handling instruction

Handling Instructions
for flow 1B packages
This document is valid for all type of flow 1B modules:
12 mm & 17 mm housing, with solder & Press-fit pins
Date:
29.02.2016
Rev ision:
Created by:
Zs. Gy imóthy
Rev. 02
Proprietary data, company confidential. All rights reserved.
Table of Contents
1
General assembly instructions........................................................................... 6
2
Specification for PCBs ...................................................................................... 7
2.1
Specification for modules with Press-fit pins ........................................................ 7
2.2
Specification for modules with solder pins ........................................................... 8
2.3
Specification for modules with Press-fit pins that are soldered to the PCB ................. 8
3
Specification for module backside surface (for DCB substrated module only) ............. 9
4
Specification for heat sink .............................................................................. 10
5
Specification for thermal interface materials ...................................................... 10
5.1
OPTION 1: Thermal paste: ............................................................................. 10
5.2
OPTION 2: Thermal foil: ................................................................................ 10
5.3
OPTION 3: Pre-applied thermal interface material .............................................. 11
6
Specification for fastening screws to the heat sink .............................................. 12
6.1
Screw with pre-assembled washers .................................................................. 12
6.2
Mounting with automatic screwdriver ............................................................... 13
7
Mounting options of modules with Press-fit pins ................................................. 14
8
Press-in process of modules with Press-fit pins .................................................. 14
8.1
Press-in construction ..................................................................................... 14
8.1.1
Press-in tool reference design ......................................................................... 15
8.1.1.1
Modules without thermal interface material ...................................................... 15
8.1.1.2
Modules with thermal interface material .......................................................... 16
8.1.2
Supporting tool ............................................................................................ 17
8.2
Press-in process parameters ........................................................................... 18
8.2.1
Basic requirements for the press-in process....................................................... 18
8.3
Process control parameters ............................................................................ 19
9
Press-out process for modules w ith Press-fit pins ............................................... 21
9.1
Press out tool............................................................................................... 22
9.2
Press-out process characteristics ..................................................................... 23
9.2.1
Press-out process parameters ......................................................................... 24
9.3
Disassembling by hand .................................................................................. 24
10
Mounting options of modules with solder pins .................................................... 25
10.1
Using screws to fix the module to the PCB......................................................... 25
10.2
Using soldering jig (without using screws) ......................................................... 25
11
Recommendation for soldering ........................................................................ 26
11.1
Wave soldering of modules w ith solder pins ....................................................... 26
11.2
Hand soldering parameters ............................................................................. 26
12
ESD protection ............................................................................................. 27
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Table of Contents
13
Storage and transportation conditions .............................................................. 27
13.1
Climatic conditions ........................................................................................ 27
13.2
Biological conditions ...................................................................................... 28
13.3
Chemically active substances .......................................................................... 28
13.4
Mechanically active substances ....................................................................... 28
13.5
Mechanical Conditions ................................................................................... 28
14
Disclaimer ................................................................................................... 29
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Table of Figures
1. Figure: Module with PCB and heat sink .......................................................................6
2. Figure: Chemical tin plating (for illustration only, no real proportions) .............................7
3. Figure: HAL tin plating (for illustration only, no real proportions) ....................................7
4. Figure: Solder pin diameter ......................................................................................8
5. Figure: Scratch and etching hole dimensions ...............................................................9
6. Figure (Left to right): Polished surface; Discoloration of substrate; Fingerprint on the surface
..............................................................................................................................9
7. Figure: Thermal paste honeycomb pattern ................................................................ 10
8. Figure: Recommended thermal foil dimensions .......................................................... 11
9. Figure: Recommended torque and speed curve .......................................................... 13
10. Figure: Recommended construction for the press-in process....................................... 14
11. Figure: Press-in tools closed, module is pressed in .................................................... 15
12. Figure: press-in tool for modules without thermal interface material ............................ 16
13. Figure: Recommended press-in tool for modules with thermal interface material............ 17
14. Figure: The recommended hole and cutout dimensions for supporting tool .................... 18
15. Figure: Press-in depth in PCB................................................................................ 19
16. Figure: Typical press-in diagram of a 33 pin module ................................................. 20
17. Figure: Exploded view of the press-out tool ............................................................. 21
18. Figure: Working position of the press-out tool.......................................................... 21
19. Figure: Recommended dimensions of the upper tool ................................................. 22
20. Figure: Recommended dimensions of the lower tool .................................................. 23
21. Figure: Force-path diagram of the press-out process................................................. 24
22. Figure: Cutting edge ........................................................................................... 24
24. Figure: Plated through hole, good soldering ............................................................. 26
25. Figure: Typical prof ile for wave soldering ................................................................ 26
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Revision History
Rev ision
Level
Description
12.02.2016
02
Update in chapter: 1; 2.1; 5.3; 6.2; 7; 8.1; 8.1.1.2; 8.1.2;
8.3; 10; 10.1; 10.2; 10.3; 11; 12; 13.5;
01.06.2015
01
New document
Date
29.02.2016
Page
Numbe r(s)
Zs. Gyimóthy
6, 7, 11, 13, 14,
16-19, 25-28
Rev. 02
page 5
1
General assembly instructions
The flow 1B type modules have to be mounted to a PCB. The electrical connections between
module and the PCB can be made by soldering or by using Press-fit technology. In applications
where the module is attached to a heat sink, the PCB must also be attached to this heat sink.
Figure 1 shows how this attachment can be achieved with threaded spacers.
PCB
Module
Module backside
Heat sink
1. Figure: Module with PCB and heat sink
The distance between the top surface of the heat sink and the bottom plane of the PCB is 12
mm or 17 mm, defined by the module type. PCB spacers can be used to obtain the correct
spacing. The number and the position of the fixing points depend on the design of the circuit,
the location of different masses like capacitors or inductors and the environment of the
system. General recommendation cannot be given. For recommended heights of these spacers
see the sections of mounting options (7, 10).
Typical (recommended) assembly sequence:
1. Attach module to the PCB
2. Position and fix the assembled PCB with spacers to the heat sink
3. Fix the module to the heat sink
During assembly process, a single pin is not allowed to be drawn or pushed more than
±0.2 mm or load w ith a force greater than 35 N (except during pressing-in of Press-fit pins).
The special design of the Press-fit pins prevents higher than 0.1 mm deformation of pins
during the pressing-in process.
The tension of the pin must not exceed ±5 N at a maximu m substrate temperature of 100 °C.
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2
Specification for PCBs


2.1




Printed board material meets the requirements of IEC 61249-2-7;
The number of conductive layers is not limited.
Specification for modules with Press-fit pins
Printed board thickness must not be less than 1.6 mm (thinner PCBs require additional
testing and w ill be performed upon request).
PCB should be covered with solder mask on both sides.
Plated through-hole specifications for Press-fit pin:
o Hole diameter before plating: 1.6 mm ± 0.025 mm
o Thickness of the PTH wall > 25 μm Cu
o Plated hole final dimension: 1.45 mm +0.09 mm / -0.06 mm
o Minimum Cu width of the annular ring > 0.1 mm
o Through hole position accuracy ±0.1 mm
Plating material:
o
for chemical tin plating (Sn): 0.5 μm to 10 μm
The PCB can be disassembled and reused 2 more times.
2. Figure: C hemical tin plating (for illustration only, no real proportions)
o
for HAL tin plating (Sn): 0.5 μm to 50 μm
The PCB can be disassembled and reused 2 more times.
3. Figure: HAL tin plating (for illustration only, no real proportions)



o Au: not generally released; individual release of PCB system required
Minimum distance between the edge of the PCB and the centre of the pin hole: 4 mm
Minimum distance between the centre of the pin hole and the component on the PCB:
4 mm
For any other requirements IEC 60352-5 standard should be considered
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2.2


Specification for modules with solder pins
The module must be attached to the PCB with 4 screws
After screwing the module to the PCB, all pins must be soldered. The hole diameters on
the PCB have to be designed according to the soldering pin diameter which is
Ø 1 mm ±0.05 mm.
For further dimensions or a 3D model please contact your local sales manager.
4. Figure: Solder pin diameter
2.3
Specification for modules with Press-fit pins that are soldered to
the PCB
In cases where the Press-fit pins are soldered instead of pressed into the PCB the
recommended PCB hole diameter is 1.85 mm ± 0.1 mm. In these cases, that the annular ring
must be designed according to the standards for through hole components to ensure proper
soldering of the Press-fit pins.
Please read section ‎11. Recommendation for soldering also.
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3
Specification for module backside surface (for DCB
substrated module only)
The thermal properties are not affected if the dimensions of the surface imperfections are
within the following values.



Polishing is allowed on the whole nickel plated surface if copper doesn’t become visible.
If copper becomes visible, the unit is scratched and the follow ing acceptance critera
should be used. The depth and width of the scratch can’t exceed 200 μm and 800 μm,
respectively. The length of the scratch does not matter but the total area of scratches
must not exceed 5 % of the total substrate surface.
The diameter and depth of etching holes have to be below 1000 μm and 200 μm,
respectively.
Discolorations and f ingerprints are only surface imperfections and do not affect the module's
functionality.
Substrate surface imperfections can be seen on the figures below.
5. Figure: Scratch and etching hole dimensions
6. Figure (Left to right): Polished surface; Discoloration of substrate; Fingerprint on the surface
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4
Specification for heat sink
The whole heat sink surface under the module must be plane, clean and free of particles.




The flatness tolerance should be: < 25 µm in general.
In case the thermal paste thicker than 50 µm the flatness tolerance can be < 50 µm.
(A flatness tolerance specifies a tolerance zone defined by two parallel planes w ithin
which the surface must lie.)
The surface roughness should be less than: Rz < 10 µm.
Heat sink surface imperfections should be within the values described for the module
backside surface (please refer to section ‎3).
5
Specification for thermal interface materials
5.1
OPTION 1: Thermal paste:
A. Apply a homogeneous layer of thermal conductive paste over the whole backside of the
module, w ith a roller or spatula. The recommended thermal paste thickness is
45 µm ± 15 µm in this case.
B. Apply thermal paste in a honeycomb pattern, seen on 7. Figure:. The preferred
technology for paste application is screen printing. For a draw ing of the pattern please
contact your local sales representative.
7. Figure: Thermal paste honeycomb pattern
Thermal paste thicker than recommended will increase thermal resistance ( Rth).
5.2




OPTION 2: Thermal foil:
A thermal foil comprising of an aluminium core layer and two outer layers of phase
change material should be used.
The total thickness of the foil has to be less than 80 µm. Thicker foils could cause the
ceramic substrate to break and increase the thermal resistance.
Recommended foil type is Kunze Folien KU-ALC5 or ALF5:
Recommended foil dimensions: see 7. Figure: on next page.
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Type
a/mm
b/mm
c/mm
d/mm
r/mm
t/µm
flow 1B
72 ± 0.15
61 ± 0.15
36 ± 0.15
4.5 ± 0.15
2 ± 0.15
< 80
8. Figure: Recommended thermal foil dimensions
5.3
OPTION 3: Pre-applied thermal interface material
The modules may have already been pre-printed with thermal interface material.
 For modules w ith Press-fit pins a unique press-in tool (see section Error! Refe rence
source not found.) has to be used or the module has to be mounted first to the heat
sink and then pressed into the PCB.
 Further information about using modules with pre-applied TIM see the application note
for “Power modules with Phase-Change Material” on Vincotech’s website
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6
Specification for fastening screws to the heat sink






Screws M4 (recommended screw type DIN 7984)
Min. length of the screw in the heat sink: 6 mm
Flat washer ISO 7092 (DIN 433)
Spring washer DIN127 or DIN 128
Mounting torque: 1.6 Nm < Ms < 2 Nm
For modules with AlN DCB: tighten both screws with half torque first, and then tighten
both screws with max. torque afterwards
A torque wrench shall be used to tighten the mounting screws at the specified torque as
excessive torque may result in damage or degradation of the device. The inaccuracy of torque
wrench tightening method can range up to ±12 %. This has to be taken into account to
prevent over-tightening the fastener.
Due to excessive temperature f luctuations washers should be used to prevent the loosening of
the screws. After accurate tightening of the screws the spring washer exerts a constant force
on the joint. The flat washer distributes this force on the plastic surface.
6.1
Screw with pre-assembled washers
Screws with pre-assembled washers (SEMS or kombi screws) combine the screw and the
washers into a single component. These screws eliminate the need to slip the washers into
place by hand, boosting the speed and efficiency of the assemb ly process. The specifications of
these screws are provided below:




Screw size M4 according to DIN 6900 (ISO 10644; JIS B1188)
Flat washer according to DIN 6902 Type C (ISO 10673 Type S; JIS B1256)
Split lock spring washer according to DIN 6905 (JIS B1251)
Mounting torque range: 1.6 Nm < Ms < 2 Nm
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6.2
Mounting with automatic screwdriver
For a fast, reliable and repeatable screwing process an automatic screwdriver with two stage
tightening method is recommended. The screwdriver starts fast in the first stage and slows
down after the first target torque is reached to accurately tighten the screw to the final target.
For torque and speed recommen dations see below the curves (9. Figure) and values:
Torque
-
Cycle start:
First target:
Final tq min.:
Final target:
Final tq max.:
0.3 Nm
0.5 Nm
1.6 Nm
1.8 Nm
2 Nm
Soft start speed:
Step 1 speed:
Step 2 speed:
96 rpm
max. 650 rpm
max. 12 rpm
Speed
-
9. Figure: Recommended torque and speed curve
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7
Mounting options of modules with Press-fit pins
In the case of modules with Press-fit pins, is not recommended to screw the modules to the
PCB through the towers.
The recommended height of the spacers for fixing the PCB to the heatsink is:


In case of 12 mm type and Thick Film substrate modules: 11.5- 0 .1 mm.
In case of 17 mm type and Thick Film substrate modules: 16.5 - 0 .1 mm
8
Press-in process of modules with Press-fit pins
8.1
Press-in construction
10. Figure: Recommended construction for the press-in process
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11. Figure: Press-in tools closed, module is pressed in





The module can be pressed into the PCB from the top (as 10. Figure: shows) or the PCB
can be pressed onto the module from the top (the module is below the PCB).
The preferred method is to press the module into the PCB from the top. This method
will be discussed in this document.
Pressing multiple modules into one PCB can be done one by one (subsequently) or all at
once.
Pressing multiple modules at the same time requires a press -in tool according to the
above detailed single tool. The tool has to ensure the correct leveling of the modules
and PCB to avoid mechanical stress.
The “U-shape” tool (Error! Re ference source not found.) is only because to keep the
distance between the PCB and the module. Depending on the PCB layout the geometry
and the position of this distance keeper can be different. Minimu m distance between
tool and the components on the PCB: 4 mm
8.1.1 Press-in tool reference design
8.1.1.1
Modules without thermal interface material
Requirements for the press-in tool:


Tool steel grade 21 MnCr 5 w ith yield strength of 660 MPa and hardness of 330 HB or
better.
Maintenance: Due to inherent contamination f rom process and product tolerance
differences, it is recommended to clean the press-in tool regularly.
The dimension marked w ith ‘x’ on the draw ing (12. Figure:):


In case of 12 mm type and Thick Film substrate modules: 11.5 +0 .05 mm
In case of 17 mm type and Thick Film substrate modules: 16.5+0 .05 mm
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For a 3D model please contact your local sales manager.
12. Figure: press-in tool for modules without thermal interface material
8.1.1.2
Modules with thermal interface material
A unique press-in top tool shown in Figure 16 is needed to prevent significant damage to the
phase change material during the press-in process. Small damages (max: Ø 0.6 mm) are
allowed.
Requirements for the press-in tool:


Tool steel grade 21 MnCr 5 w ith yield strength of 660 MPa and hardness of 330 HB or
better.
Maintenance: Due to inherent contamination from process and product tolerance
differences, it is recommended to clean the press-in tool regularly. The desired cleaning
interval is once every 100 modules w ith soft wipes soaked in Isopropyl alcohol.
The dimension marked w ith ‘x’ on the draw ing (13. Figure:):


In case of 12 mm type and Thick Film substrate modules: 11.5 +0 .05 mm
In case of 17 mm type and Thick Film substrate modules: 16.5 +0 .05 mm
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For a 3D model please contact your local sales manager.
13. Figure: Recommended press-in tool for modules with thermal interface material
8.1.2 Supporting tool





The supporting tool supports the PCB during the press-in process. The size and position
of the holes and cut-outs depends on the components on the PCB.
14. Figure: shows the recommended hole and cut -out dimensions for the Press-fit pins.
The recommended diameter of the holes / cut-outs for the pins in the supporting tool is
between 1.7 mm and 4 mm (depending on the positioning accuracy). The minimal
supporting place around the hole is 2 mm (the min. distance of PCB components from
the PCB pinhole should be also considered here). If the pins are close to each other
then it is possible to make a lengthwise cut -out for more pins as well. It is necessary to
position the PCB and the module as well. The depth of the cut-outs for the pins is
6 mm.
The module can be positioned with pins from the bottom tool through the fixing holes of
the modules.
Material of the supporting tool: POM (Polyoxymethylene) ESD proof or any metal allo y.
The thickness of the supporting tool has to be at least 20 mm.
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14. Figure: The recommended hole and cutout dimensions for supporting tool
8.2
Press-in process parameters

Press-in force: 70 N/pin to 160 N/pin

Press-in speed: 5 mm/s to 10 mm/s
The total press-in force depends on the number of the pins, the hole-diameter and the plating
(type/quality) of the PCB.
8.2.1 Basic requirements for the press-in process
The Press-fit pins have to be pressed to the correct depth into the holes of the PCB. The center
of the Press-fit pin head has to be at least 0.5 mm below the top surface and at least 0.5 mm
above the bottom surface of the PCB. (15. Figure:).
This condition is automatically fulf illed w ith the use of the recommended press -in tool. Error!
Re fere nce source not found. shows the closed press-in tool w ith the module. If a position
controlled press-in process is implemented care has to be taken to ensure the same conditions
are reached.
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15. Figure: Press-in depth in PCB
8.3
Process control parameters
If the press machine is equipped with the possibility to record the force-stroke values during
the process, the following quality relevant values should be taken into consideration. 16.
Figure: shows a normal press-in diagram.
Three different sections can be seen on the diagram:



First raising section (blue): The heads of the Press-fit pins slide into the holes and
deform to fit in the holes. This section ends with a local maximum.
Second section (green): The pin slides in the holes to reach the final position. The
centre of the pin heads are inside the holes and do not deform any longer. This section
ends with a local minimum.
Second raising section (red): press-in tool touches the PCB and the sliding of the pins is
stopped. The press-in tool starts to bend the PCB.
The pressing-in has to be stopped at the beginning of the second raising section, not
exceeding the actual max force of the first rising section, to avoid damaging the PCB or the
deformation of the plastic housing. The press-in force or the motion stroke of the tool has to
be controlled to stop at the beginning of the second raising section.
Possible process control parameter settings are as follows:

The local maximum value (end of blue section) of the force-stroke diagram has to be:
o higher than 70 N x number of the pins,
o smaller than 160 N x number of the pins.
These limits are marked on the diagram. If the press-in force does not fit in the interval
defined above, it can indicate faulty plating, or improper diameter of the holes.
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5000
4000
Force (N)
3000
2000
1000
0
231,5
232
232,5
233
233,5
Stroke (mm)
234
234,5
235
16. Figure: Typical press-in diagram of a 33 pin module
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9
Press-out process for modules with Press-fit pins
Please note: In the case an out -pressed module should be used again, it is necessary to solder
the module to the PCB because of the remaining deformation of the pins. This is because the
Press-fit zone will keep a remaining deformation after the press-out process. An additional
press-in cycle will result in low holding forces between the Press-fit pin and the PCB hole.
Additional information for the annular ring can be found in section ‎2.3
17. Figure: Exploded view of the press-out tool
18. Figure: Working position of the press-out tool
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9.1
Press out tool
The specific tool to disassemble the modules from the PCBs has two parts, similar to the press in tool. The lower part serves as a backing for the PCB. It has a backing nest and supporting
pins. It is important that the backing has to be as close as poss ible to the side of the modules.
The supporting pins are in line with the fixing pins of the upper part. There may be
components mounted to the PCB in the area of the backing. It is possible to cut out the nest in
this case.
The upper part consists of two pressing plates that are connected by springs. The pins on the
lower plate serve to fix the PCB. With the aid of these parts, the bending of the PCB can be
prevented during pressing.
The ram fastened to the upper plate is designed according to the positions of the parts on the
PCB and the layout of the pins.
It is not possible to press the module out with a flat plate if the PCB is thicker than 2.5 mm,
due to the overhang of the pins. In this case, pressing sticks positioned according to the pin
layout are necessary.

Recommended spring force: 25 N/mm

Recommended number of springs: 4 Pieces
19. Figure: Recommended dimensions of the upper tool
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20. Figure: Recommended dimensions of the lower tool
9.2
Press-out process characteristics
After inserting the module into the nest, the downward moving press f ixes the PCB with the
lower plate through the springs. The pins are pressed through by the onward moving pressing
ram.
21. F igure: shows a typical force-distance diagram of the press-out process for a 33 pin
module. It is typical for this curve that a characteristic peak appears w hich indicates the
breaking of the cold welded connection.
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press-in
2500
Pins slide out
Connections brake
Force (N)
2000
1500
Compression of the springs of the
tool starts
1000
500
0
205
206
207
208
209
210
211
Stroke (mm)
21. Figure: Force-path diagram of the press-out process
9.2.1 Press-out process parameters


9.3
Press-out force: minimum 40 N/pin
Press-out speed: 2 mm/s to 5 mm/s
Disassembling by hand
If the Press-fit pin-head is overlapped by the PCB in such a way that the spring-end is out of
the PCB, the disassembling is possible w ith hand pliers. The cutting should be done in a way
that the cutting edge is under the area where the two parts of the pin head join shown as level
‘A-A’ in 22. Figure:. After cutting away all of the pin-heads, it is possible to remove the module
from the PCB.
22. Figure: Cutting edge
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10
Mounting options of modules with solder pins
For minimum overhang of the pins IPC-A-610E standard and the module datasheet drawing
should be considered
10.1
Using screws to fix the module to the PCB

Insert the module pins into the PCB

Fix the module to the PCB with 4 screws by the towers before soldering (for screws
min. ø2.8 mm hole is needed on PCB). Screw type: BN82428, D = 2.5 mm and
L = 6 mm w ith a mounting torque: 0.4 Nm.
Recommendation for spacer height:
o In case of 17 mm type and DCB substrated module: 16.9- 0 .1 mm.
o In case of 12 mm type and Thick Film substrated modules: 11.2- 0 .1 mm.
o In case of 17 mm type and Thick Film substrated modules: 16.8- 0 .1 mm

23. Figure: Assembly illustration
10.2



Using soldering jig (without using screws)
Insert the module pins into the PCB
Fix the module to the PCB with soldering jig before soldering
The height of the spacers depend on the distance between the soldering jig and PCB
thickness.
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11
Recommendation for soldering
24. Figure: Plated through hole, good soldering
Plated through holes should exhibit a vertical solder fill of 75 %, with a fully formed f illet on
the solder side and evidence of 75 % wetting on the component side lead, barrel and pad.
11.1
Wave soldering of modules with solder pins
T
T3
T2
T1
t1
t2 t3 t4
t
25. Figure: Typical profile for wave soldering
Soldering of certain modules w ith Press-fit pins is also possible using the wave soldering
process. Wave soldering cannot be performed on all type of Press-fit modules.
11.2



Hand soldering parameters
Max. solder iron temperature:
Max. contact time with component lead:
Number of heat cycles:
350 °C
10 s
3
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12
ESD protection
Modules are sensitive to electrostatic discharge which can damage or destroy sensitive
semiconductors. All modules are ESD protected in the shipment box by semi conductive plastic
trays. During the handling and assembly of the modules it is recommended to wear a
conductive grounded wrist band and ensure a conductive grounded working place.
Please take into consideration the following standards for handling electrostatic -sensitive
devices: EN61340-5-1, ANSI S20.20
13
Storage and transportation conditions
The modules can be subjected to environmental conditions characterized by the follo wing
classes:
Storage:
1K2 / 1B1 / 1C1 / 1S2 / 1M2
Transportation:
2K2 / 2B1 / 2C1 / 2S1 / 2M2*
These classes are defined in the IEC 60721-3-1 and IEC 60721-3-2 standards. The parameters
detailed below are for informative purposes only. This section does not substitute the above
mentioned standards. The modules with wire pins have 1 year shelf life and the modules with
Press-fit pins have 2 years shelf life with the given storage conditions.
Flammability classification of the plastic material for flow 1B are V-0 and 5-VA (selfextinguishing, no dripping of flaming particles) according to UL 94, IEC 60695-11-10 and
IEC 60695-11-20 test methods.
13.1
Climatic conditions
1K2
Air temperature:
Humidity:
Rate of change of temperature:
Air pressure:
Solar radiation:
Movement of surrounding air:
Condensation:
Precipitation:
Water from other sources than rain:
Formation of ice and frost:
5 °C to 40 °C
5 % to 85 % RH but max. 1 g/m3 to 25 g/m3 absolute
0.5 °C/min
70 kPa to 106 kPa
700 W/m2
1 m/s
No
No
No
No
2K2
Temperature:
Change of temperature air/air:
Relative humidity not combined
with rapid temperature changes:
Relative humidity combined
with rapid temperature changes:
Low air pressure:
Change of air pressure:
Solar radiation:
Movement of surrounding air:
Precipitation:
−25 °C to 60 °C
±25 °C
max. 75 % (at 30 °C temperature)
No
70 kPa
No
700 W/m2
No
No
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Heat radiation:
Water from other sources than rain:
Wetness:
13.2
No
No
No
Biological conditions
1B1
Flora and fauna:
Negligible
2B1
Flora and fauna:
13.3
No
Chemically active substances
1C1
Sea and road salts:
Sulphur dioxide:
Hydrogen sulphide:
Chlorine:
Hydrogen chloride:
Hydrogen fluoride:
Ammonia:
Ozone:
Nitrogen oxides:
No (Salt mist may be present in sheltered locations of coastal areas.)
0.1 mg/m3
0.01 mg/m3
0.01 mg/m3
0.01 mg/m3
0.003 mg/m3
0.3 mg/m3
0.01 mg/m3
0.1 mg/m3 (Expressed in equivalent values of Nitrogen dioxide.)
2C2
Sea salts:
Sulphur dioxide:
Hydrogen sulphide:
Nitrogen oxides:
Ozone:
Hydrogen chloride:
Hydrogen fluoride:
Ammonia:
13.4
none
0.1 mg/m3
0.01 mg/m3
0.1 mg/m3 (Expressed in the equivalent values of Nitrogen dioxide.)
0.01 mg/m3
0.1 mg/m3
0.003 mg/m3
0.3 mg/m3
Mechanically active substances
1S2
Sand:
Dust (suspension):
Dust (sedimentation):
30 mg/m3
0.2 mg/m3
1.5 mg/(m2 h)
2S1
Sand in air:
Dust (sedimentation):
13.5
No
No
Mechanical Conditions
1M2
Stationary vibration, sinusoidal
Please see section Error! Re fere nce source not found..
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Non stationary vibration, including shock
Shock response spectrum type L
peak acceleration:
40 m/s2
Static load: 5 kPa
2M2*
Stationary vibration sinusoidal
Please see section Error! Re fere nce source not found..
Stationary vibration, random
Acceleration
spectral density:
1 m2 /s3
Frequency range:
10 Hz to 200 Hz
and
Acceleration
spectral density:
0.3 m2 /s3
Frequency range:
200 Hz to 2000 Hz
The later range can be neglected transporting w ith vehicles with high damping.
Non stationary vibration, including shock
Shock response spectrum type I.
peak acceleration:
100 m/s2
and
Shock response spectrum type II.
peak acceleration:
300 m/s2
*Free fall: weight and drop height deviate from 2M2
tested acc. to internal standard: F23047-A1004-S000-01-76
Specimen Weight
[kg]
up to 9,5 kg
over 9,5 to 18,6 kg
over 18, 6 to 27,7 kg
over 27, 7 kg
Number of Drops
Drop Heights [mm]
Standard Level
Extra Level
460
760
310
610
200
460
200
310
3
7
Toppling: Around any of the edges.
Rolling, pitching
Angle:
±35°
Period:
8s
35° may occur for short time periods but 22.5° may persist permanently.
Acceleration:
Static load:
14
20 m/s2
10 kPa
Disclaimer
The information and recommendations in this document are based on standards and common
engineering practices. Customer specific applications and specifications may require additional
processes and tests than may differ of supersede those recommended in this document.
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