HS-26CLV31RH TM Data Sheet August 2000 Radiation Hardened 3.3V Quad Differential Line Driver The Intersil HS-26CLV31RH is a radiation hardened 3.3V quad differential line driver designed for digital data transmission over balanced lines, in low voltage, RS-422 protocol applications. CMOS processing assures low power consumption, high speed, and reliable operation in the most severe radiation environments. The HS-26CLV31RH accepts CMOS level inputs and converts them to differential outputs. Enable pins allow several devices to be connected to the same data source and addressed independently. The device has unique outputs that become high impedance when the driver is disabled or powered-down, maintaining signal integrity in multi-driver applications. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-96663. A “hot-link” is provided on our homepage for downloading. www.intersil.com/spacedefense/space.htm INTERNAL MKT. NUMBER • Electrically Screened to SMD # 5962-96663 • QML Qualified per MIL-PRF-38535 Requirements • 1.2 Micron Radiation Hardened CMOS - Total Dose. . . . . . . . . . . . . . . . . . . . . 300 krad(Si)(Max) - Single Event Upset LET . . . . . . . . . . .100MeV/mg/cm2) - Single Event Latch-up Immune • Extremely Low Stand-by Current . . . . . . . . . 100µA (Max) • Operating Supply Range . . . . . . . . . . . . . . . . 3.0V to 3.6V • CMOS Level Inputs . . . . VIH > (.7)(VDD); VIL < (.3)(VDD) • Differential Outputs. . . . . . . . . . . VOH > 1.8V; VOL < 0.5V • High Impedance Outputs when Disabled or Powered Down • Low Output Impedance . . . . . . . . . . . . . . . . . 10Ω or Less • Full -55oC to 125oC Military Temperature Range Pinouts HS1-26CLV31RH (SBDIP) CDIP2-T16 TOP VIEW TEMP. RANGE (oC) 5962F9666302QEC HS1-26CLV31RH-8 -55 to 125 5962F9666302QXC HS9-26CLV31RH-8 -55 to 125 5962F9666302V9A HS0-26CLV31RH-Q 25 5962F9666302VEC HS1-26CLV31RH-Q -55 to 125 5962F9666302VXC HS9-26CLV31RH-Q -55 to 125 HS1-26CLV31RH/PROTO HS1-26CLV31RH/PROTO -55 to 125 HS9-26CLV31RH/PROTO HS9-26CLV31RH/PROTO -55 to 125 Logic Diagram ENABLE ENABLE DIN DO DO CIN BIN CO CO 1 BO BO AIN 1 16 VDD AO 2 15 DIN AO 3 14 DO ENABLE 4 13 DO BO 5 12 ENABLE BO 6 11 CO BIN 7 10 CO GND 8 9 CIN HS9-26CLV31RH (FLATPACK) CDFP4-F16 TOP VIEW AIN AO AO 4898 Features Ordering Information ORDERING NUMBER File Number AIN 1 16 VDD AO 2 15 DIN AO 3 14 DO ENABLE 4 13 DO BO 5 12 ENABLE BO 6 11 CO BIN 7 10 CO GND 8 9 CIN CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000 HS-26CLV31RH Die Characteristics DIE DIMENSIONS: 96.5 mils x 195 mils x 21 mils (2450 x 4950) Substrate: AVLSI1RA Backside Finish: Silicon INTERFACE MATERIALS: Glassivation: Type: PSG (Phosphorus Silicon Glass) Thickness: 8kÅ ± 1kÅ ASSEMBLY RELATED INFORMATION: Substrate Potential (Powered Up): VDD Metallization: Bottom: Mo/TiW Thickness: 5800Å ± 1kÅ Top: AlSiCu (Top) Thickness: 10kÅ ± 1kÅ ADDITIONAL INFORMATION: Worst Case Current Density: <2.0 x 105A/cm2 Bond Pad Size: 110µm x 100µm Metallization Mask Layout (15) DIN (16) VDD (1) AIN (16) VDD HS-26CLV31RH AO (2) (14) DO AO (3) (13) DO (12) ENABLE ENABLE (4) CIN (9) (10) CO ND (8) BO (6) ND (8) (11) CO BIN (7) BO (5) All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com 2