Initiates file download

Handling Instructions
for flow 90 packages
This document is valid for all type of flow 90 0 & flow 90 1 modules:
0 & 2 clips versions with solder pins
Date:
10.03.2016
Revision:
Created by:
Zs.Gyimothy
Rev. 01
Proprietary data, company confidential. All rights reserved.
Table of Contents
1
General assembly instructions ............................................................................. 5
2
Specification for PCBs......................................................................................... 5
2.1
Required holes on the PCB .................................................................................. 5
2.2
For modules with 2 clips ..................................................................................... 5
2.3
For modules without clips ................................................................................... 6
3
Specification for module backside surface ............................................................. 7
4
Specification for heat sinks ................................................................................. 9
5
Specification for thermal interface materials.......................................................... 9
5.1
OPTION 1: Thermal paste ................................................................................... 9
5.2
OPTION 2: Thermal foil ...................................................................................... 9
5.3
OPTION 3: Pre-applied thermal interface material .................................................10
6
Specification for fastening screws to the heat sink ................................................10
6.1
Screw with pre-assembled washers .....................................................................10
6.2
Mounting with automatic screwdriver ..................................................................10
7
Mounting modules in PCB ..................................................................................12
7.1
Module with 2 clips ...........................................................................................12
7.2
Modules without clips ........................................................................................13
8
Recommendation for soldering ...........................................................................14
8.1
Wave soldering of modules with solder pins .........................................................14
8.2
Hand soldering parameters ................................................................................14
9
ESD protection .................................................................................................15
10
Environmental conditions ...................................................................................15
10.1
Parameters of environment classes .....................................................................15
10.1.1
Climatic conditions ............................................................................................15
10.1.2
Biological conditions ..........................................................................................16
10.1.3
Chemically active substances .............................................................................16
10.1.4
Mechanically active substances ...........................................................................16
10.1.5
Mechanical Conditions .......................................................................................16
11
Disclaimer .......................................................................................................17
10.03.2016
Zs.Gyimothy
Rev. 01
page 2
Table of Figures
Figure 1:Scratch and etching hole dimensions ................................................................... 7
Figure 2: Polished surface............................................................................................... 8
Figure 3: Discoloration of substrate ................................................................................. 8
Figure 4: Fingerprint on the surface ................................................................................. 8
Figure 5: Recommended thermal foil dimensions ............................................................... 9
Figure 6: Recommended torque and speed curve ............................................................ 11
Figure 7: Plate through hole, good soldering ................................................................... 14
10.03.2016
Zs.Gyimothy
Rev. 01
page 3
Revision History
Date
Revision
Level
Description
10.03.2016
01
Merge documents: Flow90_0-P-01-HI & Flow90_12CW-P-02-HI
10.03.2016
Zs.Gyimothy
Page
Number(s)
Rev. 01
page 4
1 General assembly instructions
The flow 90 type modules have to be mounted to a PCB. The electrical connections between
module and the PCB are made by soldering. During assembly the pins are not to be drawn or
pushed more than ±0.2 mm or loaded with a force greater than 35 N. The tension of the pin
must not exceed ±5 N at a maximum substrate temperature of 100 °C.
2 Specification for PCBs
 Printed board material meets the requirements of IEC 61249-2-7.
 The maximum number of conductive layers is not limited.
The module has to be fixed to the PCB by clipping it into the appropriate holes. The role of the
clips is to hold the modules in the PCB at proper position before and during soldering process.
For details see section ‎2.1 Required holes on the PCB.
 After clipping, all pins must be soldered into the PCB. The hole diameters on the PCB
has to be designed according to the soldering pin diameter which is Ø1 mm ±0.05 mm.
For further dimensions or 3D model please contact your local sales manager.
2.1 Required holes on the PCB
The drawings below show the required PCB-cutouts defined for different PCB thicknesses, for
modules with 2 clips and solder pins.
2.2 For modules with 2 clips
flow 90 0
flow 90 1
10.03.2016
Zs.Gyimothy
Rev. 01
page 5
2.3 For modules without clips
flow 90 0
flow 90 1
To fix the module and hold the right angle between PCB and DCB another fixing solution is needed.
Pinholes on the PCB need to be adjusted to the module pins.
Pin diameter: Ø 1mm ±0.05 mm.
10.03.2016
Zs.Gyimothy
Rev. 01
page 6
3 Specification for module backside surface
The thermal properties are not affected if the dimensions of the surface imperfections are
within the following values.



Polishing is allowed on the whole nickel plated surface if copper doesn’t become visible.
If copper becomes visible the unit is scratched and following acceptance criteria should
be used. The depth and width of the scratch can’t exceed 200 μm and 800 μm,
respectively. The length of the scratch does not matter but the total area of scratches
must not exceed 5% of the total substrate surface.
The diameter and depth of etching holes have to be below 1000 μm and 200 μm,
respectively.
Discolorations and fingerprints are only surface imperfections and do not affect the module’s
functionality.
Substrate surface imperfections can be seen on the figures below.
Figure 1:Scratch and etching hole dimensions
10.03.2016
Zs.Gyimothy
Rev. 01
page 7
Figure 2: Polished surface
Figure 3: Discoloration of substrate
Figure 4: Fingerprint on the surface
10.03.2016
Zs.Gyimothy
Rev. 01
page 8
4 Specification for heat sinks
The whole heat sink surface under the module must be plane, clean and free of particles.


The flatness tolerance should be: < 25 µm.
In case the thermal paste is thicker than 50 µm the flatness tolerance can be < 50 µm.
(A flatness tolerance specifies a tolerance zone defined by two parallel planes within
which the surface must lie.)


The surface roughness should be less than: Rz < 10 µm.
Heat sink surface imperfections should be within the values described for the module
backside surface (please refer to section ‎3. Specification for module backside surface’).
5 Specification for thermal interface materials
5.1 OPTION 1: Thermal paste
A. Apply a homogeneous layer of thermal conductive paste over the whole backside of the
module, with a roller or spatula.
B. Apply thermal paste in a honeycomb pattern. The preferred technology for paste
application is screen printing. For a drawing of the pattern please contact your local
sales representative.
The recommended thermal paste thickness is 45 µm ±15 µm in both cases.
Thermal paste thicker than recommended will increase thermal resistance (Rth).
5.2 OPTION 2: Thermal foil




A thermal foil comprising of an aluminum core layer and two outer layers of phase
change material should be used.
The total thickness of the foil has to be less than 80 µm. Thicker foils could cause the
ceramic substrate to break and will increase the thermal resistance.
Recommended foil type: Kunze Folien KU-ALC5 or ALF5
Recommended foil dimensions: see Figure 5.
Figure 5: Recommended thermal foil dimensions
10.03.2016
Zs.Gyimothy
Rev. 01
page 9
Type
a/mm
b/mm
c/mm
d/mm
r/mm
flow 90 0
64 ± 0.15
55 ± 0.15
31.5 ± 0.15
4.5 ± 0.15
2 ± 0.15
flow 90 1
84 ± 0.15
73 ± 0.15
34.5 ± 0.15
4.5 ± 0.15
2 ± 0.15
5.3 OPTION 3: Pre-applied thermal interface material


The modules may have already been pre-printed with thermal interface material.
Further information about using modules with pre-applied TIM see the application note
for “Power modules with Phase-Change Material” on Vincotech’s website
6 Specification for fastening screws to the heat sink






Screws M4 (recommended screw type DIN 7984)
Min. depth of the screw in the heat sink: 6 mm
Flat washer ISO 7092 (DIN 433) - size of outer diameter Ø8 mm can be fitted into the
module.
Spring washer DIN127 or DIN 128
Mounting torque: 1.6 Nm < Ms < 2 Nm
For modules with AlN DCB: tighten both screws with half torque first, and tighten both
screws with max. torque afterwards
6.1 Screw with pre-assembled washers
Screws with pre-assembled washers (SEMS or kombi screws) combine the screw and the
washers into a single component. These screws eliminate the need to slip the washers into
place by hand, boosting the speed and efficiency of the assembly process. The specification of
these screws is provided below:


Screw size M4 according to DIN 6900 (ISO 10644; JIS B1188)
Flat washer according to DIN 6902 Type C (ISO 10673 Type S; JIS B1256)
Size of outer diameter Ø8 mm can be fitted into the module.


6.2
Split lock spring washer according to DIN 6905 (JIS B1251)
Mounting torque range: 1.6 Nm < Ms < 2 Nm
Mounting with automatic screwdriver
For a fast, reliable and repeatable screwing process an automatic screwdriver with two stage
tightening method is recommended. The screwdriver starts fast in the first stage and slows
down after the first target torque is reached to accurately tighten the screw to the final target.
For torque and speed recommendations see below the curves (14. Figure) and values:
Torque
-
Cycle start:
First target:
Final tq min.:
Final target:
Final tq max.:
0.3 Nm
0.5 Nm
1.6 Nm
1.8 Nm
2 Nm
10.03.2016
Zs.Gyimothy
Rev. 01
page 10
Speed
-
Soft start speed:
Step 1 speed:
Step 2 speed:
96 rpm
max. 650 rpm
max. 12 rpm
Figure 6: Recommended torque and speed curve
10.03.2016
Zs.Gyimothy
Rev. 01
page 11
7 Mounting modules in PCB
7.1 Module with 2 clips
1. Insert the module pins to the PCB. Press the module into the PCB as shown on the figure
below until the clips are locked
2. Module in place on PCB. The clips can ensure to hold the right angle between substrate and
PCB during wave soldering process
3. Load is not allowed on the module before the end of the soldering.
10.03.2016
Zs.Gyimothy
Rev. 01
page 12
7.2 Modules without clips
1. Insert the module pins into the PCB, and push the module till it’s bottom surface rests on
the PCB.
2. Module has to be fixed by tool in order to hold the right angle position between the
substrate and the PCB during the soldering process.
3. Load is not allowed on the module before the end of the soldering.
10.03.2016
Zs.Gyimothy
Rev. 01
page 13
8 Recommendation for soldering
Figure 7: Plate through hole, good soldering
Plated through holes should exhibit a vertical solder fill of 75 %, with a fully formed fillet on
the solder side and evidence of 75 % wetting on the component side lead, barrel and pad.
8.1 Wave soldering of modules with solder pins
T
T3
T2
T1
t1
t2 t3 t4
t
8.2 Hand soldering parameters

Max. solder iron temperature:
350 °C

Max. contact time with component lead:
10 s

Number of heat cycles:
3
10.03.2016
Zs.Gyimothy
Rev. 01
page 14
9 ESD protection
Modules are sensitive to electrostatic discharge which can damage or destroy sensitive
semiconductors. All modules are ESD protected in the shipment box by semi conductive plastic
trays. During the handling and assembly of the modules it is recommended to wear a
conductive grounded wrist band and ensure a conductive grounded working place.
Please take into consideration the following standards for handling electrostatic-sensitive
devices: EN61340-5-1, ANSI S20.20
10 Environmental conditions
The modules can be subjected to environmental conditions characterized by the following
classes:
Storage:
1K2 / 1B1 / 1C1 / 1S2 / 1M2
Transportation:
2K2 / 2B1 / 2C1 / 2S1 / 2M2
These classes are defined in the IEC 60721-3-1 and IEC 60721-3-2 standards. The modules
with wire pins have 1 year shelf life with the given storage conditions.
Flammability classification of the plastic material for flow 90 packages are V-0 and 5-VA (selfextinguishing, no dripping of flaming particles) according to UL 94, IEC 60695-11-10 and IEC
60695-11-20 test methods.
10.1
Parameters of environment classes
The parameters detailed below are for informative purposes only. This section does not
substitute the above mentioned standards. Please read the IEC 60721-3-1 and IEC 60721-3-2
standards for the description of the environment classes.
10.1.1 Climatic conditions
1K2
Air temperature:
Humidity:
Rate of change of temperature:
Air pressure:
Solar radiation:
Movement of surrounding air:
Condensation:
Precipitation:
Water from other sources than rain:
Formation of ice and frost:
2K2
Temperature:
Change of temperature air/air:
Relative humidity not combined
with rapid temperature changes:
Relative humidity combined
with rapid temperature changes:
Low air pressure:
5 °C to 40 °C
5 % to 85 % RH but max. 1 g/m³ to 25 g/m3 absolute
0.5 °C/min
70 kPA to 106 kPa
700 W/m2
1 m/s
No
No
No
No
−25 °C to 60 °C
±25 °C
max. 75 % (at 30 °C temperature)
No
70 kPa
10.03.2016
Zs.Gyimothy
Rev. 01
page 15
Change of air pressure:
Solar radiation:
Movement of surrounding air:
Precipitation:
Heat radiation:
Water from other sources than rain:
Wetness:
No
700 W/m2
No
No
No
No
No
10.1.2 Biological conditions
1B1
Flora and fauna:
Negligible
2B1
Flora and fauna:
No
10.1.3 Chemically active substances
1C1
Sea and road salts:
Sulphur dioxide:
Hydrogen sulphide:
Chlorine:
Hydrogen chloride:
Hydrogen fluoride:
Ammonia:
Ozone:
Nitrogen oxides:
No (Salt mist may be present in sheltered locations of coastal areas.)
0.1 mg/m3
0.01 mg/m3
0.01 mg/m3
0.01 mg/m3
0.003 mg/m3
0.3 mg/m3
0.01 mg/m3
0.1 mg/m3 (Expressed in equivalent values of Nitrogen dioxide.)
2C2
Sea salts:
Sulphur dioxide:
Hydrogen sulphide:
Nitrogen oxides:
Ozone:
Hydrogen chloride:
Hydrogen fluoride:
Ammonia:
none
0.1 mg/m3
0.01 mg/m3
0.1 mg/m3 (Expressed in the equivalent values of Nitrogen dioxide.)
0.01 mg/m3
0.1 mg/m3
0.003 mg/m3
0.3 mg/m3
10.1.4 Mechanically active substances
1S2
Sand:
Dust (suspension):
Dust (sedimentation):
30 mg/m3
0.2 mg/m3
1.5 mg/(m2h)
2S1
Sand in air:
Dust (sedimentation):
No
No
10.1.5 Mechanical Conditions
10.03.2016
Zs.Gyimothy
Rev. 01
page 16
1M2
Stationary vibration, sinusoidal
Please see section Error! Reference source not found..
Non stationary vibration, including shock
Shock response spectrum type L
peak acceleration:
40 m/s2
Static load: 5 kPa
2M2*
Stationary vibration sinusoidal
Please see section Error! Reference source not found..
Stationary vibration, random
Acceleration
spectral density:
1 m2/s3
Frequency range:
10 Hz to 200 Hz
and
Acceleration
spectral density:
0.3 m2/s3
Frequency range:
200 Hz to 2000 Hz
The later range can be neglected transporting with vehicles with high damping.
Non stationary vibration, including shock
Shock response spectrum type I.
peak acceleration:
100 m/s2
and
Shock response spectrum type II.
peak acceleration:
300 m/s2
*Free fall: weight and drop height deviate from 2M2
tested acc. to internal standard: F23047-A1004-S000-01-76
Drop Heights [mm]
Specimen Weight
[kg]
Standard Level
Extra Level
up to 9,5 kg
460
760
over 9,5 to 18,6 kg
310
610
over 18,6 to 27,7 kg
200
460
over 27,7 kg
200
310
Number of Drops
3
7
Toppling
Around any of the edges.
Rolling, pitching
Angle:
±35°
Period:
8s
35° may occur for short time periods but 22.5° may persist permanently.
Acceleration
20 m/s2
Static load:
10 kPa
11
Disclaimer
The information and recommendations in this document are based on standards and common
engineering practices. Customer specific applications and specifications may require additional
processes and tests that may supersede those recommended in this document.
10.03.2016
Zs.Gyimothy
Rev. 01
page 17