handling instruction

Handling Instructions
for flow 0B packages
This document is valid for all type of flow 0B modules
with solder pins
Date:
05.06.2015
Revision:
Created by:
Zs. Gyimóthy
Rev. 03
Proprietary data, company confidential. All rights reserved.
Table of Contents
1
General assembly instructions ............................................................................. 5
2
Specification for PCBs......................................................................................... 6
2.1
Specification for modules with solder pins ............................................................. 6
2.2
Required PCB cutouts for screwing holes .............................................................. 7
3
Specification for module backside surface ............................................................. 8
4
Specification for heat sink ................................................................................... 9
5
Specification for thermal interface materials.........................................................10
5.1
OPTION 1: Thermal paste: .................................................................................10
5.2
OPTION 2: Thermal foil: ....................................................................................10
5.3
OPTION 3: Pre-applied thermal interface material .................................................11
6
Specification for fastening screws to the heat sink ................................................11
6.1
Screw with pre-assembled washers .....................................................................11
7
Recommendation for soldering ...........................................................................12
7.1
Wave soldering of modules with solder pins .........................................................12
7.2
Hand soldering parameters ................................................................................12
8
ESD protection .................................................................................................13
9
Environmental conditions ...................................................................................13
9.1
Vibration resistance ..........................................................................................13
9.2
Parameters of environment classes .....................................................................13
9.2.1
Climatic conditions ............................................................................................13
9.2.2
Biological conditions ..........................................................................................14
9.2.3
Chemically active substances .............................................................................14
9.2.4
Mechanically active substances ...........................................................................15
9.2.5
Mechanical Conditions .......................................................................................15
10
Disclaimer .......................................................................................................16
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Table of Figures
1. Figure: Module with PCB and heat sink ......................................................................... 5
2. Figure: Solder pin diameter......................................................................................... 6
3. Figure: PCB cutouts for two-clip modules with solder pins ............................................... 7
4. Figure: Scratch and etching hole dimensions ................................................................. 8
5. Figure: Polished surface.............................................................................................. 8
6. Figure: Discoloration of substrate ................................................................................ 9
7. Figure: Fingerprint on the surface ................................................................................ 9
8. Figure: Thermal paste honeycomb pattern .................................................................. 10
9. Figure: Recommended thermal foil dimensions ............................................................ 10
10. Figure: Plated through hole, good soldering .............................................................. 12
26. Figure: Typical profile for wave soldering .................................................................. 12
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Revision History
Date
Revision
Level
Description
12.11.2013
01
New document
04.07.2014
02
Change on housing design
05.06.2015
03
Change format; change preliminary to final ver.
05.06.2015
Page
Number(s)
3,4,5
Zs. Gyimóthy
all
Rev. 03
page 4
1
General assembly instructions
The flow0B type modules have to be mounted first to PCB, and afterwards fixed to heat sink.
The electrical connections between module and PCB are made by soldering. It is also required
to fix the PCB to the heat sink with threaded spacers. The number and the position of the
fixing points depend on the design of the circuit and location of different masses like capacitors
or inductors and the environment of the system. General recommendation cannot be given.
The recommended height of the spacers is: 17-0.1 mm.
PCB
Module
Module backside
Heat sink
1. Figure: Module with PCB and heat sink
During assembly the pins are not to be drawn or pushed more than ±0.2 mm or loaded with a
force bigger than 35 N. The tension of the pin must not exceed ±5 N at a maximum substrate
temperature of 100 C.
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2
Specification for PCBs


2.1
Printed board material meets the requirements of IEC 61249-2-7;
The number of conductive layers is not limited.
Specification for modules with solder pins

The module must be fixed to the PCB with 2 screws (type BN82428, D=2.5 mm and
L=6 mm) before soldering the pins into the PCB. Mounting torque: 0.4 Nm.

After screwing, all pins must be soldered into the PCB. The hole diameters on the PCB
has to be designed according to the soldering pin diameter which is 1±0.05 mm. For
further dimensions or 3D model please contact your local sales manager.
2. Figure: Solder pin diameter
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2.2
Required PCB cutouts for screwing holes
3. Figure: PCB cutouts for two-clip modules with solder pins
In the keepout area it is not allowed to be any PCB component between module and PCB.
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3
Specification for module backside surface
The thermal properties are not affected if the dimensions of the surface imperfections are
within the following values.



Polishing is allowed on the whole nickel plated surface if copper doesn’t become visible.
If copper becomes visible, the unit is scratched and the following acceptance critera
should be used. The depth and width of the scratch can’t exceed 200 μm and 800 μm,
respectively. The length of the scratch does not matter but the total area of scratches
must not exceed 5 % of the total substrate surface.
The diameter and depth of etching holes have to be below 1000 μm and 200 μm,
respectively.
4. Figure: Scratch and etching hole dimensions
5. Figure: Polished surface
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6. Figure: Discoloration of substrate
7. Figure: Fingerprint on the surface
4
Specification for heat sink
The whole heat sink surface under the module must be plane, clean and free of particles.


The flatness tolerance should be: < 25 µm in general.
In case the thermal paste thicker than 50 µm the flatness tolerance can be < 50 µm.
(A flatness tolerance specifies a tolerance zone defined by two parallel planes within
which the surface must lie.)

The surface roughness should be less than: Rz < 10 µm.

Heat sink surface imperfections should be within the values described for the module
backside surface (please refer to section 3).
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5
Specification for thermal interface materials
5.1
OPTION 1: Thermal paste:
A. Apply a homogeneous layer of thermal conductive paste over the whole backside of the
module, with a roller or spatula.
B. Apply thermal paste in a honeycomb pattern, seen on 8. Figure:. The preferred
technology for paste application is screen printing. For a drawing of the pattern please
contact your local sales representative.
The recommended thermal paste thickness is 55 µm ± 15 µm in this case.
Thermal paste thicker than recommended will increase thermal resistance ( Rth).
8. Figure: Thermal paste honeycomb pattern
5.2

OPTION 2: Thermal foil:

A thermal foil comprising of an aluminium core layer and two outer layers of phase
change material should be used.
The total thickness of the foil has to be less than 80 µm. Thicker foils could cause the
ceramic substrate to break and increase the thermal resistance.
Recommended foil type: Kunze Folien KU-ALC5 or ALF5

Recommended foil dimensions: see below.

9. Figure: Recommended thermal foil dimensions


The thickness of the foil is less than 80 µm.
Material of the foil is aluminum, covered with a phase change material.
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5.3

6
OPTION 3: Pre-applied thermal interface material
The modules may have already been pre-printed with thermal interface material.
Specification for fastening screws to the heat sink





Screws M4 (recommended screw type DIN 7984)
Min. depth of the screw in the heat sink: 6 mm
Flat washer ISO 7092 (DIN 433)
Spring washer DIN127 or DIN 128
Mounting torque: 2 Nm < Ms < 2.2 Nm
A torque wrench shall be used to tighten the mounting screws at the specified torque as
excessive torque may result in damage or degradation of the device. The inaccuracy of torque
wrench tightening method can range up to ±12 %. This has to be taken into account to
prevent over-tightening the fastener.
Due to excessive temperature fluctuations washers should be used to prevent the loosening of
the screws. After accurate tightening of the screws the spring washer exerts a constant force
on the joint. The flat washer distributes this force on the plastic surface.
6.1
Screw with pre-assembled washers
Screws with pre-assembled washers (SEMS or kombi screws) combine the screw and the
washers into a single component. These screws eliminate the need to slip the washers into
place by hand, boosting the speed and efficiency of the assembly process. The specifications of
these screws are provided below:




Screw size M4 according to DIN 6900 (ISO 10644; JIS B1188)
Flat washer according to DIN 6902 Type C (ISO 10673 Type S; JIS B1256)
Split lock spring washer according to DIN 6905 (JIS B1251)
Mounting torque range: 2 Nm < Ms < 2.2 Nm
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7
Recommendation for soldering
10. Figure: Plated through hole, good soldering
Plated through holes should exhibit a vertical solder fill of 100 %, with a fully formed fillet on
the solder side and evidence of 100 % wetting on the component side lead, barrel and pad.
7.1
Wave soldering of modules with solder pins
T
T3
250 °C < 𝑇3 < 260 °C
𝑇3 − 𝑇2 < 150 °C
K 𝑇2 − 𝑇1
K
2 <
<3
s
𝑡2 − 𝑡1
s
2 s < 𝑡4 − 𝑡3 < 10 s
T2
T1
t1
t2 t3 t4
t
11. Figure: Typical profile for wave soldering
Soldering of certain modules with Press-fit pins is also possible using the wave soldering
process. Wave soldering cannot be performed on all type of Press-fit modules.
7.2



Hand soldering parameters
Max. solder iron temperature:
350 °C
Max. contact time with component lead: 10 s
Number of heat cycles:
3
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8
ESD protection
Modules are sensitive to electrostatic discharge which can damage or destroy sensitive
semiconductors. All modules are ESD protected in the shipment box by semi conductive plastic
trays. During the handling and assembly of the modules it is recommended to wear a
conductive grounded wrist band and ensure a conductive grounded working place.
The modules have the following ESD sensitivity levels according the ESD Association
classification:
ESD STM5.1-1998 Human Body Model:
Class 0
ESD STM5.2-1999 Machine Model:
Class M1
ESD STM5.3.1-1999 Charged Device Model:
Class C1
Please take into consideration the following standards for handling electrostatic-sensitive
devices: EN61340-5-1, ANSI S20.20
9
Environmental conditions
The modules can be subjected to environmental conditions characterized by the following
classes:
Storage:
1K2 / 1B1 / 1C1 / 1S2 / 1M2
Transportation:
2K2 / 2B1 / 2C1 / 2S1 / 2M2
These classes are defined in the IEC 60721-3-1 and IEC 60721-3-2 standards. The modules
with wire pins have 1 year shelf life and the modules with Press-fit pins have 2 years shelf life
with the given storage conditions.
Flammability classification of the plastic material for flow 1B are V-0 and 5-VA (selfextinguishing, no dripping of flaming particles) according to UL 94, IEC 60695-11-10 and
IEC 60695-11-20 test methods.
9.1
Vibration resistance
In addition to the vibration parameters defined in 1M2 and 2M2 classes, the flow 1 package
modules are qualified with the environmental test in accordance to the standard
IEC 60068-2-6:2007 standard with the following severity:
Frequency range:
displacement amplitude:
Frequency range:
peak acceleration:
Duration:
Number of axes:
10 Hz to 26.6 Hz
3.5 mm (7 mm peak-to-peak)
26.6 Hz to 500 Hz
10 G (98.1 m/s2)
2 hours
3
These parameters are more severe than the parameters of the 1M2 and 2M2 classes.
9.2
Parameters of environment classes
The parameters detailed below are for informative purposes only. This section does not
substitute the above mentioned standards. Please read the IEC 60721-3-1 and IEC 60721-3-2
standards for the description of the environment classes.
9.2.1
Climatic conditions
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1K2
Air temperature:
5 °C to 40 °C
Humidity:
5 % to 85 % RH but max. 1 g/m3 to 25 g/m3 absolute
Rate of change of temperature:
0.5 °C/min
Air pressure:
70 kPa to 106 kPa
Solar radiation:
700 W/m2
Movement of surrounding air:
1 m/s
Condensation:
No
Precipitation:
No
Water from other sources than rain:
No
Formation of ice and frost:
No
2K2
Temperature:
−25 °C to 60 °C
Change of temperature air/air:
±25 °C
Relative humidity not combined
with rapid temperature changes:
max. 75 % (at 30 °C temperature)
Relative humidity combined
with rapid temperature changes:
No
Low air pressure:
70 kPa
Change of air pressure:
No
Solar radiation:
700 W/m2
Movement of surrounding air:
No
Precipitation:
No
Heat radiation:
No
Water from other sources than rain:
No
Wetness:
No
9.2.2
Biological conditions
1B1
Flora and fauna:
Negligible
2B1
Flora and fauna:
9.2.3
No
Chemically active substances
1C1
Sea and road salts:
No (Salt mist may be present in sheltered locations of coastal areas.)
Sulphur dioxide:
0.1 mg/m3
Hydrogen sulphide:
0.01 mg/m3
Chlorine:
0.01 mg/m3
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Hydrogen chloride:
0.01 mg/m3
Hydrogen fluoride:
0.003 mg/m3
Ammonia:
0.3 mg/m3
Ozone:
0.01 mg/m3
Nitrogen oxides:
0.1 mg/m3 (Expressed in equivalent values of Nitrogen dioxide.)
2C2
Sea salts:
none
Sulphur dioxide:
0.1 mg/m3
Hydrogen sulphide:
0.01 mg/m3
Nitrogen oxides:
0.1 mg/m3 (Expressed in the equivalent values of Nitrogen dioxide.)
Ozone:
0.01 mg/m3
Hydrogen chloride:
0.1 mg/m3
Hydrogen fluoride:
0.003 mg/m3
Ammonia:
0.3 mg/m3
9.2.4
Mechanically active substances
1S2
Sand:
30 mg/m3
Dust (suspension):
0.2 mg/m3
Dust (sedimentation):
1.5 mg/(m2h)
2S1
Sand in air:
No
Dust (sedimentation):
No
9.2.5
Mechanical Conditions
1M2
Stationary vibration, sinusoidal
Please see section 9.1.
Non stationary vibration, including shock
Shock response spectrum type L
peak acceleration:
40 m/s2
Static load:
5 kPa
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2M2
Stationary vibration sinusoidal
Please see section 9.1.
Stationary vibration, random
Acceleration
spectral density:
1 m2/s3
Frequency range:
10 Hz to 200 Hz
and
Acceleration
spectral density:
0.3 m2/s3
Frequency range:
200 Hz to 2000 Hz
The later range can be neglected transporting with vehicles with high damping.
Non stationary vibration, including shock
Shock response spectrum type I.
peak acceleration:
100 m/s2
and
Shock response spectrum type II.
peak acceleration:
300 m/s2
Free fall
1.2 m (mass of the object is less than or equal to 20 kg)
or
1 m (mass of the object is between 20 kg and 100 kg)
or
0.25 m (mass of the object is higher than or equal to 100 kg)
Toppling
Around any of the edges.
Rolling, pitching
Angle:
±35°
Period:
8s
35° may occur for short time periods but 22.5° may persist permanently.
Acceleration
20 m/s2
Static load:
10 kPa
10
Disclaimer
The information and recommendations in this document are based on standards and common
engineering practices. Customer specific applications and specifications may require additional
processes and tests than may differ of supersede those recommended in this document.
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