83B BC846BMB SO T8 65 V, 100 mA NPN general-purpose transistor Rev. 1 — 15 May 2012 Product data sheet 1. Product profile 1.1 General description NPN general-purpose transistor in a leadless ultra small DFN1006B-3 (SOT883B) Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Leadless ultra small SMD plastic package Low package height of 0.37 mm Power dissipation comparable to SOT23 AEC-Q101 qualified 1.3 Applications General-purpose switching and amplification Mobile applications 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 65 V IC collector current - - 100 mA hFE DC current gain VCE = 5 V; IC = 2 mA 200 - 450 2. Pinning information Table 2. Pinning Pin Description 1 base 2 emitter Simplified outline Graphic symbol 3 1 3 3 collector 1 2 Transparent top view 2 sym021 BC846BMB NXP Semiconductors 65 V, 100 mA NPN general-purpose transistor 3. Ordering information Table 3. Ordering information Type number BC846BMB Package Name Description Version DFN1006B-3 leadless ultra small plastic package; 3 solder lands; body 1.0 0.6 0.37 mm SOT883B 4. Marking Table 4. Marking codes Type number Marking code BC846BMB 0100 1011 4.1 Binary marking code description PIN 1 INDICATION READING DIRECTION READING EXAMPLE: 0111 1011 MARKING CODE (EXAMPLE) READING DIRECTION 006aac673 Fig 1. BC846BMB Product data sheet DFN1006B-3 (SOT883B) binary marking code description All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2012 © NXP B.V. 2012. All rights reserved. 2 of 11 BC846BMB NXP Semiconductors 65 V, 100 mA NPN general-purpose transistor 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 80 V VCEO collector-emitter voltage open base - 65 V VEBO emitter-base voltage open collector - 6 V IC collector current - 100 mA ICM peak collector current single pulse; tp 1 ms - 200 mA IBM peak base current single pulse; tp 1 ms - 200 mA Ptot total power dissipation Tamb 25 C - 250 mW Tj junction temperature - 150 C Tamb ambient temperature 65 +150 C Tstg storage temperature 65 +150 C [1] [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter thermal resistance from junction to ambient Rth(j-a) [1] Conditions in free air [1] Min Typ Max Unit - - 500 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 006aab603 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 102 0.2 0.1 0.05 0.02 10 0.01 0 1 10−5 10−4 10−3 10−2 10−1 1 10 102 103 tp (s) FR4 PCB, standard footprint Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values BC846BMB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2012 © NXP B.V. 2012. All rights reserved. 3 of 11 BC846BMB NXP Semiconductors 65 V, 100 mA NPN general-purpose transistor 7. Characteristics Table 7. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit collector-base cut-off current VCB = 30 V; IE = 0 A - - 15 nA VCB = 30 V; IE = 0 A; Tj = 150 C - - 5 A IEBO emitter-base cut-off current VEB = 5 V; IE = 0 A - - 100 nA hFE DC current gain VCE = 5 V; IC = 2 mA 200 - 450 VCEsat collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA - 90 200 mV IC = 100 mA; IB = 5 mA [1] - 200 400 mV base-emitter saturation voltage IC = 10 mA; IB = 0.5 mA [2] - 760 - mV IC = 100 mA; IB = 5 mA [2] - 900 - mV base-emitter voltage IC = 2 mA; VCE = 5 V [3] 580 660 700 mV IC = 10 mA; VCE = 5 V [3] - - 770 mV 100 - - MHz ICBO VBEsat VBE BC846BMB Product data sheet fT transition frequency VCE = 5 V; IC = 10 mA; f = 100 MHz Cc collector capacitance VCB = 10 V; IE = ie = 0 A; f = 1 MHz - 2 3 pF Ce emitter capacitance VEB = 0.5 V; IC = ic = 0 A; f = 1 MHz - 11 - pF NF noise figure IC = 200 A; VCE = 5 V; RS = 2 k; f = 1 kHz; B = 200 Hz - 2 10 dB [1] Pulse test: tp 300 s; 0.02. [2] VBEsat decreases by approximately 1.7 mV/K with increasing temperature. [3] VBE decreases by approximately 2 mV/K with increasing temperature. All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2012 © NXP B.V. 2012. All rights reserved. 4 of 11 BC846BMB NXP Semiconductors 65 V, 100 mA NPN general-purpose transistor mgt727 600 VBE (mV) 1000 hFE (1) 500 mgt728 1200 (1) 800 400 (2) (2) 300 600 200 400 (3) 100 0 10−1 1 10 (3) 200 102 0 10−2 103 10−1 1 10 I C (mA) VCE = 5 V VCE = 5 V (1) Tamb = 150 C (1) Tamb = 55 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 55 C Fig 3. 102 103 I C (mA) (3) Tamb = 150 C DC current gain as a function of collector current; typical values mgt729 104 Fig 4. Base-emitter voltage as a function of collector current; typical values mgt730 1200 VBEsat (mV) 1000 VCEsat (mV) (1) 103 800 (2) 600 (3) 102 400 (1) 200 (3) (2) 10 10−1 1 10 102 0 10−1 103 1 IC/IB = 20 IC/IB = 10 (1) Tamb = 150 C (1) Tamb = 55 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 55 C (3) Tamb = 150 C Fig 5. Collector-emitter saturation voltage as a function of collector current; typical values BC846BMB Product data sheet 10 102 103 I C (mA) I C (mA) Fig 6. Base-emitter saturation voltage as a function of collector current; typical values All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2012 © NXP B.V. 2012. All rights reserved. 5 of 11 BC846BMB NXP Semiconductors 65 V, 100 mA NPN general-purpose transistor 8. Test information 9. Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 10. Package outline 0.65 0.55 0.40 0.34 0.35 0.20 0.12 1 0.04 max 2 0.30 0.22 1.05 0.65 0.95 0.30 0.22 3 0.55 0.47 Dimensions in mm Fig 7. 11-11-02 Package outline DFN1006B-3 (SOT883B) 11. Packing information Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number Package Description Packing quantity 10000 BC846MBM [1] BC846BMB Product data sheet SOT883B 2 mm pitch, 8 mm tape and reel -315 For further information and the availability of packing methods, see Section 15. All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2012 © NXP B.V. 2012. All rights reserved. 6 of 11 BC846BMB NXP Semiconductors 65 V, 100 mA NPN general-purpose transistor 12. Soldering Footprint information for reflow soldering SOT883B 1.3 0.7 R0.05 (8x) 0.9 0.6 0.7 0.25 (2x) Fig 8. 0.3 (2x) 0.3 0.4 (2x) 0.4 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm sot883b_fr Reflow soldering footprint DFN1006B-3 (SOT883B) BC846BMB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2012 © NXP B.V. 2012. All rights reserved. 7 of 11 BC846BMB NXP Semiconductors 65 V, 100 mA NPN general-purpose transistor 13. Revision history Table 9. Revision history Document ID Release date Data sheet status Change notice Supersedes BC846BMB v.1 20120515 Product data sheet - - BC846BMB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2012 © NXP B.V. 2012. All rights reserved. 8 of 11 BC846BMB NXP Semiconductors 65 V, 100 mA NPN general-purpose transistor 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 14.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. BC846BMB Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2012 © NXP B.V. 2012. All rights reserved. 9 of 11 BC846BMB NXP Semiconductors 65 V, 100 mA NPN general-purpose transistor Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] BC846BMB Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 15 May 2012 © NXP B.V. 2012. All rights reserved. 10 of 11 BC846BMB NXP Semiconductors 65 V, 100 mA NPN general-purpose transistor 16. Contents 1 1.1 1.2 1.3 1.4 2 3 4 4.1 5 6 7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Binary marking code description. . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2012. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 15 May 2012 Document identifier: BC846BMB