08 page 24 9 Press-out process for modules with Press-fit pins Please note: In the case an out -pressed module should be used again, it is necessary to solder the module to the PCB because of the remaining deformation of the pins. This is because the Press-fit zone will keep a remaining deformation after the press -out process. An additional press-in cycle will result in low holding forces between the Press-fit pin and the PCB hole. Additional information for the annular ring can be found in section 2.3. Pressing plates Ram Fixing pins Module with PCB Supporting pins Backing nest 22. Figure: Exploded view of the press-out tool 23. Figure: Working position of the press-out tool 08.12.2015 Zs. Gyimóthy Rev. 08 page 25 9.1 Press-out tool The specific tool to disassemble the modules f rom the PCBs has two parts similar to the press in tool. The lower part serves as a backing for the PCB. It has a backing nest and supporting pins. It is important that the backing has to be as c lose as possible to the sides of the module. The supporting pins are in line with the fixing pins of the upper part. There may be components mounted to the PCB in the area of the backing. It is possible to cut out the nest in this case. The upper part consists of two pressing plates that are connected by springs. The pins on the lower plate serve to fix the PCB. With the aid of these parts, the bending of the PCB can be prevented during pressing. The ram fastened to the upper plate is designed according to the positions of the parts on the PCB and the layout of the pins. It is not possible to press the module out with a f lat plate if the PCB is thicker than 2.5 mm due to the overhang of the pins. In this case, pressing sticks positioned according to the pin layout are necessary. Recommended spring force: 25 N/mm Recommended number of springs: 4 Pieces 24. Figure: Recommended dimensions of the upper tool 08.12.2015 Zs. Gyimóthy Rev. 08 page 26 25. Figure: Recommended dimensions of the lower tool 9.2 Press-out process characteristics After inserting the module into the nest, the downward moving press f ixes the PCB with the lower plate through the springs. The pins are pressed through by the onward moving pressing ram. 26. F igure: shows a typical force-distance diagram of the press-out process for a 20 pin module. It is typical for this curve that a characteristic peak appears w hich indicates the breaking of the cold welded connection. 08.12.2015 Zs. Gyimóthy Rev. 08 page 27 Connections brake Pins slide out Compression of the springs of the tool starts 26. Figure: Force-path diagram of the press-out process 9.2.1 Press-out process parameters 9.3 Press-out force: Higher than 40 N/pin Press-out speed: 2 mm/s to 5 mm/s Disassembling by hand If the Press-fit pin-head is overlapped by the PCB in such a way that the spring-end is out of the PCB, the disassembling is possible hand pliers. The cutting should be done in such a way that the cutting edge is under the area where the two parts of the pin head join shown as level ‘A-A’ in 27. Figure:. After clipping away all of the pin-heads, it is possible to remove the module f rom the PCB. 27. Figure: Cutting edge 08.12.2015 Zs. Gyimóthy Rev. 08 page 28 10 Mounting options of modules with solder pins 10.1 Modules with 4 towers for minimu m overhang of pins IPC-A-610E standard and module datasheet drawing should be considered 10.1.1 Using screws to fix the module to the PCB Insert the module pins into the PCB Fix the module to the PCB with 4 screws by the towers before soldering (for screws min. ø2.8 mm hole is needed on PCB) Screw type: BN82428, D = 2.5 mm and L = 6 mm w ith a mounting torque: 0.4 Nm. Recommendation for spacer: o not necessary to use surrounding the module o general height: - 11.9+0 .05 in the case of 12 mm modules - 16.9+0 .05 in the case of 17 mm modules 28. Figure: Assembly illustration 10.1.2 Using soldering jig (without using screws) Insert the module pins into the PCB Fix the module to the PCB with soldering jig before soldering Recommendation for spacer: o use spacers also surrounding the module o general height can be variable: has to be adjusted, depending on height of soldering jig and PCB thickness 08.12.2015 Zs. Gyimóthy Rev. 08 page 29 10.2 Modules with 2 clips spacer height depends on PCB thickness, calculated as follows: PCB thickness [mm] 1.4 ≤ S < 1.8 1.8 ≤ S < 2.2 2.2 ≤ S < 2.6 Height of module clip [mm] 2-clips and 12mm type: 2-clips and 17mm type: H= 13.65 18.65 height of spacer [mm] H= 14.15 19.15 H= 14.65 19.65 h = H - S ±0.05 10.2.1 Mounting by hand Insert the module pins into the PCB and clip in the module (see 29. Figure: Hand mounting stepsBurrs are not allowed on the PCB-cutouts The necessary force for pushing the clips is o 12 N in case of 17 mm modules/side o 40 N in case of 12 mm modules/side 12 mm modules 17 mm modules 1. Insert the module pins to the PCB and press one arbitrary side of the module gently as shown below until two clips of that side are locked 2. Press the other side to lock the remaining two clips as shown on the figure below 3. The mounted module on PCB 29. Figure: Hand mounting steps 08.12.2015 Zs. Gyimóthy Rev. 08 page 30 10.2.2 Mounting with clip-in tool In case the cutout on the PCB has sharp edges (milled or drilled), or the PCB is not coated by lacquer, it is strongly recommended to use an auxiliary clip-in tool (see 30. Figure) as it makes the mounting easier. 30. Figure: C lip-in tool 12 mm modules 17 mm modules Mounting operation by clip-in tool 31. Figure: Mounting operation provided by the clip-in tool For more information or a 3D model please contact your local sales manager. 08.12.2015 Zs. Gyimóthy Rev. 08 page 31 10.3 Modules with 4 clips spacer height depends on PCB thickness, calculated as follows: PCB thickness [mm] 1.4 ≤ S < 1.8 1.8 ≤ S < 2.2 2.2 ≤ S < 2.6 Height of module clip [mm] 4-clips and 17mm type: H= 18.7 height of spacer [mm] H= 18.7 H= 18.7 h = H - S ±0.05 10.3.1 Mounting by hand 1. Insert the module pins to the PCB and press one arbitrary side of the module gently as shown below until two clips of that side are locked 2. Press the other side to lock the remaining two clips as shown on the figure below 3. The mounted module on PCB 32. Figure: Hand mounting operation for 4 clip module 08.12.2015 Zs. Gyimóthy Rev. 08 page 32 10.3.2 Mounting with clip-in tool It is recommended to use a clip-in tool as it makes mounting easier. 33. Figure: C lip-in tool For more information or a 3D model please contact your local sales manager. 08.12.2015 Zs. Gyimóthy Rev. 08 page 33 11 Permitted deformations of the clips and springs 12 mm housing 17 mm housing 34. Figure: Permitted deformation of the clips and springs Maximum allowable force and displacement on the clip and springs: Clip Spring Housing max. force max. displacement max. force max. displacement 12 mm 70 N 1.2 mm 20 N 1.5 mm 17 mm 20 N 1.5 mm 20 N 1.8 mm 08.12.2015 Zs. Gyimóthy Rev. 08 page 34 12 Recommendation for soldering 35. Figure: Platedthrough hole, good soldering Plated through holes should exhibit a vertical solder fill of 75 %, with a fully formed f illet on the solder side and evidence of 75 % wetting on the component side lead, barrel and pad. 12.1 Wave soldering of modules with solder pins T T3 T2 T1 t1 t2 t3 t4 t 36. Figure: Typical profile for wave soldering Soldering of certain modules w ith Press-fit pins is also possible using the wave soldering process. Wave soldering cannot be performed on all type of Press-fit modules. 12.2 Hand soldering parameters Max. solder iron temperature: Max. contact time with component lead: Number of heat cycles: 350 °C 10 s 3 08.12.2015 Zs. Gyimóthy Rev. 08 page 35 13 ESD protection Modules are sensitive to electrostatic discharge which can damage or destroy sensitive semiconductors. All modules are ESD protected in the shipment box by semi conductive plastic trays. During the handling and assembly of the modules it is required to wear a conductive grounded wrist band and ensure a conductive grounded working place. Please take into consideration the following standards for handling ele ctrostatic-sensitive devices: IEC 61340-5-1, ANSI/ESD S20.20 08.12.2015 Zs. Gyimóthy Rev. 08 page 36 14 Environmental conditions The modules can be subjected to environmental conditions characterize d by the following classes: Storage: 1K2 / 1B1 / 1C1 / 1S2 / 1M2 Transportation: 2K2 / 2B1 / 2C1 / 2S1 / 2M2* These classes are defined in the IEC 60721-3-1 and IEC 60721-3-2 standards. The modules with wire pins have 1 year shelf life and the modules w ith Press-fit pins have 2 years shelf life with the given storage conditions. Flammability classification of the plastic material for flow 0 packages are V-0 and 5-VA (selfextinguishing, no dripping of flaming particles) according to UL 94, IEC 60695-11-10 and IEC 60695-11-20 test methods. 14.1 Vibration resistance In addition to the vibration parameters defined in 1M2 and 2M2 classes, the flow 0 package modules are qualified w ith the environmental test in accordance to the IEC 60068-2-6:2007 standard with the follow ing severity: Frequency range: displacement amplitude: Frequency range: peak acceleration: Duration: Number of axes: 10 Hz to 26.6 Hz 3.5 mm (7 mm peak-to-peak) 26.6 Hz to 500 Hz 10 G (98.1 m/s2 ) 2 hours 3 These parameters are more severe than the parameters of the 1M2 and 2M2 classes. 14.2 Parameters of environment classes The parameters detailed below are for informative purposes only. This section does not substitute the above mentioned standards. Please read the IEC 60721-3-1 and IEC 60721-3-2 standards for the description of the environment classes. 14.2.1 Climatic conditions 1K2 Air temperature: 5 °C to 40 °C Humidity: 5 % to 85 % RH but max. 1 g/m³ to 25 g/m3 absolute Rate of change of temperature: 0.5 °C/min Air pressure: 70 kPA to 106 kPa Solar radiation: 700 W/m2 Movement of surrounding air: 1 m/s Condensation: No Precipitation: No Water from other sources than rain: No Formation of ice and frost: No 08.12.2015 Zs. Gyimóthy Rev. 08 page 37 2K2 Temperature: −25 °C to 60 °C Change of temperature air/air: ±25 °C Relative humidity not combined with rapid temperature changes: max. 75 % (at 30 °C temperature) Relative humidity combined with rapid temperature changes: No Low air pressure: 70 kPa Change of air pressure: No Solar radiation: 700 W/m2 Movement of surrounding air: No Precipitation: No Heat radiation: No Water from other sources than rain: No Wetness: No 14.2.2 Biological conditions 1B1 Flora and fauna: Negligible 2B1 Flora and fauna: No 14.2.3 Chemically active substances 1C1 Sea and road salts: No (Salt mist may be present in sheltered locations of c oastal areas.) Sulphur dioxide: 0.1 mg/m3 Hydrogen sulphide: 0.01 mg/m3 Chlorine: 0.01 mg/m3 Hydrogen chloride: 0.01 mg/m3 Hydrogen fluoride: 0.003 mg/m3 Ammonia: 0.3 mg/m3 Ozone: 0.01 mg/m3 Nitrogen oxides: 0.1 mg/m3 (Expressed in equivalent values of Nitrogen dioxide.) 2C2 Sea salts: none Sulphur dioxide: 0.1 mg/m3 Hydrogen sulphide: 0.01 mg/m3 Nitrogen oxides: 0.1 mg/m3 (Expressed in the equivalent values of Nitrogen dioxide.) Ozone: 0.01 mg/m3 08.12.2015 Zs. Gyimóthy Rev. 08 page 38 Hydrogen chloride: 0.1 mg/m3 Hydrogen fluoride: 0.003 mg/m3 Ammonia: 0.3 mg/m3 14.2.4 Mechanically active substances 1S2 Sand: 30 mg/m3 Dust (suspension): 0.2 mg/m3 Dust (sedimentation): 1.5 mg/(m2 h) 2S1 Sand in air: No Dust (sedimentation): No 14.2.5 Mechanical Conditions 1M2 Stationary vibration, sinusoidal Please see section 14.1. Non stationary vibration, including shock Shock response spectrum type L peak acceleration: 40 m/s2 Static load: 5 kPa 2M2* Stationary vibration sinusoidal Please see section 14.1. Stationary vibration, random Acceleration spectral density: 1 m2 /s3 Frequency range: 10 Hz to 200 Hz and Acceleration spectral density: 0.3 m2 /s3 Frequency range: 200 Hz to 2000 Hz The later range can be neglected transporting w ith vehicles with high damping. Non stationary vibration, including shock Shock response spectrum type I. peak acceleration: 100 m/s2 and Shock response spectrum type II. peak acceleration: 300 m/s2 08.12.2015 Zs. Gyimóthy Rev. 08 page 39 *Free fall: weight and drop height deviate from 2M2 tested acc. to internal standard: F23047-A1004-S000-01-76 Specimen Weight [kg] up to 9,5 kg over 9,5 to 18,6 kg over 18, 6 to 27,7 kg over 27, 7 kg Number of Drops Toppling Drop Heights [mm] Standard Level Extra Level 460 760 310 610 200 460 200 310 3 7 Around any of the edges. Rolling, pitching Angle: ±35° Period: 8s 35° may occur for short time periods but 22.5° may persist permanently. Acceleration 20 m/s2 Static load: 10 kPa 15 Disclaimer The information and recommendations in this document are based on standards and common engineering practices. Customer specific applications and specifications may require additional processes and tests that may supersede those recommended in this document. 08.12.2015 Zs. Gyimóthy Rev. 08 page 40