Reliability Report

AOS Semiconductor
Product Reliability Report
AOD4136,
rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOD4136. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOD4136 passes AOS quality and
reliability requirements. The released product will be categorized by the process family and be
monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
TM
The AOD4136 is fabricated with SDMOS trench technology that combines excellent RDS(ON)
with low gate charge. The result is outstanding efficiency with controlled switching behavior. This
universal technology is well suited for both DC-DC and load switch applications.
-RoHS Compliant
-Halogen-Free
Details refer to the datasheet.
II. Die / Package Information:
AOD4136
Standard sub-micron
TM
N-Channel SDMOS POWER Transistor
Package Type
TO252
Lead Frame
Bare Cu
Die Attach
Soft solder
Bonding
Al & Au wire
Mold Material
Epoxy resin with silica filler
Moisture Level
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
Process
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III. Result of Reliability Stress for AOD4136
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
reflow@260°c
Temp = 150°c ,
Vgs=100% of
Vgsmax
-
HTGB
HTRB
Temp = 150°c ,
Vds=80% of
Vdsmax
Lot
Attribution
15 lots
168hrs
500 hrs
1000 hrs
168hrs
500 hrs
1000 hrs
6 lot
(Note A*)
Total
Sample size
0
JESD22A113
462pcs
0
JESD22A108
0
JESD22A108
660pcs
0
JESD22A110
0
JESD22A102
0
JESD22A104
77 pcs / lot
462pcs
6 lot
(Note A*)
77 pcs / lot
130 °c , 85%RH,
33.3 psi, Vgs =
100% of Vgs max
100 hrs
12 lots
Pressure Pot
121°c , 29.7psi,
RH=100%
96 hrs
(Note A*)
12lots
55 pcs / lot
924pcs
(Note A*)
77 pcs / lot
-65°c to 150°c ,
air to air,
250 / 500
cycles
15 lots
(Note A*)
Reference
Standard
2739pcs
HAST
Temperature
Cycle
Number
of
Failures
1155pcs
77 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 4
MTTF = 29742 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOD4136). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
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9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)]
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= 1.83 x 10 / [2x (12x77x1000) x258] = 4
9
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MTTF = 10 / FIT = 3.84 x 10 hrs = 29742 years
Chi²= Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
Af
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
130 deg C
150 deg C
258
87
32
13
5.64
2.59
1
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
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