11-Mar-11 LTM4601 118LD 15mm X 15mm X 2.82mm (TABLE OF MATERIAL DECLARATION) The LTM4601 is RoHS compliant per EU RoHS Directive 2003/95/EC. No. 1 2 3 4 5 6 Note: It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) Component Weight Material Mass Materials Analysis Part Name Material Name Materials Analysis (element) CAS Number (gram) (weight %) (gram) Barium Compounds 7727-43-7 0.0017 1.50 Substrate Circuit Board 0.1151 Filler Substances (Silica 73776-74-4 0.0459 39.91 Crystalline) 7631-86-9 Copper Metal 7440-50-8 0.0645 56.00 Copper Compounds 1328-53-6 0.0000 0.02 Ecotoxic substances 7439-92-1 0.0000 0.00 Gold metal or alloy 7440-57-5 0.0005 0.46 Nickel 7440-02-0 0.0024 2.10 Zinc 7440-66-6 0.0000 0.01 0.0189 Sn 7440-31-5 0.0180 95.00 Solder Paste Alloy Sb 7440-36-0 0.0009 5.00 7439-89-6 Iron Powder (Fe) 0.3810 56.98 Passive/Active 0.6687 7440-50-8 Copper (Cu) 0.1519 22.72 Components 7440-02-0 Nickel (Ni) 0.0161 2.40 7440-31-5 Tin (Sn) 0.0076 1.14 Ceramic (Ba compounds) 12047-27-7 0.1121 16.77 Active Ics Silicon 0.0143 Silicon 7440-21-3 0.0143 100.00 Wire Gold 0.0024 Au 7440-57-5 0.0024 99.99 Encapsulation Epoxy Resin Fused Silica 60676-86-0 0.6893 77.20 0.8929 Epoxy Resin non-disclosure 0.0795 8.90 Phenol Resin non-disclosure 0.0795 8.90 Crytalline Silica 14808-60-7 0.0268 3.00 Carbon Black 1333-86-4 0.0045 0.50 Metal Hydroxide non-disclosure 0.0134 1.50 Total Package Weight 1.7124 Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts