AOS Semiconductor Product Reliability Report AOD4136, rev B Plastic Encapsulated Device ALPHA & OMEGA Semiconductor, Inc www.aosmd.com 1 This AOS product reliability report summarizes the qualification result for AOD4136. Accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. Review of final electrical test result confirms that AOD4136 passes AOS quality and reliability requirements. The released product will be categorized by the process family and be monitored on a quarterly basis for continuously improving the product quality. Table of Contents: I. II. III. IV. Product Description Package and Die information Environmental Stress Test Summary and Result Reliability Evaluation I. Product Description: TM The AOD4136 is fabricated with SDMOS trench technology that combines excellent RDS(ON) with low gate charge. The result is outstanding efficiency with controlled switching behavior. This universal technology is well suited for both DC-DC and load switch applications. -RoHS Compliant -Halogen-Free Details refer to the datasheet. II. Die / Package Information: AOD4136 Standard sub-micron TM N-Channel SDMOS POWER Transistor Package Type TO252 Lead Frame Bare Cu Die Attach Soft solder Bonding Al & Au wire Mold Material Epoxy resin with silica filler Moisture Level Up to Level 1 * Note * based on info provided by assembler and mold compound supplier Process 2 III. Result of Reliability Stress for AOD4136 Test Item Test Condition Time Point MSL Precondition 168hr 85°c /85%RH +3 cycle reflow@260°c Temp = 150°c , Vgs=100% of Vgsmax - HTGB HTRB Temp = 150°c , Vds=80% of Vdsmax Lot Attribution 15 lots 168hrs 500 hrs 1000 hrs 168hrs 500 hrs 1000 hrs 6 lot (Note A*) Total Sample size 0 JESD22A113 462pcs 0 JESD22A108 0 JESD22A108 660pcs 0 JESD22A110 0 JESD22A102 0 JESD22A104 77 pcs / lot 462pcs 6 lot (Note A*) 77 pcs / lot 130 °c , 85%RH, 33.3 psi, Vgs = 100% of Vgs max 100 hrs 12 lots Pressure Pot 121°c , 29.7psi, RH=100% 96 hrs (Note A*) 12lots 55 pcs / lot 924pcs (Note A*) 77 pcs / lot -65°c to 150°c , air to air, 250 / 500 cycles 15 lots (Note A*) Reference Standard 2739pcs HAST Temperature Cycle Number of Failures 1155pcs 77 pcs / lot Note A: The reliability data presents total of available generic data up to the published date. IV. Reliability Evaluation FIT rate (per billion): 4 MTTF = 29742 years The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in sample size of the selected product (AOD4136). Failure Rate Determination is based on JEDEC Standard JESD 85. FIT means one failure per billion hours. 2 9 Failure Rate = Chi x 10 / [2 (N) (H) (Af)] 9 = 1.83 x 10 / [2x (12x77x1000) x258] = 4 9 8 MTTF = 10 / FIT = 3.84 x 10 hrs = 29742 years Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval N = Total Number of units from HTRB and HTGB tests H = Duration of HTRB/HTGB testing Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C) Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)] Acceleration Factor ratio list: Af 55 deg C 70 deg C 85 deg C 100 deg C 115 deg C 130 deg C 150 deg C 258 87 32 13 5.64 2.59 1 Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16 Tj u =The use junction temperature in degree (Kelvin), K = C+273.16 k = Boltzmann’s constant, 8.617164 X 10-5eV / K 3