Handling Instructions for flow 90 packages This document is valid for all type of flow 90 0 & flow 90 1 modules: 0 & 2 clips versions with solder pins Date: 10.03.2016 Revision: Created by: Zs.Gyimothy Rev. 01 Proprietary data, company confidential. All rights reserved. Table of Contents 1 General assembly instructions ............................................................................. 5 2 Specification for PCBs......................................................................................... 5 2.1 Required holes on the PCB .................................................................................. 5 2.2 For modules with 2 clips ..................................................................................... 5 2.3 For modules without clips ................................................................................... 6 3 Specification for module backside surface ............................................................. 7 4 Specification for heat sinks ................................................................................. 9 5 Specification for thermal interface materials.......................................................... 9 5.1 OPTION 1: Thermal paste ................................................................................... 9 5.2 OPTION 2: Thermal foil ...................................................................................... 9 5.3 OPTION 3: Pre-applied thermal interface material .................................................10 6 Specification for fastening screws to the heat sink ................................................10 6.1 Screw with pre-assembled washers .....................................................................10 6.2 Mounting with automatic screwdriver ..................................................................10 7 Mounting modules in PCB ..................................................................................12 7.1 Module with 2 clips ...........................................................................................12 7.2 Modules without clips ........................................................................................13 8 Recommendation for soldering ...........................................................................14 8.1 Wave soldering of modules with solder pins .........................................................14 8.2 Hand soldering parameters ................................................................................14 9 ESD protection .................................................................................................15 10 Environmental conditions ...................................................................................15 10.1 Parameters of environment classes .....................................................................15 10.1.1 Climatic conditions ............................................................................................15 10.1.2 Biological conditions ..........................................................................................16 10.1.3 Chemically active substances .............................................................................16 10.1.4 Mechanically active substances ...........................................................................16 10.1.5 Mechanical Conditions .......................................................................................16 11 Disclaimer .......................................................................................................17 10.03.2016 Zs.Gyimothy Rev. 01 page 2 Table of Figures Figure 1:Scratch and etching hole dimensions ................................................................... 7 Figure 2: Polished surface............................................................................................... 8 Figure 3: Discoloration of substrate ................................................................................. 8 Figure 4: Fingerprint on the surface ................................................................................. 8 Figure 5: Recommended thermal foil dimensions ............................................................... 9 Figure 6: Recommended torque and speed curve ............................................................ 11 Figure 7: Plate through hole, good soldering ................................................................... 14 10.03.2016 Zs.Gyimothy Rev. 01 page 3 Revision History Date Revision Level Description 10.03.2016 01 Merge documents: Flow90_0-P-01-HI & Flow90_12CW-P-02-HI 10.03.2016 Zs.Gyimothy Page Number(s) Rev. 01 page 4 1 General assembly instructions The flow 90 type modules have to be mounted to a PCB. The electrical connections between module and the PCB are made by soldering. During assembly the pins are not to be drawn or pushed more than ±0.2 mm or loaded with a force greater than 35 N. The tension of the pin must not exceed ±5 N at a maximum substrate temperature of 100 °C. 2 Specification for PCBs Printed board material meets the requirements of IEC 61249-2-7. The maximum number of conductive layers is not limited. The module has to be fixed to the PCB by clipping it into the appropriate holes. The role of the clips is to hold the modules in the PCB at proper position before and during soldering process. For details see section 2.1 Required holes on the PCB. After clipping, all pins must be soldered into the PCB. The hole diameters on the PCB has to be designed according to the soldering pin diameter which is Ø1 mm ±0.05 mm. For further dimensions or 3D model please contact your local sales manager. 2.1 Required holes on the PCB The drawings below show the required PCB-cutouts defined for different PCB thicknesses, for modules with 2 clips and solder pins. 2.2 For modules with 2 clips flow 90 0 flow 90 1 10.03.2016 Zs.Gyimothy Rev. 01 page 5 2.3 For modules without clips flow 90 0 flow 90 1 To fix the module and hold the right angle between PCB and DCB another fixing solution is needed. Pinholes on the PCB need to be adjusted to the module pins. Pin diameter: Ø 1mm ±0.05 mm. 10.03.2016 Zs.Gyimothy Rev. 01 page 6 3 Specification for module backside surface The thermal properties are not affected if the dimensions of the surface imperfections are within the following values. Polishing is allowed on the whole nickel plated surface if copper doesn’t become visible. If copper becomes visible the unit is scratched and following acceptance criteria should be used. The depth and width of the scratch can’t exceed 200 μm and 800 μm, respectively. The length of the scratch does not matter but the total area of scratches must not exceed 5% of the total substrate surface. The diameter and depth of etching holes have to be below 1000 μm and 200 μm, respectively. Discolorations and fingerprints are only surface imperfections and do not affect the module’s functionality. Substrate surface imperfections can be seen on the figures below. Figure 1:Scratch and etching hole dimensions 10.03.2016 Zs.Gyimothy Rev. 01 page 7 Figure 2: Polished surface Figure 3: Discoloration of substrate Figure 4: Fingerprint on the surface 10.03.2016 Zs.Gyimothy Rev. 01 page 8 4 Specification for heat sinks The whole heat sink surface under the module must be plane, clean and free of particles. The flatness tolerance should be: < 25 µm. In case the thermal paste is thicker than 50 µm the flatness tolerance can be < 50 µm. (A flatness tolerance specifies a tolerance zone defined by two parallel planes within which the surface must lie.) The surface roughness should be less than: Rz < 10 µm. Heat sink surface imperfections should be within the values described for the module backside surface (please refer to section 3. Specification for module backside surface’). 5 Specification for thermal interface materials 5.1 OPTION 1: Thermal paste A. Apply a homogeneous layer of thermal conductive paste over the whole backside of the module, with a roller or spatula. B. Apply thermal paste in a honeycomb pattern. The preferred technology for paste application is screen printing. For a drawing of the pattern please contact your local sales representative. The recommended thermal paste thickness is 45 µm ±15 µm in both cases. Thermal paste thicker than recommended will increase thermal resistance (Rth). 5.2 OPTION 2: Thermal foil A thermal foil comprising of an aluminum core layer and two outer layers of phase change material should be used. The total thickness of the foil has to be less than 80 µm. Thicker foils could cause the ceramic substrate to break and will increase the thermal resistance. Recommended foil type: Kunze Folien KU-ALC5 or ALF5 Recommended foil dimensions: see Figure 5. Figure 5: Recommended thermal foil dimensions 10.03.2016 Zs.Gyimothy Rev. 01 page 9 Type a/mm b/mm c/mm d/mm r/mm flow 90 0 64 ± 0.15 55 ± 0.15 31.5 ± 0.15 4.5 ± 0.15 2 ± 0.15 flow 90 1 84 ± 0.15 73 ± 0.15 34.5 ± 0.15 4.5 ± 0.15 2 ± 0.15 5.3 OPTION 3: Pre-applied thermal interface material The modules may have already been pre-printed with thermal interface material. Further information about using modules with pre-applied TIM see the application note for “Power modules with Phase-Change Material” on Vincotech’s website 6 Specification for fastening screws to the heat sink Screws M4 (recommended screw type DIN 7984) Min. depth of the screw in the heat sink: 6 mm Flat washer ISO 7092 (DIN 433) - size of outer diameter Ø8 mm can be fitted into the module. Spring washer DIN127 or DIN 128 Mounting torque: 1.6 Nm < Ms < 2 Nm For modules with AlN DCB: tighten both screws with half torque first, and tighten both screws with max. torque afterwards 6.1 Screw with pre-assembled washers Screws with pre-assembled washers (SEMS or kombi screws) combine the screw and the washers into a single component. These screws eliminate the need to slip the washers into place by hand, boosting the speed and efficiency of the assembly process. The specification of these screws is provided below: Screw size M4 according to DIN 6900 (ISO 10644; JIS B1188) Flat washer according to DIN 6902 Type C (ISO 10673 Type S; JIS B1256) Size of outer diameter Ø8 mm can be fitted into the module. 6.2 Split lock spring washer according to DIN 6905 (JIS B1251) Mounting torque range: 1.6 Nm < Ms < 2 Nm Mounting with automatic screwdriver For a fast, reliable and repeatable screwing process an automatic screwdriver with two stage tightening method is recommended. The screwdriver starts fast in the first stage and slows down after the first target torque is reached to accurately tighten the screw to the final target. For torque and speed recommendations see below the curves (14. Figure) and values: Torque - Cycle start: First target: Final tq min.: Final target: Final tq max.: 0.3 Nm 0.5 Nm 1.6 Nm 1.8 Nm 2 Nm 10.03.2016 Zs.Gyimothy Rev. 01 page 10 Speed - Soft start speed: Step 1 speed: Step 2 speed: 96 rpm max. 650 rpm max. 12 rpm Figure 6: Recommended torque and speed curve 10.03.2016 Zs.Gyimothy Rev. 01 page 11 7 Mounting modules in PCB 7.1 Module with 2 clips 1. Insert the module pins to the PCB. Press the module into the PCB as shown on the figure below until the clips are locked 2. Module in place on PCB. The clips can ensure to hold the right angle between substrate and PCB during wave soldering process 3. Load is not allowed on the module before the end of the soldering. 10.03.2016 Zs.Gyimothy Rev. 01 page 12 7.2 Modules without clips 1. Insert the module pins into the PCB, and push the module till it’s bottom surface rests on the PCB. 2. Module has to be fixed by tool in order to hold the right angle position between the substrate and the PCB during the soldering process. 3. Load is not allowed on the module before the end of the soldering. 10.03.2016 Zs.Gyimothy Rev. 01 page 13 8 Recommendation for soldering Figure 7: Plate through hole, good soldering Plated through holes should exhibit a vertical solder fill of 75 %, with a fully formed fillet on the solder side and evidence of 75 % wetting on the component side lead, barrel and pad. 8.1 Wave soldering of modules with solder pins T T3 T2 T1 t1 t2 t3 t4 t 8.2 Hand soldering parameters Max. solder iron temperature: 350 °C Max. contact time with component lead: 10 s Number of heat cycles: 3 10.03.2016 Zs.Gyimothy Rev. 01 page 14 9 ESD protection Modules are sensitive to electrostatic discharge which can damage or destroy sensitive semiconductors. All modules are ESD protected in the shipment box by semi conductive plastic trays. During the handling and assembly of the modules it is recommended to wear a conductive grounded wrist band and ensure a conductive grounded working place. Please take into consideration the following standards for handling electrostatic-sensitive devices: EN61340-5-1, ANSI S20.20 10 Environmental conditions The modules can be subjected to environmental conditions characterized by the following classes: Storage: 1K2 / 1B1 / 1C1 / 1S2 / 1M2 Transportation: 2K2 / 2B1 / 2C1 / 2S1 / 2M2 These classes are defined in the IEC 60721-3-1 and IEC 60721-3-2 standards. The modules with wire pins have 1 year shelf life with the given storage conditions. Flammability classification of the plastic material for flow 90 packages are V-0 and 5-VA (selfextinguishing, no dripping of flaming particles) according to UL 94, IEC 60695-11-10 and IEC 60695-11-20 test methods. 10.1 Parameters of environment classes The parameters detailed below are for informative purposes only. This section does not substitute the above mentioned standards. Please read the IEC 60721-3-1 and IEC 60721-3-2 standards for the description of the environment classes. 10.1.1 Climatic conditions 1K2 Air temperature: Humidity: Rate of change of temperature: Air pressure: Solar radiation: Movement of surrounding air: Condensation: Precipitation: Water from other sources than rain: Formation of ice and frost: 2K2 Temperature: Change of temperature air/air: Relative humidity not combined with rapid temperature changes: Relative humidity combined with rapid temperature changes: Low air pressure: 5 °C to 40 °C 5 % to 85 % RH but max. 1 g/m³ to 25 g/m3 absolute 0.5 °C/min 70 kPA to 106 kPa 700 W/m2 1 m/s No No No No −25 °C to 60 °C ±25 °C max. 75 % (at 30 °C temperature) No 70 kPa 10.03.2016 Zs.Gyimothy Rev. 01 page 15 Change of air pressure: Solar radiation: Movement of surrounding air: Precipitation: Heat radiation: Water from other sources than rain: Wetness: No 700 W/m2 No No No No No 10.1.2 Biological conditions 1B1 Flora and fauna: Negligible 2B1 Flora and fauna: No 10.1.3 Chemically active substances 1C1 Sea and road salts: Sulphur dioxide: Hydrogen sulphide: Chlorine: Hydrogen chloride: Hydrogen fluoride: Ammonia: Ozone: Nitrogen oxides: No (Salt mist may be present in sheltered locations of coastal areas.) 0.1 mg/m3 0.01 mg/m3 0.01 mg/m3 0.01 mg/m3 0.003 mg/m3 0.3 mg/m3 0.01 mg/m3 0.1 mg/m3 (Expressed in equivalent values of Nitrogen dioxide.) 2C2 Sea salts: Sulphur dioxide: Hydrogen sulphide: Nitrogen oxides: Ozone: Hydrogen chloride: Hydrogen fluoride: Ammonia: none 0.1 mg/m3 0.01 mg/m3 0.1 mg/m3 (Expressed in the equivalent values of Nitrogen dioxide.) 0.01 mg/m3 0.1 mg/m3 0.003 mg/m3 0.3 mg/m3 10.1.4 Mechanically active substances 1S2 Sand: Dust (suspension): Dust (sedimentation): 30 mg/m3 0.2 mg/m3 1.5 mg/(m2h) 2S1 Sand in air: Dust (sedimentation): No No 10.1.5 Mechanical Conditions 10.03.2016 Zs.Gyimothy Rev. 01 page 16 1M2 Stationary vibration, sinusoidal Please see section Error! Reference source not found.. Non stationary vibration, including shock Shock response spectrum type L peak acceleration: 40 m/s2 Static load: 5 kPa 2M2* Stationary vibration sinusoidal Please see section Error! Reference source not found.. Stationary vibration, random Acceleration spectral density: 1 m2/s3 Frequency range: 10 Hz to 200 Hz and Acceleration spectral density: 0.3 m2/s3 Frequency range: 200 Hz to 2000 Hz The later range can be neglected transporting with vehicles with high damping. Non stationary vibration, including shock Shock response spectrum type I. peak acceleration: 100 m/s2 and Shock response spectrum type II. peak acceleration: 300 m/s2 *Free fall: weight and drop height deviate from 2M2 tested acc. to internal standard: F23047-A1004-S000-01-76 Drop Heights [mm] Specimen Weight [kg] Standard Level Extra Level up to 9,5 kg 460 760 over 9,5 to 18,6 kg 310 610 over 18,6 to 27,7 kg 200 460 over 27,7 kg 200 310 Number of Drops 3 7 Toppling Around any of the edges. Rolling, pitching Angle: ±35° Period: 8s 35° may occur for short time periods but 22.5° may persist permanently. Acceleration 20 m/s2 Static load: 10 kPa 11 Disclaimer The information and recommendations in this document are based on standards and common engineering practices. Customer specific applications and specifications may require additional processes and tests that may supersede those recommended in this document. 10.03.2016 Zs.Gyimothy Rev. 01 page 17