Material Content Data Sheet Umbrella Spec Date Revision Construction element chip substrate including metallisation wire encapsulation housing clamp lead, finish and plating SMD (including thermistors, resistors and shunts) deviation Easy2 B-Series 2015-02-06 3.1 RoHS compliant Material group Materials CAS-Nr. if applicable inorganic material silicon 7440-21-3 non noble metal inorganic material non noble metal noble metal non noble metal non noble metal non noble metal polymers polymers inorganic material plastics plastics inorganic material ferrous metal non noble metal non noble metal non noble metal non noble metal copper aluminium oxid tin silver magnesium cobalt aluminium silicone gel PBT antimonytrioxide brominated resin chlorinated resin silicondioxide / glasfiber X12CrNi17-7(1.4310) tin copper zinc nickel 7440-50-8 1344-28-1 7440-31-5 7440-22-4 7439-95-4 7440-48-4 7429-90-5 inorganic material non noble metal non noble metal noble metal <25% lead oxide copper tin silver 1317-36-8 7440-50-8 7440-31-5 7440-22-4 Weight range of product family ** Fluctuation margin 1309-64-4 7440-31-5 7440-50-8 7440-66-6 7440-02-0 Average mass [%]* 1 Sum [%] Yes Traces 1 28,8 20,4 6,6 0,9 0,9 X X 1 14,4 27,6 2,9 2 1,4 15,1 2,7 1 14,4 49 5,8 X 3,1 X X 0,1 RoHS compliant X X X Sum in total 100 41,0 g <25% *) related to component weight **) Weight of particular product, see technical product information Important Remarks: 1) This document provides full declaration of all materials present in Infineon products above a threshold of 0,1 % b.w. (1000 ppm). 2) Trace concentrations (i.e. < 0,1 % b.w) present in products are marked with an "X" as far as they represent substances-of-concern. A list of substances-of-concern can be found at http://www.infineon.com/soc. 3) All statements are based on our present knowledge and are subject to change at any time due to technical requirements and development. Company Address Internet Comment Infineon Technologies 81726 AG München www.infineon.com