AON7442 30V N-Channel AlphaMOS General Description Product Summary • Latest Trench Power AlphaMOS (αMOS LV) technology • Very Low RDS(on) at 4.5VGS • Low Gate Charge • High Current Capability • RoHS and Halogen-Free Compliant Application • DC/DC Converters in Computing, Servers, and POL • Isolated DC/DC Converters in Telecom and Industrial VDS ID (at VGS=10V) 30V 50A RDS(ON) (at VGS=10V) < 1.9mΩ RDS(ON) (at VGS = 4.5V) < 3.3mΩ 100% UIS Tested 100% Rg Tested DFN 3.3x3.3 EP Bottom View Top View D Top View 1 8 2 7 3 6 4 5 G S Pin 1 Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage Continuous Drain CurrentG VGS TC=25°C Pulsed Drain Current C Continuous Drain Current Avalanche Current C Avalanche energy L=0.05mH VDS Spike C 100ns TC=25°C Power Dissipation B TA=25°C Power Dissipation A Junction and Storage Temperature Range Thermal Characteristics Parameter Maximum Junction-to-Ambient A Maximum Junction-to-Ambient A D Maximum Junction-to-Case Rev.2.0: January 2016 IAS 66 A EAS 109 mJ VSPIKE 36 V 83 Steady-State Steady-State W 33 6.2 RθJA RθJC www.aosmd.com W 4 TJ, TSTG Symbol t ≤ 10s A 35 PDSM TA=70°C A 44 PD TC=100°C V 200 IDSM TA=70°C ±20 39 IDM TA=25°C Units V 50 ID TC=100°C Maximum 30 -55 to 150 Typ 16 45 1.1 °C Max 20 55 1.5 Units °C/W °C/W °C/W Page 1 of 6 AON7442 Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter STATIC PARAMETERS Drain-Source Breakdown Voltage BVDSS IDSS Zero Gate Voltage Drain Current Conditions Min ID=250µA, VGS=0V Gate-Body leakage current VDS=0V, VGS= ±20V Gate Threshold Voltage VDS=VGS,ID=250µA RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=20A TJ=125°C IS=1A,VGS=0V IS Maximum Body-Diode Continuous Current G DYNAMIC PARAMETERS Ciss Input Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance Qgs Gate Source Charge 1.9 3.3 mΩ 1 V 50 A VGS=0V, VDS=0V, f=1MHz VGS=10V, VDS=15V, ID=20A 0.4 mΩ S 2994 VGS=0V, VDS=15V, f=1MHz SWITCHING PARAMETERS Qg(10V) Total Gate Charge Qg(4.5V) Total Gate Charge V 2.9 0.7 Diode Forward Voltage nA 2.2 1.5 153 Forward Transconductance VSD 100 2.3 2.4 gFS Output Capacitance 1.8 VGS=4.5V, ID=20A VDS=5V, ID=20A µA 5 1.2 Units V 1 TJ=55°C IGSS Max 30 VDS=30V, VGS=0V VGS(th) Coss Typ pF 1276 pF 196 pF 0.9 1.4 Ω 47.7 65 nC 23 31 nC 7.6 nC Qgd Gate Drain Charge 10 nC tD(on) Turn-On DelayTime 10.5 ns tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf Turn-Off Fall Time trr Body Diode Reverse Recovery Time Qrr 7.5 ns 30.8 ns 8.8 ns IF=20A, dI/dt=500A/µs 20 Body Diode Reverse Recovery Charge IF=20A, dI/dt=500A/µs 46 ns nC VGS=10V, VDS=15V, RL=0.75Ω, RGEN=3Ω A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The Power dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the user's specific board design. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Single pulse width limited by junction temperature TJ(MAX)=150°C. D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max. F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating. G. The maximum current rating is package limited. H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN, FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev.2.0: January 2016 www.aosmd.com Page 2 of 6 AON7442 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 100 100 VDS=5V 4.5V 80 80 10V 60 3.5V ID(A) ID (A) 60 3V 40 40 20 20 125°C 25°C VGS=2.5V 0 0 0 1 2 3 4 0 5 5 2 3 4 5 6 Normalized On-Resistance 1.8 4 RDS(ON) (mΩ Ω) 1 VGS(Volts) Figure 2: Transfer Characteristics (Note E) VDS (Volts) Fig 1: On-Region Characteristics (Note E) VGS=4.5V 3 2 1 VGS=10V VGS=10V ID=20A 1.6 1.4 1.2 VGS=4.5V ID=20A 1 0.8 0 0 5 0 10 15 20 25 30 ID (A) Figure 3: On-Resistance vs. Drain Current and Gate Voltage (Note E) 25 50 75 100 125 150 175 Temperature (°C) Figure 4: On-Resistance vs. Junction Temperature (Note E) 5 1.0E+02 ID=20A 1.0E+01 4 40 1.0E+00 125°C IS (A) RDS(ON) (mΩ Ω) 125°C 3 1.0E-01 1.0E-02 25°C 2 1.0E-03 25°C 1 1.0E-04 1.0E-05 0.0 0 2 4 6 8 VGS (Volts) Figure 5: On-Resistance vs. Gate-Source Voltage (Note E) Rev.2.0: January 2016 0.2 0.4 0.6 0.8 1.0 1.2 10 www.aosmd.com VSD (Volts) Figure 6: Body-Diode Characteristics (Note E) Page 3 of 6 AON7442 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 10 4000 VDS=15V ID=20A 3500 Ciss 8 Capacitance (pF) VGS (Volts) 3000 6 4 2500 2000 Coss 1500 1000 Crss 2 500 0 0 0 10 20 30 40 50 0 5 10µs RDS(ON) 400 20 25 10.0 100µs DC 1ms 10ms 1.0 TJ(Max)=150°C TC=25°C 0.1 0.0 0.01 TJ(Max)=150°C TC=25°C 10µs 0.1 1 Power (W) ID (Amps) 15 500 1000.0 100.0 10 VDS (Volts) Figure 8: Capacitance Characteristics Qg (nC) Figure 7: Gate-Charge Characteristics 300 200 100 10 0 0.0001 100 VDS (Volts) 0.001 0.01 0.1 1 10 Pulse Width (s) Figure 10: Single Pulse Power Rating Junction-to-Case (Note F) Figure 9: Maximum Forward Biased Safe Operating Area (Note F) Zθ JC Normalized Transient Thermal Resistance 10 D=Ton/T TJ,PK=TC+PDM.ZθJC.RθJC In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse RθJC=1.5°C/W 1 PDM 0.1 Single Pulse 0.01 0.00001 0.0001 Ton 0.001 0.01 0.1 T 1 10 Pulse Width (s) Figure 11: Normalized Maximum Transient Thermal Impedance (Note F) Rev.2.0: January 2016 www.aosmd.com Page 4 of 6 AON7442 TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 100 60 50 80 Current rating ID(A) Power Dissipation (W) 90 70 60 50 40 30 20 40 30 20 10 10 0 0 0 25 50 75 100 125 150 0 TCASE (° °C) Figure 12: Power De-rating (Note F) 25 50 75 100 125 150 TCASE (° °C) Figure 13: Current De-rating (Note F) TA=25°C Zθ JA Normalized Transient Thermal Resistance 10 D=Ton/T TJ,PK=TA+PDM.ZθJA.RθJA 1 In descending order D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse RθJA=55°C/W 40 0.1 PDM 0.01 Single Pulse Ton 0.001 0.0001 0.001 0.01 0.1 1 10 T 100 1000 Pulse Width (s) Figure 15: Normalized Maximum Transient Thermal Impedance (Note H) Rev.2.0: January 2016 www.aosmd.com Page 5 of 6 AON7442 Gate Charge Test Circuit & Waveform Vgs Qg 10V + + Vds VDC - Qgs Qgd VDC - DUT Vgs Ig Charge Resistive Switching Test Circuit & Waveforms RL Vds Vds 90% + Vdd DUT Vgs VDC - Rg 10% Vgs Vgs t d(on) tr t d(off) t on tf toff Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L 2 E AR = 1/2 LIAR Vds BVDSS Vds Id + Vdd Vgs Vgs I AR VDC - Rg Id DUT Vgs Vgs Diode Recovery Test Circuit & Waveforms Q rr = - Idt Vds + DUT Vds Isd Vgs Ig Rev.2.0: January 2016 Vgs L Isd + Vdd t rr dI/dt I RM Vdd VDC - IF Vds www.aosmd.com Page 6 of 6