TI TLC374IDRG4

TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
D
D
D
D
D
D
D
D
D
D
Single- or Dual-Supply Operation
Wide Range of Supply Voltages
2 V to 18 V
Very Low Supply Current Drain 0.3 mA Typ
at 5 V
Fast Response Time . . . 200 ns Typ for
TTL-Level Input Step
Built-In ESD Protection
High Input Impedance . . . 1012 Ω Typ
Extremely Low Input Bias Current 5 pA Typ
Ultrastable Low Input Offset Voltage
Input Offset Voltage Change at Worst-Case
Input Conditions Typically 0.23 µV/Month,
Including the First 30 Days
Common-Mode Input Voltage Range
Includes Ground
Outputs Compatible With TTL, MOS, and
CMOS
Pin-Compatible With LM339
D, J, N, OR PW PACKAGE
(TOP VIEW)
1OUT
2OUT
VDD
2IN –
2IN +
1IN –
1IN +
14
2
13
3
12
4
11
5
10
6
9
7
8
3OUT
4OUT
GND
4IN +
4IN –
3IN +
3IN –
FK PACKAGE
(TOP VIEW)
VDD
NC
2IN –
NC
2IN +
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
GND
NC
4IN +
NC
4IN –
1IN–
1IN+
NC
3IN–
3IN+
description
These quadruple differential comparators are
fabricated using LinCMOS technology and
consist of four independent voltage comparators
designed to operate from a single power supply.
Operation from dual supplies is also possible if the
difference between the two supplies is 2 V to 18 V.
Each device features extremely high input
impedance (typically greater than 1012 Ω),
allowing direct interfacing with high-impedance
sources. The outputs are n-channel open-drain
configurations and can be connected to achieve
positive-logic wired-AND relationships.
1
2OUT
1OUT
NC
3OUT
4OUT
D
D
NC – No internal connection
symbol (each comparator)
IN +
OUT
IN –
The TLC374 has internal electrostatic discharge (ESD) protection circuits and has been classified with a 1000-V
ESD rating using human body model testing. However, care should be exercised in handling this device as
exposure to ESD may result in degradation of the device parametric performance.
The TLC374C is characterized for operation from 0°C to 70°C. The TLC374I is characterized for operation from
– 40° to 85°C. The TLC374M is characterized for operation over full military temperature range of
– 55°C to 125°C. The TLC374Q is characterized for operation from – 40°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinCMOS is a trademark of Texas Instruments Incorporated.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL OUTLINE
(D)
CHIP CARRIER
(FK)
CERAMIC DIP
(J)
PLASTIC DIP
(N)
TSSOP
(PW)
CHIP
FORM
(Y)
5 mV
TLC374CD
—
—
TLC374CN
TLC374CPW
TLC374Y
TA
VIO max
AT 25°C
0°C to 70°C
– 40°C to 85°C
5 mV
TLC374ID
—
—
TLC374IN
—
—
– 55°C to 125°C
5 mV
TLC374MD
TLC374MFK
TLC374MJ
TLC374MN
—
—
– 40°C to 125°C
5 mV
TLC374QD
—
—
TLC374QN
—
—
The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC374CDR).
equivalent schematic (each comparator)
Common to All Channels
VDD
OUT
GND
IN +
2
POST OFFICE BOX 655303
IN –
• DALLAS, TEXAS 75265
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
TLC374Y chip information
This chip, when properly assembled, displays characteristics similar to the TLC374C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
VDD
(3)
BONDING PAD ASSIGNMENTS
(13)
(12)
(11)
(10)
(9)
1IN +
(7)
(6)
1IN –
2OUT
(14)
(8)
3IN +
(7)
(9)
3IN –
(1)
4OUT
(1)
1OUT
–
+
(2)
(8)
65
+
–
+
(5)
(4)
2IN +
2IN –
(14)
3OUT
–
+
(13)
–
(11)
(10)
4IN +
4IN –
(12)
GND
(2)
(3)
(4)
(5)
(6)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
90
TJMAX = 150°C
TOLERANCES ARE ± 10%
ALL DIMENSIONS ARE IN MILS.
PIN (12) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VDD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDD
Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 18 V
Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Input current, II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 5 mA
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Duration of output short circuit to ground (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA: TLC374C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
TLC374I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
TLC374M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C
TLC374Q . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Case temperature range for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: D, N, or PW package . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: J package . . . . . . . . . . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values except differential voltages are with respect to network ground.
2. Differential voltages are at IN+ with respect to IN –.
3. Short circuits from outputs to VDD can cause excessive heating and eventual device destruction.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING
FACTOR
DERATE
ABOVE TA
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
TA = 125°C
POWER RATING
D
500 mW
7.6 mW/°C
84°C
500 mW
494 mW
190 mW
FK
500 mW
11.0 mW/°C
104°C
500 mW
500 mW
269 mW
J
500 mW
11.0 mW/°C
104°C
500 mW
500 mW
269 mW
N
500 mW
9.2 mW/°C
95°C
500 mW
500 mW
224 mW
PW
700 mW
5.6 mW/°C
448 mW
—
—
—
recommended operating conditions
TLC374C
MIN
Supply voltage, VDD
Common mode input voltage,
voltage VIC
Common-mode
VDD = 5 V
VDD = 10 V
Operating free-air temperature, TA
4
POST OFFICE BOX 655303
TLC374I
TLC374M
TLC374Q
MAX
MIN
MAX
MIN
MAX
MIN
3
16
3
16
4
16
3
16
0
3.5
0
3.5
0
3.5
0
3.5
0
8.5
0
8.5
0
8.5
0
8.5
0
70
– 40
85
– 55
125
– 40
125
• DALLAS, TEXAS 75265
MAX
UNIT
V
V
°C
electrical characteristics at specified free-air temperature, VDD = 5 V
PARAMETER
VIO
Input offset voltage
IIO
Input offset current
IIB
VICR
TEST CONDITIONS
VIC = VICRmin
min, See Note 4
TA†
TLC374C
MIN
25°C
TYP
1
Full range
VOH = 5 V
VOH = 15 V
VOL
Low level output voltage
Low-level
VID = – 1 V
V,
IOL = 4 mA
IOL
Low-level output current
VID = –1 V,
VOL = 1.5 V
IDD
Supply
y current
(four comparators)
VID = 1 V
V,
No load
5
1
7
1
5
5
2
25°C
Full range
0 to
VDD – 1.5
0 to
VDD – 1.5
0 to
VDD – 1.5
0.1
25°C
150
Full range
25°C
0.1
1
150
700
6
25°C
16
300
Full range
0.1
150
700
6
600
16
300
800
400
700
6
600
nA
nA
1
400
nA
V
1
400
mV
pA
20
0 to
VDD – 1
UNIT
pA
10
0 to
VDD – 1
25°C
5
1
1
0.6
MAX
10
0 to
VDD – 1
Full range
TYP
16
300
800
µA
mV
mA
600
800
µA
† All characteristics are measured with zero common-mode input voltage unless otherwise noted. Full range is 0°C to 70°C for TLC374C, – 40°C to 85°C for TLC374I, and – 55°C to
125°C for the TLC374M, and – 40°C to 125°C for TLC374Q. MAX is 70°C for TLC374C, 85°C TLC374I, and 125°C for the TLC374M, and 125°C for TLC374Q. IMPORTANT: See
Parameter Measurement Information.
NOTE 4: The offset voltage limits given are the maximum values required to drive the output above 4 V or below 400 mV with a 10-kΩ resistor between the output and VDD. They can
be verified by applying the limit value to the input and checking for the appropriate output state.
switching characteristics, VDD = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TLC374C, TLC374I
TLC374M, TLC374Q
MIN
Response time
RL connected to 5 V through
g 5.1 kΩ,
CL = 15 pF ‡,
See Note 5
TYP
100-mV input step with 5-mV overdrive
650
TTL-level input step
200
‡ CL includes probe and jig capacitance.
NOTE 5: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
UNIT
MAX
ns
5
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
VID = 1 V
1
5
MIN
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
High level output current
High-level
MAX
5
MAX
TLC374M
TYP
0.3
25°C
IOH
MIN
1
MAX
Common-mode input
voltage range
MAX
6.5
25°C
Input bias current
TLC374I
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
electrical characteristics at specified free-air temperature, VDD = 5 V, TA = 25°C (unless otherwise
noted)
PARAMETER
TLC374Y
TEST CONDITIONS
VIC = VICRmin,
MIN
See Note 4
TYP
MAX
1
5
UNIT
VIO
IIO
Input offset voltage
Input offset current
1
pA
IIB
VICR
Input bias current
5
pA
IOH
VOL
High-level output current
0.1
nA
IOL
IDD
Low-level output current
Common-mode input voltage range
0 to VDD – 1
Low-level output voltage
Supply current (four comparators)
VID = 1 V,
VID = – 1 V,
VOH = 5 V
IOL = 4 mA
VID = – 1 V,
VID =1 V,
VOL = 1.5 mV
No load
V
150
6
mV
400
16
300
mV
mA
600
µA
NOTE 4: The offset voltage limits given are the maximum values required to drive the output above 4 V or below 400 mV with a 10-kΩ resistor
between the output and VDD. They can be verified by applying the limit value to the input and checking for the appropriate output state.
switching characteristics, VDD = 5 V, TA = 25°C
PARAMETER
Response time
TEST CONDITIONS
RL connected to 5 V through
g 5.1 kΩ,
CL = 15 pF †,
See Note 5
TLC374Y
MIN
TYP
100-mV input step with 5-mV overdrive
650
TTL-level input step
200
MAX
† CL includes probe and jig capacitance.
NOTE 4: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
ns
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
PARAMETER MEASUREMENT INFORMATION
The digital output stage of the TLC374 can be damaged if it is held in the linear region of the transfer curve.
Conventional operational amplifier/comparator testing incorporates the use of a servo loop that is designed to force
the device output to a level within this linear region. Since the servo-loop method of testing cannot be used, the
following alternative for measuring parameters such as input offset voltage, common-mode rejection, etc., are
offered.
To verify that the input offset voltage falls within the limits specified, the limit value is applied to the input as shown
in Figure 1(a). With the noninverting input positive with respect to the inverting input, the output should be high. With
the input polarity reversed, the output should be low.
A similar test can be made to verify the input offset voltage at the common-mode extremes. The supply voltages can
be slewed as shown in Figure 1(b) for the VICR test, rather than changing the input voltages, to provide greater
accuracy.
A close approximation of the input offset voltage can be obtained by using a binary search method to vary the
differential input voltage while monitoring the output state. When the applied input voltage differential is equal, but
opposite in polarity to the input offset voltage, the output changes state.
5V
1V
5.1 kΩ
5.1 kΩ
Applied VIO
Limit
VO
Applied VIO
Limit
VO
–4 V
(a) VIO WITH VIC = 0
(b) VIO WITH VIC = 4 V
Figure 1. Method for Verifying That Input Offset Voltage is Within Specified Limits
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
PARAMETER MEASUREMENT INFORMATION
Figure 2 illustrates a practical circuit for direct dc measurement of input offset voltage that does not bias the
comparator into the linear region. The circuit consists of a switching-mode servo loop in which U1a generates a
triangular waveform of approximately 20-mV amplitude. U1b acts as a buffer with C2 and R4 removing any residual
dc offset. The signal is then applied to the inverting input of the comparator under test, while the noninverting input
is driven by the output of the integrator formed by U1c through the voltage divider formed by R9 and R10. The loop
reaches a stable operating point when the output of the comparator under test has a duty cycle of exactly 50%, which
can only occur when the incoming triangle wave is sliced symmetrically or when the voltage at the noninverting input
exactly equals the input offset voltage.
Voltage divider R9 and R10 provide a step up of the input offset voltage by a factor of 100 to make measurement
easier. The values of R5, R8, R9, and R10 can significantly influence the accuracy of the reading; therefore, it is
suggested that their tolerance level be 1% or lower.
Measuring the extremely low values of input current requires isolation from all other sources of leakage current and
compensation for the leakage of the test socket and board. With a good picoammeter, the socket and board leakage
can be measured with no device in the socket. Subsequently, this open-socket leakage value can be subtracted from
the measurement obtained with a device in the socket to obtain the actual input current of the device.
VDD
U1b
1/4 TLC274CN
Buffer
+
C2
1 µF
–
R4
47 kΩ
R1
240 kΩ
+
C1
0.1 µF
–
R6
5.1 kΩ
R2
R3
10 kΩ
100 kΩ
C3
0.68 µF
U1c
1/4 TLC274CN
–
DUT
R7
1 MΩ
R8
1.8 kΩ, 1%
U1a
1/4 TLC274CN
Triangle
Generator
R5
1.8 kΩ, 1%
R10
100 Ω, 1%
+
Integrator
C4
0.1 µF
R9
10 kΩ, 1%
Figure 2. Test Circuit for Input Offset Voltage Measurement
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
VIO
(X100)
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
PARAMETER MEASUREMENT INFORMATION
Response time is defined as the interval between the application of an input step function and the instant when the
output reaches 50% of its maximum value. Response time, low-to-high-level output, is measured from the trailing
edge of the input pulse. Response-time measurement at low input signal levels can be greatly affected by the input
offset voltage. The offset voltage should be balanced by the adjustment at the inverting input (as shown in Figure 3)
so that the circuit is just at the transition point. Then a low signal, for example, 105-mV or 5-mV overdrive, causes
the output to change state.
VDD
1 µF
5.1 kΩ
Pulse Generator
OUT
CL
(see Note A)
50 Ω
1V
Input
Offset Voltage
Compensation
Adjustment
10 Ω
10 Turn
1 kΩ
0.1 µF
–1 V
TEST CIRCUIT
Overdrive
100 mV
Overdrive
Input
Input
100 mV
90%
50%
Low-to-HighLevel Output
10%
High-to-LowLevel Output
90%
50%
10%
tf
tr
tPLH
tPLH
VOLTAGE WAVEFORMS
NOTE A: CL includes probe and jig capacitance.
Figure 3. Response, Rise, and Fall Times Test Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
PRINCIPLES OF OPERATION
LinCMOS process
LinCMOS process is a linear polysilicon-gate complimentary-MOS process. Primarily designed for singlesupply applications, LinCMOS products facilitate the design of a wide range of high-performance analog
functions from operational amplifiers to complex mixed-mode converters.
While digital designers are experienced with CMOS, MOS technologies are relatively new for analog designers.
This short guide is intended to answer the most frequently asked questions related to the quality and reliability
of LinCMOS products. Further questions should be directed to the nearest TI field sales office.
electrostatic discharge
CMOS circuits are prone to gate oxide breakdown when exposed to high voltages even if the exposure is only
for very short periods of time. Electrostatic discharge (ESD) is one of the most common causes of damage to
CMOS devices. It can occur when a device is handled without proper consideration for environmental
electrostatic charges, e.g. during board assembly. If a circuit in which one amplifier from a dual operational
amplifier is being used and the unused pins are left open, high voltages tends to develop. If there is no provision
for ESD protection, these voltages may eventually punch through the gate oxide and cause the device to fail.
To prevent voltage buildup, each pin is protected by internal circuitry.
Standard ESD-protection circuits safely shunt the ESD current by providing a mechanism whereby one or more
transistors break down at voltages higher than normal operating voltages but lower than the breakdown voltage
of the input gate. This type of protection scheme is limited by leakage currents which flow through the shunting
transistors during normal operation after an ESD voltage has occurred. Although these currents are small, on
the order of tens of nanoamps, CMOS amplifiers are often specified to draw input currents as low as tens of
picoamps.
To overcome this limitation, TI design engineers developed the patented ESD-protection circuit shown in
Figure 4. This circuit can withstand several successive 1-kV ESD pulses, while reducing or eliminating leakage
currents that may be drawn through the input pins. A more detailed discussion of the operation of TI’s
ESD-protection circuit is presented on the next page.
All input an output pins of LinCMOS and Advanced LinCMOS products have associated ESD-protection
circuitry that undergoes qualification testing to withstand 1000 V discharged from a 100-pF capacitor through
a 1500-Ω resistor (human body model) and 200 V from a 100-pF capacitor with no current-limiting resistor
(charged device model). These tests simulate both operator and machine handling of devices during normal
test and assembly operations.
VDD
R1
Input
To Protected Circuit
R2
Q1
Q2
D1
D2
D3
VSS
Figure 4. LinCMOS ESD-Protection Schematic
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
PRINCIPLES OF OPERATION
Input protection circuit operation
Texas Instruments patented protection circuitry allows for both positive- and negative-going ESD transients.
These transients are characterized by extremely fast rise times and usually low energies, and can occur both
when the device has all pins open and when it is installed in a circuit.
positive ESD transients
Initial positive charged energy is shunted through Q1 to VSS. Q1 turns on when the voltage at the input rises
above the voltage on VDD by a value equal to the VEB of Q1. The base current increases through R2 with input
current as Q1 saturates. The base current through R2 as Q1 saturates forces the voltage at the drain and gate
of Q2 to exceed its threshold level (VT ∼ 22 to 26 V) and turn on Q2. The shunted input current through Q1 to
VSS is now shunted through the n-channel enhancement-type MOSFET Q2 to VSS. If the voltage on the input
pin continues to rise, the breakdown voltage of d3 is exceeded and all remaining energy is dissipated in R1 and
D3. The breakdown voltage of D3 is designed to be 24 V to 27 V, which is well below the gate oxide voltage of
the circuit to be protected.
negative ESD transients
The negative charged ESD transients are shunted directly through D1. Additional energy is dissipated in R1
and D2 as D2 becomes forward-biased. The voltage seen by the protected circuit is – 0.3 V to – 1 V (the forward
voltage of D1 and D2).
circuit-design considerations
LinCMOS products are being used in actual circuits environments that have input voltages that exceed the
recommended common-mode input voltage range and activate the input protection circuit. Even under normal
operation, these conditions occur during circuit power up or power down, and in many cases, when the device
is being used for a signal conditioning function. The input voltages can exceed VICR and not damage the device
only if the inputs are current limited. The recommended current limit shown on most product data sheets is
± 5 mA. Figures 5 and 6 show typical characteristics for input voltage vs input current.
Normal operation and correct output state can be expected even when the input voltage exceeds the positive
supply voltage. The input current should be externally limited even through internal positive current limiting is
achieved in the input protection circuit by the action of Q1. When Q1 is on, it saturates and limits the current
to approximately 5-mA collector current by design. When saturated, Q1 base current increases with input
current. This current is forced into the VDD pin and into the device IDD or the VDD supply through R2 producing
the current limiting effects shown in Figure 5. This internal limiting lasts only as long as the input voltage is below
the VT of Q2.
When the input voltage exceeds the negative supply voltage, normal operation is affected and output voltage
states may not be correct. Also, the isolation between channels of multiple devices (duals and quads) can be
severely affected. External current limiting must be used since this current is directly shunted by D1 and D2,
and no internal limiting is achieved. If normal output voltage states are required, an external input voltage clamp
is required (see Figure 7).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
PRINCIPLES OF OPERATION
INPUT CURRENT
vs
INPUT VOLTAGE†
INPUT CURRENT
vs
INPUT VOLTAGE†
8
10
TA = 25°C
9
7
TA = 25°C
IIII – Input Current – mA
IIII – Input Current – mA
8
6
5
4
3
7
6
5
4
3
2
2
1
1
0
VDD
VDD + 4
VDD + 8
VI – Input Voltage – V
0
VDD– 0.3
VDD + 12
† The dashed line identifies an area of operation where some
degradation of parametric performance may be experienced.
VDD – 0.5
VDD – 0.7
VI – Input Voltage – V
VDD – 0.9
† The dashed line identifies an area of operation where some
degradation of parametric performance may be experienced.
Figure 5
Figure 6
VDD
RL
VI
+
VREF
1/4
TLC374
–
See Note A
RL
Positive Voltage Input Current Limit:
+VI – VDD – 0.3 V
RI =
5 mA
Negative Voltage Input Current Limit:
–VI – VDD – (0.3 V)
RI =
5 mA
NOTE A: If the correct output state is required when the negative input exceeds VSS, a Schotty clamp is required.
Figure 7. Typical Input Current-Limiting Configuration for a LinCMOS Comparator
12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
MECHANICAL INFORMATION
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0.050 (1,27)
0.020 (0,51)
0.014 (0,35)
14
0.010 (0,25) M
8
0.008 (0,20) NOM
0.244 (6,20)
0.228 (5,80)
0.157 (4,00)
0.150 (3,81)
Gage Plane
0.010 (0,25)
1
7
0°– 8°
A
0.044 (1,12)
0.016 (0,40)
Seating Plane
0.069 (1,75) MAX
0.010 (0,25)
0.004 (0,10)
PINS **
0.004 (0,10)
8
14
16
A MAX
0.197
(5,00)
0.344
(8,75)
0.394
(10,00)
A MIN
0.189
(4,80)
0.337
(8,55)
0.386
(9,80)
DIM
4040047 / D 10/96
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
Falls within JEDEC MS-012
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
MECHANICAL INFORMATION
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
25
5
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
14
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
MECHANICAL INFORMATION
J (R-GDIP-T**)
CERAMIC DUAL-IN-LINE PACKAGE
14 PIN SHOWN
PINS **
14
16
18
20
A MAX
0.310
(7,87)
0.310
(7,87)
0.310
(7,87)
0.310
(7,87)
A MIN
0.290
(7,37)
0.290
(7,37)
0.290
(7,37)
0.290
(7,37)
B MAX
0.785
(19,94)
0.785
(19,94)
0.910
(23,10)
0.975
(24,77)
B MIN
0.755
(19,18)
0.755
(19,18)
C MAX
0.280
(7,11)
0.300
(7,62)
0.300
(7,62)
0.300
(7,62)
C MIN
0.245
(6,22)
0.245
(6,22)
0.245
(6,22)
0.245
(6,22)
DIM
B
14
8
C
1
7
0.065 (1,65)
0.045 (1,14)
0.100 (2,54)
0.070 (1,78)
0.020 (0,51) MIN
0.930
(23,62)
A
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.100 (2,54)
0.023 (0,58)
0.015 (0,38)
0°– 15°
0.014 (0,36)
0.008 (0,20)
4040083/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification only on press ceramic glass frit seal only.
Falls within MIL-STD-1835 GDIP1-T14, GDIP1-T16, GDIP1-T18, and GDIP1-T20
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
MECHANICAL INFORMATION
N (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
16 PIN SHOWN
PINS **
14
16
18
20
A MAX
0.775
(19,69)
0.775
(19,69)
0.920
(23.37)
0.975
(24,77)
A MIN
0.745
(18,92)
0.745
(18,92)
0.850
(21.59)
0.940
(23,88)
DIM
A
16
9
0.260 (6,60)
0.240 (6,10)
1
8
0.070 (1,78) MAX
0.035 (0,89) MAX
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.010 (0,25) M
0°– 15°
0.010 (0,25) NOM
14/18 PIN ONLY
4040049/C 08/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001 (20 pin package is shorter then MS-001.)
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLC374, TLC374Q, TLC374Y
LinCMOS QUADRUPLE DIFFERENTIAL COMPARATORS
SLCS118C – NOVEMBER 1983 – REVISED MARCH 1999
MECHANICAL INFORMATION
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PIN SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
0,75
0,50
A
Seating Plane
1,20 MAX
0,10
0,05 MIN
PINS **
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064 / E 08/96
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
PACKAGE OPTION ADDENDUM
www.ti.com
12-Oct-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-87659012A
ACTIVE
LCCC
FK
20
1
TBD
5962-8765901CA
ACTIVE
CDIP
J
14
1
TBD
A42 SNPB
TLC374CD
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374CDG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374CDR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374CDRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374CN
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC374CN-A
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC374CN-AE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC374CNE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC374CNSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374CNSRG4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374CPW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374CPWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374CPWLE
OBSOLETE
TSSOP
PW
14
TLC374CPWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374CPWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374ID
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
TLC374IDG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
TLC374IDR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
TLC374IDRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
Call TI
Level-1-260C-UNLIM
TLC374IN
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLC374INE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TBD
POST-PLATE N / A for Pkg Type
Call TI
N / A for Pkg Type
Call TI
TLC374MD
ACTIVE
SOIC
D
14
50
TBD
CU NIPDAU
Level-1-220C-UNLIM
TLC374MDG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TLC374MFKB
ACTIVE
LCCC
FK
20
1
TBD
TLC374MJ
ACTIVE
CDIP
J
14
1
TBD
Addendum-Page 1
POST-PLATE N / A for Pkg Type
A42 SNPB
N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com
12-Oct-2007
Orderable Device
Status (1)
Package
Type
Package
Drawing
TLC374MJB
ACTIVE
CDIP
J
Pins Package Eco Plan (2)
Qty
14
1
TBD
Lead/Ball Finish
A42 SNPB
MSL Peak Temp (3)
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLC374CDR
D
14
SITE 60
330
16
6.5
9.0
2.1
8
16
Q1
TLC374CNSR
NS
14
SITE 41
330
16
8.2
10.5
2.5
12
16
Q1
TLC374CPWR
PW
14
SITE 41
330
12
7.0
5.6
1.6
8
12
Q1
TLC374IDR
D
14
SITE 60
330
16
6.5
9.0
2.1
8
16
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
4-Oct-2007
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TLC374CDR
D
14
SITE 60
346.0
346.0
33.0
TLC374CNSR
NS
14
SITE 41
346.0
346.0
33.0
TLC374CPWR
PW
14
SITE 41
346.0
346.0
29.0
TLC374IDR
D
14
SITE 60
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
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improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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