MICROCHIP TC1263

TC1263
500mA Fixed Output CMOS LDO with Shutdown
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•
•
•
•
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FRONT VIEW
TAB IS GND
TAB IS GND
TC1263
Battery Operated Systems
Portable Computers
Medical Instruments
Instrumentation
Cellular/GSM/PHS Phones
Linear Post-Regulators for SMPS
Pagers
TC1263
3 4 5
1 2
BYP
Applications
5-Pin TO-220
5-Pin DDPAK
1 2 3 4 5
BYP
SHDN
GND
VIN
VOUT
Very Low Dropout Voltage
500mA Output Current
High Output Voltage Accuracy
Standard or Custom Output Voltages
Over Current and Over Temperature Protection
SHDN Input for Active Power Management
ERROR Output Can Be Used as a Low Battery
Detector (SOIC only)
VOUT
•
•
•
•
•
•
•
Package Type
SHDN
GND
VIN
Features
8-Pin SOIC
Device Selection Table
VOUT
1
8
VIN
GND
2
7
NC
NC
3
6
SHDN
BYPASS
4
5
ERROR
TC1263
General Description
Part Number
Package
Junction
Temp. Range
TC1263-xxVOA
8-Pin SOIC
-40°C to +125°C
TC1263-xxVAT
5-Pin TO-220
-40°C to +125°C
TC1263-xxVET
5-Pin DDPAK
-40°C to +125°C
NOTE: xx indicates output voltages.
Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0.
Other output voltages are available. Please contact Microchip
Technology Inc. for details.
The TC1263 is a fixed output, high accuracy (typically
±0.5%) CMOS low dropout regulator. Designed
specifically for battery-operated systems, the TC1263’s
CMOS construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80µA at full load (20 to 60 times lower than
in bipolar regulators).
TC1263 key features include ultra low noise operation,
very low dropout voltage (typically 350mV at full load),
and fast response to step changes in load.
The TC1263 incorporates both over temperature and
over current protection. The TC1263 is stable with an
output capacitor of only 1µF and has a maximum
output current of 500mA. It is available in 8-Pin SOIC,
5-Pin TO-220 and 5-Pin DDPAK packages.
Typical Application
VIN
VIN
VOUT
TC1263
GND
 2002 Microchip Technology Inc.
SHDN
VOUT
+
COUT
1µF
SHDN
DS21374B-page 1
TC1263
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V
Operating Temperature Range...... -40°C < TJ < 125°C
Storage Temperature.......................... -65°C to +150°C
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1263 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 100µA, CL = 3.3µF, SHDN > VIH , TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Parameter
Min
Typ
Max
Units
VIN
Symbol
Input Operating Voltage
2.7
—
6.0
V
IOUTMAX
Maximum Output Current
500
—
—
mA
VOUT
Output Voltage
—
—
VR ±0.5%
VR – 2.5%
—
VR + 2.5%
Test Conditions
Note 8
V
Note 1
Note 2
∆VOUT/∆T
VOUT Temperature Coefficient
—
40
—
ppm/°C
∆VOUT/∆VIN
Line Regulation
—
0.05
0.35
%
∆VOUT/VOUT
Load Regulation
—
0.002
0.01
%/mA
VIN-VOUT
Dropout Voltage
—
—
—
20
60
200
350
30
130
390
650
mV
IL = 100µA
IL = 100mA
IL = 300mA
IL = 500mA (Note 4)
(VR + 1V) ≤ VIN ≤ 6V
IL = 0.1mA to IOUTMAX (Note 3)
IDD
Supply Current
—
80
130
µA
SHDN = VIH, IL = 0
ISHDN
Shutdown Supply Current
—
0.05
1
µA
SHDN = 0V
FRE ≤ 1kHz
PSRR
Power Supply Rejection Ratio
—
64
—
dB
IOUTSC
Output Short Circuit Current
—
1200
1400
mA
VOUT = 0V
∆VOUT/∆PD
Thermal Regulation
—
0.04
—
V/W
Note 5
eN
Output Noise
—
260
—
nV/√Hz
VIH
SHDN Input High Threshold
60
—
—
%VIN
VIL
SHDN Input Low Threshold
—
—
15
%VIN
IL = IOUTMAX
SHDN Input
ERROR Output (SOIC Only)
VMIN
Minimum Operating Voltage
1.0
—
—
V
VOL
Output Logic Low Voltage
—
—
400
mV
VTH
ERROR Threshold Voltage
—
0.95 x VR
—
V
VHYS
ERROR Positive Hysteresis
—
50
—
mV
Note
1:
2:
3:
4:
5:
6:
7:
8:
1 mA Flows to ERROR
Note 7
VR is the regulator output voltage setting.
TC VOUT = (VOUT MAX – VOUT MIN ) x 106
VOUT x ∆T
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V
differential.
Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
Hysteresis voltage is referenced to VR.
The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX .
DS21374B-page 2
 2002 Microchip Technology Inc.
TC1263
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
Symbol
1
VOUT
Regulated voltage output.
2
GND
Ground terminal.
3
NC
4
BYPASS
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
5
ERROR
Out-of-Regulation Flag (open drain output). This output goes low when VOUT is out-of-tolerance
by approximately – 5%.
Description
No connect.
6
NC
7
SHDN
8
VIN
Pin No.
(5-Pin DDPAK)
(5-Pin TO-220)
Symbol
1
BYP
2
SHDN
3
GND
4
VIN
Unregulated supply input.
5
VOUT
Regulated voltage output.
 2002 Microchip Technology Inc.
No connect.
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05µA (typical).
Unregulated supply input.
Description
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05µA (typical).
Ground terminal.
DS21374B-page 3
TC1263
3.0
DETAILED DESCRIPTION
3.2
The TC1263 is a precision, fixed output LDO. Unlike
bipolar regulators, the TC1263’s supply current does
not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to ILOAD MAX load current range (an important
consideration in RTC and CMOS RAM battery back-up
applications).
Figure 3-1 shows a typical application circuit.
FIGURE 3-1:
VOUT
VIN
+
+
TYPICAL APPLICATION
CIRCUIT
1µF
C2
1µF
C1
TC1263
Battery
VOUT
+
GND
V+
SHDN
Shutdown Control
(to CMOS Logic or Tie
to VIN if unused)
3.1
ERROR
C3 Required Only
if ERROR is used as a
Processor RESET Signal
(See Text)
R1
1M
C3
+
0.2µF
ERROR is driven low whenever VOUT falls out of
regulation by more than – 5% (typical). This condition
may be caused by low input voltage, output current
limiting, or thermal limiting. The ERROR threshold is
5% below rated VOUT regardless of the programmed
output voltage value (e.g., ERROR = VOL at 4.75V
(typ.) for a 5.0V regulator and 2.85V (typ.) for a 3.0V
regulator). ERROR output operation is shown in
Figure 3-2.
Note that ERROR is active when VOUT is at or below
VTH, and inactive when VOUT is above VTH + VH.
As shown in Figure 3-1, ERROR can be used as a
battery low flag, or as a processor RESET signal (with
the addition of timing capacitor C3). R1 x C3 should be
chosen to maintain ERROR below VIH of the processor
RESET input for at least 200 msec to allow time for the
system to stabilize. Pull-up resistor R1 can be tied to
VOUT, VIN or any other voltage less than (VIN + 0.3V).
FIGURE 3-2:
BATTLOW
or RESET
Output Capacitor
A 1µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1Ω and less than 5Ω, and a
resonant frequency above 1MHz. A 1µF capacitor
should be connected from VIN to GND if there is more
than 10 inches of wire between the regulator and the
AC filter capacitor, or if a battery is used as the power
source. Aluminum electrolytic or tantalum capacitor
types can be used. (Since many aluminum electrolytic
capacitors freeze at approximately -30°C, solid
tantalums are recommended for applications operating
below -25°C.) When operating from sources other than
batteries, supply-noise rejection and transient
response can be improved by increasing the value of
the input and output capacitors and employing passive
filtering techniques.
DS21374B-page 4
ERROR Output
ERROR OUTPUT
OPERATION
VOUT
VTH
HYSTERESIS (VH)
ERROR
VIH
VOL
 2002 Microchip Technology Inc.
TC1263
4.0
THERMAL CONSIDERATIONS
4.1
Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
4.2
Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
PD ≈ (VIN MAX – VOUTMIN)ILOADMAX
Worst case actual power dissipation
Maximum voltage on VIN
Minimum regulator output voltage
Maximum output (load) current
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(θJA).
2500 sq mm 2500 sq mm 2500 sq mm
25°C/W
1000 sq mm 2500 sq mm 2500 sq mm
27°C/W
125 sq mm
35°C/W
2500 sq mm 2500 sq mm
*Tab of device attached to topside copper
VINMAX
= 3.3V ± 10%
VOUTMIN = 2.7V ± 0.5%
ILOADMAX = 275mA
TJMAX
= 125°C
TAMAX
= 95°C
θJA
= 60°C/W
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
= [(3.3 x 1.1) – (2.7 x .995)]275 x 10–3
PDMAX = (TJMAX – TAMAX)
θJA
= 260mW
Where all terms are previously defined.
Table 4-1 and Table 4-2 show various values of θJA for
the TC1263 packages.
THERMAL RESISTANCE
GUIDELINES FOR TC1263 IN
8-PIN SOIC PACKAGE
Copper
Area
(Backside)
Thermal
Resistance
(θJA)
Board
Area
PD ≈ (VINMAX – VOUTMIN)ILOADMAX
EQUATION 4-2:
Copper
Area
(Topside)*
Copper
Area
(Backside)
Given:
Where:
TABLE 4-1:
Copper
Area
(Topside)*
THERMAL RESISTANCE
GUIDELINES FOR TC1263 IN
3-PIN TO-220/DDPAK
PACKAGE
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
EQUATION 4-1:
PD =
VINMAX =
VOUT MIN =
ILOADMAX =
TABLE 4-2:
Board
Area
2500 sq mm 2500 sq mm 2500 sq mm
Thermal
Resistance
(θJA)
60°C/W
1000 sq mm 2500 sq mm 2500 sq mm
60°C/W
225 sq mm
2500 sq mm 2500 sq mm
68°C/W
100 sq mm
2500 sq mm 2500 sq mm
74°C/W
Maximum allowable power dissipation:
PD MAX = (TJMAX – TAMAX)
θJA
= (125 – 95)
60
= 500mW
In this example, the TC1263 dissipates a maximum of
260mW; below the allowable limit of 500mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN, is found by substituting the maximum allowable
power dissipation of 500mW into Equation 4-1, from
which VINMAX = 4.6V.
*Pin 2 is ground. Device is mounted on topside.
 2002 Microchip Technology Inc.
DS21374B-page 5
TC1263
5.0
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Line Regulation vs. Temperature
Output Noise vs. Frequency
0.020
RLOAD = 50µΩ
COUT = 1µF
0.018
0.0090
0.016
0.014
NOISE (µV/√Hz)
LINE REGULATION (%)
Load Regulation vs. Temperature
0.0100
10.0
LOAD REGULATION (%/mA)
Note:
0.012
0.010
0.008
0.006
1.0
0.1
0.004
0.002
0.000
-40°C
0.0
0°C
25°C
70°C
85°C
0.01
125°C
0.01
TEMPERATURE (°C)
100
1000
0.0070
0.0060
0.0050
0.0040
IDD vs. Temperature
1mA to 500mA
2.5V
0.0030
0.0020
1mA to 500mA
5V
0.0010
0.0100
-40°C
0°C
25°C
125°C
125°C
2.5V
75
5V
45
30
85°C
0.40
DROPOUT VOLTAGE (V)
105
DROPOUT VOLTAGE (V)
120
70°C
25°C
0.30
0°C
0.20
-40°C
0.10
0.40
85°C
0.30
70°C
25°C
0.20
0°C
0.10
-40°C
15
0
-40°C
0.00
0.00
0°C
25°C
70°C
85°C 125°C
0
100
200
300
ILOAD (mA)
TEMPERATURE (°C)
2.5V VOUT vs. Temperature
IL = 0.1mA
2.50
VOUT (V)
VOUT (V)
2.30
IL = 300mA
A
IL = 500mA
A
5.20
5.10
5.00
4.90
4.80
4.70
1.70
4.20
4.10
4.00
-40°C
25°C
70°C
85°C 125°C
TEMPERATURE (°C)
DS21374B-page 6
0
100
200
300
400
500
ILOAD (mA)
IL
IL
4.50
4.40
4.30
0°C
500
IL = 0.1mA
4.60
1.90
1.50
-40°C
400
5.0V VOUT vs. Temperature
2.70
2.10
125°C
LOAD
0.50
135
60
85°C
2.5V Dropout Voltage vs. ILOAD
0.50
90
70°C
TEMPERATURE (°C)
FREQUENCY (kHz)
150
IDD (µA)
10
1
0.0080
0°C
25°C
70°C
85°C
125°C
TEMPERATURE (°C)
 2002 Microchip Technology Inc.
TC1263
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
8-Pin SOIC (N)
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
12 mm
8 mm
2500
13 in
Component Taping Orientation for 5-Pin DDPAK Devices
PIN 1
User Direction of Feed
Device
Marking
W
P
Standard Reel Component Orientation
for TR Suffix Device
(Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package
5-Pin DDPAK
 2002 Microchip Technology Inc.
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
24 mm
16 mm
750
13 in
DS21374B-page 7
TC1263
6.3
Package Dimensions
8-Pin SOIC
PIN 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8° MAX..
.020 (0.51) .010 (0.25)
.013 (0.33) .004 (0.10)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
5-Pin TO-220
.185 (4.70)
.165 (4.19)
.117 (2.97)
.103 (2.62)
.415 (10.54)
.390 (9.91)
.156 (3.96)
.140 (3.56)
DIA.
.055 (1.40)
.045 (1.14)
.293 (7.44)
.204 (5.18)
3° - 7.5°
5 PLCS.
.613 (15.57)
.569 (14.45)
.037 (0.95)
.025 (0.64)
.590 (14.99)
.482 (12.24)
.025 (0.64)
.012 (0.30)
.072 (1.83)
.062 (1.57)
PIN 1
.273 (6.93)
.263 (6.68)
.115 (2.92)
.087 (2.21)
Dimensions: inches (mm)
DS21374B-page 8
 2002 Microchip Technology Inc.
TC1263
6.3
Package Dimensions (Continued)
5-Pin DDPAK
.410 (10.41)
.385 (9.78)
.183 (4.65)
.170 (4.32)
.067 (1.70)
.045 (1.14)
.055 (1.40)
.045 (1.14)
3° - 7°
(5x)
.370 (9.40)
.330 (8.38)
.010 (0.25)
.000 (0.00)
.605 (15.37)
.549 (13.95)
.026 (0.66)
.014 (0.36)
.110 (2.79)
.068 (1.72)
.037 (0.94)
.026 (0.66)
PIN 1
.067 (1.70) TYP.
8° MAX.
Dimensions: inches (mm)
 2002 Microchip Technology Inc.
DS21374B-page 9
TC1263
NOTES:
DS21374B-page 10
 2002 Microchip Technology Inc.
TC1263
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2002 Microchip Technology Inc.
DS21374B-page 11
TC1263
NOTES:
DS21374B-page 12
 2002 Microchip Technology Inc.
TC1263
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with
express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property
rights.
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KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER,
PICSTART, PRO MATE, SEEVAL and The Embedded Control
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In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
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MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
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The Company’s quality system processes and
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systems is ISO 9001 certified.
 2002 Microchip Technology Inc.
DS21374B-page 13
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18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
150 Motor Parkway, Suite 202
Hauppauge, NY 11788
Tel: 631-273-5305 Fax: 631-273-5335
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1315, 13/F, Shenzhen Kerry Centre,
Renminnan Lu
Shenzhen 518001, China
Tel: 86-755-2350361 Fax: 86-755-2366086
San Jose
China - Hong Kong SAR
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
New York
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
India
Microchip Technology Inc.
India Liaison Office
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Gustav-Heinemann Ring 125
D-81739 Munich, Germany
Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Centro Direzionale Colleoni
Palazzo Taurus 1 V. Le Colleoni 1
20041 Agrate Brianza
Milan, Italy
Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44 118 921 5869 Fax: 44-118 921-5820
05/01/02
*DS21374B*
DS21374B-page 14
 2002 Microchip Technology Inc.