Product Brief OptiMOS™ in TO-Leadless A Package Optimized for High Power Applications Infineon’s OptiMOS™ Power MOSFET TO-Leadless package is an outstanding package solution optimized for high current applications up to 300 A, such as Forklift, Light Electric Vehicles (LEV), Power Tools, PoL (Point of Load), Telecom and e-fuse. Furthermore, the 60% smaller package size enables a very compact design. Compared to D²PAK 7pin, TO-Leadless shows a substantial reduction in footprint of 30%. The 50% reduced height offers a significant advantage in narrow applications such as rack or blade servers. Key Features Industry‘s lowest RDS(on) Reduced footprint and space Highest current capability up to 300A Very low package parasitics and inductances Significantly reduced electromigra- tion due to improved solder contact area TO-Leadless - a leadless package with 60% space reduction compared to D²PAK 7pin Key Benefits Highest efficiency and system cost reduction Less paralleling and cooling required Enabling compact design Improved EMI Highest reliability 4.4 mm 2.3 mm 15.0 mm 10.0 mm 11.7 mm 9.9 mm Footprint: 150 mm2Footprint: 115 mm2 30% Footprint Reduction www.infineon.com/toll 50% Height Reduction 60% Space Reduction Applications Forklift Light electric vehicles (LEV) e.g. e-scooter, e-bikes or µ-car, Point of Load (PoL) Telecom e-fuse Product Brief OptiMOS™ in TO-Leadless A Package Optimized for High Power Applications TO-Leadless offers the Industry’s lowest RDS(on) in 30 V (0.4 mΩ) and 60 V (0.75 mΩ) devices. This enables a reduction in the number of paralleled MOSFETs in high power applications and increases power density. In addition TO-Leadless comes with a 50% bigger solder contact area. This leads to lower current density, avoiding electromigration at high current levels and temperatures, resulting in improved reliability. TO-Leadless is a package without leads with the possibility of optical inspection due to tin plated grooved gate and source contacts. Tinned trapezoidal grooves on the tips of gate and source contacts With TO-Leadless Infineon offers lowest RDS(on) 7 6.5 5.9 6 RDS(on) [mΩ] 5 Trapezoidal Groove 4 3 2.5 1 1.2 1.0 0.95 Visible solder meniscus allows a simple and inexpensive Automatic Optical Inspection 1.5 1.9 2 0.75 Pin of TO-Leadless 0.4 Visible solder joint 0 30 60 80 100 150 VDS [V] D2PAK 7pin Groove Cu-Tracks on PCB PCB TO-Leadless Product Portfolio TO-Leadless Package Type VDS [V] RDS(on) max [mΩ] IPT004N03L 30 0.4 IPT007N06N 60 0.75 IPT012N08N5 80 1.2 IPT015N10N5 100 1.5 IPT020N10N3 100 2.0 IPT059N15N3 150 5.9 The new TO-Leadless package is the best choice for high power applications due to: Best EMI behavior Highest efficiency Best thermal behavior Superior reliability Published by Infineon Technologies Austria AG 9500 Villach, Austria © 2015 Infineon Technologies AG. All Rights Reserved. Visit us: www.infineon.com Please note! THIS DOCUMENT IS FOR INFORMATION PURPOSES ONLY AND ANY INFORMATION GIVEN HEREIN SHALL IN NO EVENT BE REGARDED AS A WARRANTY, GUARANTEE OR DESCRIPTION OF ANY FUNCTIONALITY, CONDITIONS AND/OR QUALITY OF OUR PRODUCTS OR ANY SUITABILITY FOR A PARTICULAR PURPOSE. WITH REGARD TO THE TECHNICAL SPECIFICATIONS OF OUR PRODUCTS, WE KINDLY ASK YOU TO REFER TO THE RELEVANT PRODUCT DATA SHEETS PROVIDED BY US. OUR CUSTOMERS AND THEIR TECHNICAL DEPARTMENTS ARE REQUIRED TO EVALUATE THE SUITABILITY OF OUR PRODUCTS FOR THE INTENDED APPLICATION. WE RESERVE THE RIGHT TO CHANGE THIS DOCUMENT AND/ OR THE INFORMATION GIVEN HEREIN AT ANY TIME. Order Number: B111-H9808-V2-7600-EU-EC Date: 05 / 2015 Additional information For further information on technologies, our products, the application of our products, delivery terms and conditions and/or prices please contact your nearest Infineon Technologies office (www.infineon.com). Warnings Due to technical requirements, our products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by us in a written document signed by authorized representatives of Infineon Technologies, our products may not be used in any life endangering applications, including but not limited to medical, nuclear, military, life critical or any other applications where a failure of the product or any consequences of the use thereof can result in personal injury.