MCDS - Easy2-B

Material Content Data Sheet
Umbrella Spec
Date
Revision
Construction element
chip
substrate including
metallisation
wire
encapsulation
housing
clamp
lead, finish and plating
SMD (including thermistors,
resistors and shunts)
deviation
Easy2 B-Series
2015-02-06
3.1
RoHS compliant
Material group
Materials
CAS-Nr.
if applicable
inorganic material silicon
7440-21-3
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
non noble metal
polymers
polymers
inorganic material
plastics
plastics
inorganic material
ferrous metal
non noble metal
non noble metal
non noble metal
non noble metal
copper
aluminium oxid
tin
silver
magnesium
cobalt
aluminium
silicone gel
PBT
antimonytrioxide
brominated resin
chlorinated resin
silicondioxide / glasfiber
X12CrNi17-7(1.4310)
tin
copper
zinc
nickel
7440-50-8
1344-28-1
7440-31-5
7440-22-4
7439-95-4
7440-48-4
7429-90-5
inorganic material
non noble metal
non noble metal
noble metal
<25%
lead oxide
copper
tin
silver
1317-36-8
7440-50-8
7440-31-5
7440-22-4
Weight range of product family
**
Fluctuation margin
1309-64-4
7440-31-5
7440-50-8
7440-66-6
7440-02-0
Average
mass
[%]*
1
Sum
[%]
Yes
Traces
1
28,8
20,4
6,6
0,9
0,9
X
X
1
14,4
27,6
2,9
2
1,4
15,1
2,7
1
14,4
49
5,8
X
3,1
X
X
0,1
RoHS compliant
X
X
X
Sum in total
100
41,0 g
<25%
*) related to component weight
**) Weight of particular product, see technical product information
Important Remarks:
1) This document provides full declaration of all materials present in Infineon products above a threshold
of 0,1 % b.w. (1000 ppm).
2) Trace concentrations (i.e. < 0,1 % b.w) present in products are marked with an "X" as far as they
represent substances-of-concern.
A list of substances-of-concern can be found at http://www.infineon.com/soc.
3) All statements are based on our present knowledge and are subject to change at any time due to
technical requirements and development.
Company
Address
Internet
Comment
Infineon Technologies
81726 AG
München
www.infineon.com