Datasheet

TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
SP4061 Series 2.5V 20A Diode Array
Pb GREEN
RoHS
The SP4061 integrates 4 channels of low capacitance
diodes with an additional zener diode to protect sensitive
I/O pins against lightning induced surge events and
ESD. This robust device can safely absorb up to 20A per
IEC61000-4-5 (tP=8/20μs) without performance degradation
and a minimum ±30kV ESD per IEC61000-4-2 international
standard. The low loading capacitance makes the SP4061
ideal for protecting high-speed signal pins.
Pinout
Features
1
3
5
GND
9
t&4%*&$
±30kV contact, ±30kV air
t-PXDBQBDJUBODFPGQ'
(TYP) per I/O
t&'5*&$"
(tp=5/50ns)
t-PXMFBLBHFDVSSFOUPG
1μA (MAX) at 2.5V
t-JHIUOJOH*&$
20A (tp=8/20μs)
7
Functional Block Diagram
9
Applications
7
5
t&UIFSOFU
Interfaces
t7P*11IPOFT
t$VTUPNFS1SFNJTF
Equipment (CPE)
t1#94ZTUFNT
t4FU5PQ#PYFT
Application Example
RJ-45 Connector
*Package is shown as transparent
Ethernet PHY
Tx+
J1
1
GND
Tx-
3
SP4061
PHY
Rx+
J8
Rx-
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
161
Revision: March 20, 2012
SP4061 Series
SP4061
Description
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
Parameter
Units
Rating
Units
-65 to 150
°C
Peak Current (tp=8/20μs)
20.0
A
PPK
Peak Pulse Power (tp=8/20μs)
300
W
Maximum Junction Temperature
150
°C
Maximum Lead Temperature
(Soldering 20-40s)
260
°C
TOP
Operating Temperature
-40 to 85
ºC
TSTOR
Storage Temperature
-50 to 150
°C
SP4061
IPP
Storage Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Electrical Characteristics (TOP=25ºC)
Parameter
Symbol
Reverse Standoff Voltage
VRWM
Test Conditions
Min
Snap Back Voltage
VSB
ISB=50mA
Reverse Leakage Current
ILEAK
VR=2.5V, I/O to GND
Clamp Voltage1
VC
Dynamic Resistance
RDYN
ESD Withstand Voltage1
VESD
Diode Capacitance
Typ
Units
2.5
V
2.0
V
0.5
1.0
μA
IPP=1A, tp=8/20μs, Fwd
5.0
V
IPP=5A, tp=8/20μs, Fwd
6.3
V
IPP=10A, tp=8/20μs, Fwd
8.0
V
IPP=20A, tp=8/20μs, Fwd
11.5
V
(VC2-VC1)/(IPP2-IPP1)
0.35
Ω
IEC61000-4-2 (Contact)
±30
kV
IEC61000-4-2 (Air)
±30
kV
1
CI/O-GND
Reverse Bias=0V
3.5
1
CI/O-I/O
Reverse Bias=0V
2.0
Diode Capacitance
Max
5.0
pF
pF
Note: 1. Parameter is guaranteed by design and/or device characterization.
Pulse Waveform
Clamping Voltage vs. IPP
110%
12.0
100%
10.0
90%
Clamp Voltage (VC)
Percent of IPP
80%
70%
60%
50%
40%
30%
8.0
6.0
4.0
2.0
20%
10%
0.0
0%
0.0
5.0
10.0
15.0
20.0
25.0
0
30.0
Time (μs)
SP4061 Series
5
10
15
20
Peak Pulse Current-IPP (A)
162
Revision: March 20, 2012
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP4061 Series
Ordering Information
Capacitance vs. Bias
5.0
Part Number
Package
Marking
Min. Order Qty.
SP4061-04UTG
μDFN-10
TH4
3000
3.0
SP4061
Capacitance (pF)
4.0
2.0
1.0
0.0
0.0
0.5
1.0
1.5
2.0
2.5
DC Bias (V)
Soldering Parameters
Reflow Condition
Pb – Free assembly
tP
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Temperature
TP
TL
TS(max)
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
25
time to peak temperature
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
SP 4061 - 04 U T G
G= Green
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
T= Tape & Reel
Package
U= μDFN-10
Series
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Substitute Material
Silicon
Body Material
Molded Epoxy
Time
Part Numbering System
Product Characteristics
Flammability
Critical Zone
TL to TP
Ramp-up
Number of
Channels
Part Marking System
T* 4
Number of
Product Series
Channels
T = SP4061
Assembly Site
UL 94 V-0
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4.. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
163
Revision: March 20, 2012
SP4061 Series
TVS of
Diode
Arrays (SPA™ Family of Products)
TVS Diode Arrays (SPA™ Family
Products)
Lightning Surge Protection - SP4061Lightning
Series Surge Protection - SP4061 Series
Package Dimensions — μDFN-10
Top View
A
D
Package
μDFN-10 (2.6x2.6mm)
JEDEC
MO-229
Millimeters
Inches
Symbol
E
A
Min
Nom
Max
Min
Nom
Max
0.45
0.50
0.55
0.018
0.020
0.022
A3
B
Side View
0.10 C
0.005 Ref
0.17
0.22
0.27
0.006
0.008
0.010
D
2.50
2.60
2.70
0.097
0.101
0.105
0.085
D2
2.10
2.15
2.20
0.081
0.083
E
2.50
2.60
2.70
0.097
0.101
0.105
E2
1.21
1.26
1.31
0.046
0.049
0.051
0.45
0.014
e
A3
0.50 BSC
L
0.35
0.020 BSC
0.40
0.016
0.018
Recommended Solder Pads μDFN-10L 2.6x2.6mm
A
Seating
Plane
0.130 Ref
b
0.05 C
C
b
0.10 M C B A
B
Bottom View
D2
Z
F
G
C
2X
Y
C
X
P
Dimension
E2
Symbol
Millimeters
Inches
B
2.30
0.091
C
2.20
0.087
F
1.41
0.056
G
1.65
0.065
P
0.50
0.020
X
0.37
0.015
Y
0.55
0.022
Z
2.75
0.108
e
Embossed Carrier Tape & Reel Specification — μDFN-10 (2.6x2.6mm)
P0
P2
Reel Size:7 inches
D0
P1
E
A0
F
T
W
D1
5º MAX
K0
B0
Pin 1 Location
5º MAX
Symbol
Millimeters
A0
2.82 +/- 0.05
B0
2.82 +/- 0.05
D0
Ø1.50 + 0.10
D1
Ø 0.50 + 0.05
E
1.75 +/- 0.10
F
3.50 +/- 0.05
K0
0.76 +/- 0.05
P0
4.00 +/- 0.10
P1
4.00 +/- 0.10
P2
2.00 +/- 0.05
T
0.25 +/- 0.02
W
8.00 + 0.30 /- 0.10
User Feeding Direction
SP4061 Series
164
Revision: March 20, 2012
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.