SN65HVS882 www.ti.com ........................................................................................................................................................................................................ SLAS601 – MAY 2008 INDUSTRIAL 8-DIGITAL-INPUT SERIALIZER FEATURES APPLICATIONS • Eight Inputs – High Input Voltage – up to 34 V – Selectable Debounce Filters – 0 ms to 3 ms – Flexible Input Current Limit – 0.2 mA to 5.2 mA – Field Pins Protected to 15-kV HBM ESD • Output Drivers for External Status LEDs • Cascadable in Multiples of Eight Inputs • SPI-Compatible Interface • Regulated 5-V Output for External Isolator • Over-Temperature Indicator • 1 2 • • • Sensor Inputs for Industrial Automation and Process Control High Channel Count Digital Input Modules for PC and PLC Systems Decentralized I/O Modules Motion Control Systems DESCRIPTION The SN65HVS882 is an eight channel, digital-input serializer for high-channel density digital input modules in industrial automation. In combination with galvanic isolators the device completes the interface between the high voltage signals on the field-side and the low-voltage signals on the controller side. Input signals are current-limited and then validated by internal debounce filters. With the addition of a few external components, the input switching characteristics can be configured in accordance with IEC61131-2 for Type 1, 2, and 3 sensor switches. Upon the application of load and clock signals, input data is latched in parallel into the shift register and afterwards clocked out serially. Cascading of multiple devices is possible by connecting the serial output of the leading device with the serial input of the following device, enabling the design of high-channel count input modules. Multiple devices can be cascaded through a single serial port, reducing both the isolation channels and controller inputs required. Input status can be visually indicated via constant current LED outputs. The current limit on the inputs is set by a single external precision resistor. An integrated voltage regulator provides a 5-V output to supply low-power isolators. An on-chip temperature sensor provides diagnostic information for graceful shutdown and system safety. The SN65HVS882 is available in a 28-pin PWP PowerPAD™ package, allowing for efficient heat dissipation. The device is characterized for operation at temperatures from -40°C to 125°C. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated SN65HVS882 SLAS601 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com Voltage Regulator VCC Debounce Select DB0:DB1 Serial Input 5V 8 8 8 SERIALIZER LED Outputs RE0:RE7 2 Signal Conditioning Field Inputs IP0:IP7 5 V Out IREF Adj: RLIM Field Ground 3 Control Inputs LD, CE, CLK Serial Output DB0 DB1 IP0 RE0 IP1 RE1 IP2 RE2 IP3 RE3 IP4 RE4 RLIM VCC 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 GND SIP LD CLK CE SOP IP7 RE7 IP6 RE6 IP5 RE5 TOK 5VOP FUNCTIONAL BLOCK DIAGRAM Voltage Regulator VCC 5VOP 5V Temperature Sensor TOK Debounce Select DB0 Supply Monitor GND RE0 IP0 Adj. Current Thresholds SIP Current Sense & Voltage Sense RE7 IP7 DB1 Debounce Filter LD CE Channel 0 SERIALZER RLIM CLK Channel 7 SOP 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 SN65HVS882 www.ti.com ........................................................................................................................................................................................................ SLAS601 – MAY 2008 TERMINAL FUNCTIONS TERMINAL PIN NO. NAME DESCRIPTION 1, 2 DB0, DB1 3, 5, 7, 9, 11, 18, 20, 22 Debounce select inputs IPx Input channel x 4, 6, 8, 10, 12, 17, 19, 21 REx Return path x (LED drive) 13 RLIM Current limiting resistor 14 VCC 15 5VOP Field supply voltage 5-V output to supply low power isolators 16 TOK Temperature okay 23 SOP Serial data output 24 CE Clock enable input 25 CLK Serial clock input 26 LD Load pulse input 27 SIP Serial data input 28 GND Field ground Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 3 SN65HVS882 SLAS601 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT –0.3 to 36 V IPx –0.3 to 36 V Voltage at any logic input DB0, DB1, CLK, SIP, CE, LD –0.5 to 6 V Output current TOK, SOP ±8 mA All pins ±4 IPx,VCC ±15 VCC Field power input VIPx Field digital inputs VID IO Human-Body Model (2) VESD Electrostatic discharge PTOT Continuous total power dissipation TJ Junction temperature (1) (2) (3) (4) kV Charged-Device Model (3) All pins ±1 kV Machine Model (4) All pins ±100 V 170 °C See Thermal Characteristics Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. JEDEC Standard 22, Method A114-A. JEDEC Standard 22, Method C101 JEDEC Standard 22, Method A115-A THERMAL CHARACTERISTICS PARAMETER θJA Junction-to-air thermal resistance θJB Junction-to-board thermal resistance θJC Junction-to-case thermal resistance PD Device power dissipation TEST CONDITIONS MIN High-K JEDEC thermal resistance model IP0-IP7 = ICC and IIP-LIM = worst case with IP0-IP7 = RLIM = 25 kΩ, ILOAD = 50 mA on 5VOP, IP0-IP7 = RE0-RE7 = GND, fIP = 100 MHz IP0-IP7 = TYP MAX UNIT 35 °C/W 15 °C/W 4.27 °C/W VCC = 34 V VCC = 30 V 2600 VCC = 24 V mW VCC = 12 V RECOMMENDED OPERATING CONDITIONS MIN TYP MAX 10 34 V 0 4 V 5.5 34 V 0 0.8 V VCC Field supply voltage VIPL Field input low-state input voltage VIPH Field input high-state input voltage VIL Logic low-state input voltage VIH Logic high-state input voltage 2.0 RLIM Current limiter resistor 17 fIP (1) Input data rate (each field input) TA Free-air temperature, see Thermal Characteristics TJ (1) 4 0 25 5.5 V 500 kΩ 1 VCC ≤ 34 V –40 85 VCC ≤ 27 V –40 105 VCC ≤ 18 V –40 125 Junction temperature UNIT 150 Mbps °C °C Maximum data rate corresponds to 0 ms debounce time, (DB0 = open, DB1 = GND), and RIN = 0 Ω Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 SN65HVS882 www.ti.com ........................................................................................................................................................................................................ SLAS601 – MAY 2008 ELECTRICAL CHARACTERISTICS Over full-range of recommended operating conditions, unless otherwise noted PARAMETER TERMINAL TEST CONDITIONS MIN TYP MAX UNIT FIELD INPUTS VTH–(IP) Low-level input threshold voltage VTH+(IP) High-level input threshold voltage VHYS(IP) Input hysteresis VTH–(IN) Low-level input threshold voltage VTH+(IN) High-level input threshold voltage VHYS(IN) Input hysteresis Measured at field side of RIN RIP Input resistance IP0–IP7 3 V < VIPx < 6 V, RLIM = 25 kΩ IIP-LIM Input current limit IP0–IP7 RLIM = 25 kΩ tDB IRE-on Debounce times of input channels RE on-state current 4.0 IP0–IP7 RLIM = 25 kΩ 4.3 5.2 5.5 V 10 V 0.9 IP0–IP7 RE0–RE7 6 18 V < VCC <30 V, RIN = 1.2 kΩ ± 5%, RLIM = 25 kΩ, TA ≤ 85 °C 8.4 9.4 1 0.2 0.63 1.1 kΩ 3.15 3.6 4 mA DB0 = open, DB1 = GND 0 DB0 = GND, DB1 = open 1 DB0 = DB1 = open 3 RLIM = 25 kΩ, REx = GND 2.8 3.15 ms 3.5 mA 8.7 mA FIELD SUPPLY ICC(VCC) Supply current, no load VCC IP0 to IP7 = VCC, 5VOP = open, REX = GND, All logic inputs open 5V REGULATED OUTPUT VO(5V) Linear regulator output voltage ILIM(5V) Linear regulator output current limit ΔV5/ΔVCC Linear regulation 5VOP 10V < VCC < 34V, no load 4.5 5 5.5 10V < VCC < 34V, IL = 5mA 4.5 5 5.5 10V < VCC < 34V, IL = 20mA, TA ≤ 105°C 4.5 5 5.5 10V < VCC < 34V, IL = 50 mA, TA ≤ 85°C 4.5 5 5.5 115 5VOP, VCC 10V < VCC < 34V, IL = 5 mA, V mA 2 mV/V LOGIC INPUT AND OUTPUTS VOL Logic low-level output voltage VOH Logic high-level output voltage IIL Logic input leakage current TOVER Over-temperature indication, internal TSHDN Shutdown temperature, internal SOP, TOK IOL = 20 µA IOH = –20 µA DB0, DB1, SIP, LD, CE, CLK TOK 0.4 4 V –50 50 Product Folder Link(s): SN65HVS882 µA 150 °C 170 °C Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated V 5 SN65HVS882 SLAS601 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com TIMING REQUIREMENTS over operating free-air temperature range (unless otherwise noted) PARAMETER MIN TYP MAX UNIT tW1 CLK pulse duration See Figure 5 4 ns tW2 LD pulse duration See Figure 3 6 ns tSU1 SIP to CLK setup time See Figure 6 4 ns tH1 SIP to CLK hold time See Figure 6 2 ns tSU2 Falling edge to rising edge (CE to CLK) setup time See Figure 7 4 ns tREC LD to CLK recovery time See Figure 4 2 fCLK Clock pulse frequency See Figure 5 DC ns 100 MHz MAX UNIT SWITCHING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP tPLH1, tPHL1 CLK to SOP CL = 15 pF, see Figure 5 10 ns tPLH2, tPHL2 LD to SOP CL = 15 pF, see Figure 3 14 ns tr, tf Rise and fall times CL = 15 pF, see Figure 5 5 ns 6 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 SN65HVS882 www.ti.com ........................................................................................................................................................................................................ SLAS601 – MAY 2008 INPUT CHARACTERISTICS 102.0 101.0 9.4 100.5 100.0 8.8 99.5 8.6 99.0 8.4 98.5 8.2 98.0 –45 –35 –25 –15 –5 VTH+(IN) 9.2 9.0 VIN (V) IIP-LIM/IIP-LIM–25ºC(%) 101.5 9.6 VCC = 24 V VIN = 24 V RIN = 1.2 kΩ RLIM = 24.9 kΩ 5 15 25 35 45 55 65 75 85 95 VCC = 24 V RIN = 1.2 kΩ RLIM = 24.9 kΩ VTH–(IN) 8.0 –45 –35 –25 –15 –5 TA (ºC) 5 15 25 35 45 55 65 75 85 95 TA (ºC) Figure 1. Typical Current Limiter Variation vs Free-Air Temperature Figure 2. Typical Limiter Input Threshold Voltage Variation vs Free-Air Temperature Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 7 SN65HVS882 SLAS601 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com PARAMETER MEASUREMENT INFORMATION Waveforms For the complete serial interface timing, refer to Figure 19. tw2 LD LD t REC t PLH2 tPHL2 CLK SOP Figure 3. Parallel – Load Mode Figure 4. Serial – Shift Mode valid 1/fCLK t w1 SIP CLK tSU 1 tPLH1 tH1 tPHL1 CLK SOP tr tf Figure 5. Serial – Shift Mode Figure 6. Serial – Shift Mode CLK t SU2 CE CLK inhibited Figure 7. Serial – Shift Clock Inhibit Mode 8 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 SN65HVS882 www.ti.com ........................................................................................................................................................................................................ SLAS601 – MAY 2008 VOLTAGE REGULATOR PERFORMANCE CHARACTERISTICS 5.000 4 ILOAD = 5 mA 4.995 2 TA = 27°C 4.990 ILOAD = 0 mA 4.985 0 VOUT (V) ΔVOUT (mV) 6 –2 –4 4.980 4.975 –6 4.970 –8 4.965 4.960 –45 –35 –25 –15 –5 –10 0 5 10 15 20 25 30 35 5 15 25 35 45 55 65 75 85 95 TA (°C) VIN (V) Figure 8. Line Regulation 5.5 5.0 4.5 Figure 9. Output Voltage vs Free-Air Temperature RLOAD = 100 Ω VOUT (V) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 5 10 15 20 VIN (V) 25 30 35 Figure 10. Output Voltage vs Input Voltage RIN IPx IIN VTH(IN) VTH(IP) SN65HVS882 GND Figure 11. On/Off Threshold Voltage Measurements Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 9 SN65HVS882 SLAS601 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com DEVICE INFORMATION Digital Inputs V-REF 5V ILIM Mirror n = 72 IIN IPx ILIM Limiter IINmax = ILIM IREF RLIM Figure 12. Digital Input Stage Each digital input operates as a controlled current sink limiting the input current to a maximum value of ILIM. The current limit is derived from the reference current via ILIM = n × IREF, and IREF is determined by IREF = VREF/RLIM. Thus, changing the current limit requires the change of RLIM to a different value via: RLIM = n × VREF/ILIM. While the device is specified for a current limit of 3.6 mA, (via RLIM = 25 kΩ), it is easy to lower the current limit to further reduce the power consumption. For example, for a current limit of 2.5 mA simply calculate: RLIM = 90 90 = = 36 kΩ ILIM 2.5 mA Debounce Filter The HVS882 applies a simple analog/digital filtering technique to remove unintended signal transitions due to contact bounce or other mechanical effects. Any new input (either low or high) must be present for the duration of the selected debounce time to be latched into the shift register as a valid state. The logic signal levels at the control inputs, DB0 and DB1 of the internal Debounce-Select logic determine the different debounce times listed in the following truth table. Table 1. Debounce Times 10 DB1 DB0 FUNCTION Open Open 3 ms delay Open GND 1 ms delay GND Open 0 ms delay (filter bypassed) GND GND Reserved Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 SN65HVS882 www.ti.com ........................................................................................................................................................................................................ SLAS601 – MAY 2008 5V IPx REF REx RLIM GND Figure 13. Equivalent Input Diagram Shift Register The conversion from parallel input to serial output data is performed by an eight-channel serial-in parallel-out shift register. Parallel-in access is provided by the internal inputs, PIP0–PIP7, that are enabled by a low level at the load input (LD). When clocked, the latched input data shift towards the serial output (SOP). The shift register also provides a clock-enable function. Clocking is accomplished by a low-to-high transition of the clock (CLK) input while LD is held high and the clock enable (CE) input is held low. Parallel loading is inhibited when LD is held high. The parallel inputs to the register are enabled while LD is low independently of the levels of the CLK, CE, or serial (SIP) inputs. SIP D Q D Q D Q D Q D Q D Q D Q D Q SOP CLK Logic CP CP CP CP CP CP CP CP CE R S R S R S R S R S R S R S R S LD PIP 0 PIP 1 PIP 2 PIP 3 PIP 4 PIP 5 PIP 6 PIP 7 Figure 14. Shift Register Logic Structure Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 11 SN65HVS882 SLAS601 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com Table 2. Function Table INPUTS (1) FUNCTION LD CLK CE L X X Parallel load H X H No change H ↑ L Shift (1) Shift = content of each internal register shifts towards serial outputs. Data at SIP is shifted into first register. Voltage Regulator The on-chip linear voltage regulator provides a 5-V supply to the internal and external circuitry, such as digital isolators, with an output drive capability of 50 mA and a typical current limit of 115 mA. The regulator accepts input voltages from 30 V down to 10 V. Because the regulator output is intended to supply external digital isolator circuits proper output voltage decoupling is required. For best results connect a 1-µF and a 0.1-µF ceramic capacitor as close as possible to the 5VOP output. For longer traces between the SN65HVS882 and isolators of the ISO72xx family use additional 0.1-µF and 10-pF capacitors next to the isolator supply pins. Make sure, however, that the total load capacitance does not exceed 4.7 µF. For good stability the voltage regulator requires a minimum load current, IL-MIN. Ensure that under any operating condition the ratio of the minimum load current in mA to the total load capacitance in µF is larger than 1: IL-MIN 1 mA > 1 µF CL Temperature Sensor An on-chip temperature sensor monitors the device temperature and signals a fault condition if the internal temperature reaches 150°C. If the internal temperature exceeds this trip point, the TOK output switches to an active low state. If the internal temperature continues to rise, passing a second trip point at 170°C, all device outputs are put in a high-impedance state. A special condition occurs, however, when the chip temperature exceeds the second temperature trip point due to an output short. Then the output buffer becomes three-state, thus separating the buffer from the external circuitry. An internal 100-kΩ pull-down resistor, connecting the TOK pin to ground, is used as a cooling down resistor, which continues to provide a logic low level to the external circuitry. 12 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 SN65HVS882 www.ti.com ........................................................................................................................................................................................................ SLAS601 – MAY 2008 APPLICATION INFORMATION System-Level EMC The SN65HVS882 is designed to operate reliably in harsh industrial environments. At a system level, the device is tested according to several international electromagnetic compatibility (EMC) standards. In addition to the device internal ESD structures, external protection circuitry, as shown in Figure 15, can be used to absorb as much energy from burst- and surge-transients as possible. R1 VSUP = 24 V R1 56-Ω, 1/3-W MELF resistor D1 33–36-V fast Zener diode, ZSMB36 C1 10-μF, 60-V ceramic capacitor RIN 1.2-kΩ, 1/4-W MELF resistor VCC CS C1 D1 DS SN65HVS882 FE GND 0V RIN IP0–IP7 IPx CIN 22-nF, 60-V ceramic capacitor CS 4.7-nF, 2-kV polypropylene capacitor DS 39-V transient voltage suppressor, SM15T39CA D2 Super rectifier: BYM10-1000 or General purpose rectifier: 1N4007 CIN GND 0V CS D2 FE Figure 15. Typical EMC Protection Circuitry for Supply and Signal Inputs Input Channel Switching for IEC61131-2 PLC Applications The input stage of the SN65HVS882 is designed so that with a 24-V supply on VCC and an input resistor RIN = 1.2 kΩ, the trip point for signaling an ON-condition is at 9.4 V at 3.6 mA. This trip point satisfies the switching requirements of IEC61131-2 type-1 and type-3 switches. Type 2 Type 3 30 30 30 25 25 25 15 10 5 ON 20 VIN (V) ON 20 VIN (V) VIN (V) Type 1 15 10 5 OFF 0 –30 5 10 IIN (mA) 15 10 5 OFF 0 –3 15 ON 20 0 5 10 15 OFF 0 –3 20 25 IIN (mA) 30 0 5 10 IIN (mA) 15 Figure 16. Switching Characteristics for IEC1131-2 Type 1, 2, and 3 Proximity Switches For a type-2 switch application two inputs are connected in parallel. The current limiters then add to a total maximum current of 7.2 mA. While the return-path (RE-pin), of one input might be used to drive an indicator LED, the RE-pin of the other input channel should be connected to ground (GND). Paralleling input channels reduces the number of available input channels from an octal Type 1 or Type 3 input to a quad Type 2 input device. Note, that in this configuration output data of an input channel is represented by two shift register bits. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 13 SN65HVS882 SLAS601 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com RIN RIN IP0 IP0 CIN CIN RE0 RE0 RIN RIN IP1 IP1 CIN CIN RE1 RE1 Figure 17. Paralleling Two Type 1 or Type 3 Inputs Into One Type 2 Input Digital Interface Timing The digital interface of the SN65HVS882 is SPI compatible and interfaces, isolated or non-isolated, to a wide variety of standard microcontrollers. SN65HVS882 VCC 5V VREG IP0 IP7 SERIALIZER SIP HOST CONTROLLER ISO7241 LD OUTA INA CE OUTB INB CLK OUTC INC SOP IND OUTD LOAD STE SCLK SOMI Figure 18. Simple Isolation of the Shift Register Interface Upon a low-level at the load input, LD, the information of the field inputs, IP0 to IP7 is latched into the shift register. Taking LD high again blocks the parallel inputs of the shift register from the field inputs. A low-level at the clock-enable input, CE, enables the clock signal, CLK, to serially shift the data to the serial output, SOP. Data is clocked at the rising edge of CLK. Thus after eight consecutive clock cycles all field input data have been clocked out of the shift register and the information of the serial input, SIP, appears at the serial output, SOP. 14 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 SN65HVS882 www.ti.com ........................................................................................................................................................................................................ SLAS601 – MAY 2008 CLK CE high SIP LD PIP0–PIP6 PIP7 SOP don’t care IP 6 IP7 IP 5 IP4 inhibit IP3 IP2 IP1 IP 0 SIP Serial shift Figure 19. Interface Timing for Parallel-Load and Serial-Shift Operation of the Shift Register Cascading for High Channel Count Input Modules Designing high-channel count modules requires cascading multiple SN65HVS882 devices. Simply connect the serial output (SOP) of a leading device with the serial input (SIP) of a following device without changing the processor interface. HOST CONTROLLER ISO7241 4 X SN65HVS882 OUTA INA LOAD OUTB INB STE OUTC INC CLK SCLK SOMI SOP CE LD IP7 SIP OUTD SERIALIZER IP0 IP7 SOP CE CLK LD SERIALIZER IP0 IP7 SIP CLK SOP CE LD SIP SERIALIZER IP0 CLK IP7 IP0 SERIALIZER SOP LD CE SIP IND Figure 20. Cascading Four SN65HVS882 for a 32-Channel Input Module Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 15 SN65HVS882 SLAS601 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com Typical Digital Input Module Application SM15T39CA 24V1 (Logic) 24 V 5V 5V-ISO SM15T39A (Sensors) 24V2 Isolated DC/DC 4.7 nF 2 kV 4.7 nF 2 kV GND2 0V Power Supply 4.7 nF 2 kV GND1 0V-ISO 56 Ω MELF FE Srew Terminals Z2SMB36 10 mF 60 V 1N4007 1 mF 0.1 mF SN65HVS882 1.2 kΩ MELF 22 nF S0 VCC 5VOP IP0 TOK RE0 1.2 kΩ MELF VCC1 HOST CONTROLLER SIP EN2 EN1 VCC LD OUTA INA LOAD CLK OUTB INB SCLK CE INC OUTC INT RE7 SOP IND OUTD SOMI RLIM DB0 GND2 GND1 DGND GND DB1 IP7 22 nF S7 ISO7242 VCC2 24.9 kΩ Figure 21. Typical Digital Input Module Application 16 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): SN65HVS882 PACKAGE OPTION ADDENDUM www.ti.com 27-May-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65HVS882PWP ACTIVE HTSSOP PWP 28 SN65HVS882PWPR ACTIVE HTSSOP PWP 28 50 Lead/Ball Finish MSL Peak Temp (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-May-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN65HVS882PWPR Package Package Pins Type Drawing SPQ HTSSOP 2000 PWP 28 Reel Reel Diameter Width (mm) W1 (mm) 330.0 16.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.9 10.2 1.8 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 24-May-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN65HVS882PWPR HTSSOP PWP 28 2000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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