Reliability Report

AOS Semiconductor
Product Reliability Report
AOL1448,
rev C
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
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This AOS product reliability report summarizes the qualification result for AOL1448. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOL1448 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOL1448 uses advanced trench technology to provide excellent RDS(ON) with low gate charge.
This device is suitable for high side switch in SMPS and general purpose applications.
-RoHS Compliant
-Halogen-Free
Details refer to the datasheet.
II. Die / Package Information:
AOL1448
Standard sub-micron
30V N-Channel MOSFET
TM
Package Type
UltraSO-8
Lead Frame
Bare Cu
Die Attach
Soft solder
Bonding
Al & Au wire
Mold Material
Epoxy resin with silica filler
Moisture Level
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
Process
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III. Result of Reliability Stress for AOL1448
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@260°c
Temp = 150°c ,
Vgs=100% of
Vgsmax
-
HTGB
HTRB
Temp = 150°c ,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
168hrs
500 hrs
1000 hrs
Lot
Attribution
Total
Sample size
2739pcs
0
JESD22A113
4 lot
4 lot
2 lot
(Note A*)
847pcs
0
JESD22A108
4 lot
4 lot
2 lot
(Note A*)
847pcs
0
JESD22A108
660pcs
0
JESD22A110
0
JESD22A102
0
JESD22A104
77 pcs / lot
77 pcs / lot
130 °c , 85%RH,
33.3 psi, Vgs =
100% of Vgs max
100 hrs
12 lots
Pressure Pot
121°c , 29.7psi,
RH=100%
96 hrs
(Note A*)
12lots
55 pcs / lot
924pcs
(Note A*)
77 pcs / lot
-65°c to 150°c ,
air to air,
250 / 500
cycles
Reference
Standard
15 lots
HAST
Temperature
Cycle
Number
of
Failures
15 lots
(Note A*)
1155pcs
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 5
MTTF = 23159 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOL1448). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
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9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
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= 1.83 x 10 / [2x (10x77x168 +6x77x500 +6x77x1000) x258] = 5
9
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MTTF = 10 / FIT = 2.03 x 10 hrs = 23159 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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