NUD3112 D

NUD3112
Integrated Relay,
Inductive Load Driver
This device is used to switch inductive loads such as relays,
solenoids incandescent lamps, and small DC motors without the need
of a free−wheeling diode. The device integrates all necessary items
such as the MOSFET switch, ESD protection, and Zener clamps. It
accepts logic level inputs thus allowing it to be driven by a large
variety of devices including logic gates, inverters, and
microcontrollers.
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MARKING DIAGRAMS
3
Features
1
• Provides a Robust Driver Interface Between D.C. Relay Coil and
•
•
•
•
•
•
•
SOT−23
CASE 318
STYLE 21
2
Sensitive Logic Circuits
Optimized to Switch Relays of 12 V Rail
Capable of Driving Relay Coils Rated up to 6.0 W at 12 V
Internal Zener Eliminates the Need of Free−Wheeling Diode
Internal Zener Clamp Routes Induced Current to Ground for Quieter
Systems Operation
Low VDS(ON) Reduces System Current Drain
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These are Pb−Free Devices
JW5 MG
G
JW5 = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
SC−74
CASE 318F
STYLE 7
6
1
JW5 MG
G
JW5 = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
Typical Applications
• Telecom: Line Cards, Modems, Answering Machines, FAX
• Computers and Office: Photocopiers, Printers, Desktop Computers
• Consumer: TVs and VCRs, Stereo Receivers, CD Players, Cassette
•
Recorders
Industrial: Small Appliances, Security Systems, Automated Test
Equipment, Garage Door Openers
ORDERING INFORMATION
Package
Shipping†
NUD3112LT1G
SOT−23
(Pb−Free)
3000 / Tape &
Reel
SZNUD3112LT1G
SOT−23
(Pb−Free)
3000 / Tape &
Reel
NUD3112DMT1G
SC−74
(Pb−Free)
3000 / Tape &
Reel
SZNUD3112DMT1G
SC−74
(Pb−Free)
3000 / Tape &
Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
INTERNAL CIRCUIT DIAGRAMS
Drain (3)
1.0 k
Gate (1)
Drain (6)
Gate (2)
1.0 k
300 k
1.0 k
300 k
Source (2)
© Semiconductor Components Industries, LLC, 2014
Gate (5)
300 k
Source (1)
CASE 318
July, 2014 − Rev. 10
Drain (3)
Source (4)
CASE 318F
1
Publication Order Number:
NUD3112/D
NUD3112
MAXIMUM RATINGS (TJ = 25°C unless otherwise specified)
Symbol
Value
Unit
VDSS
Drain to Source Voltage – Continuous
Rating
14
Vdc
VGS
Gate to Source Voltage – Continuous
6
Vdc
ID
Drain Current – Continuous
500
mA
Ez
Single Pulse Drain−to−Source Avalanche Energy (TJinitial = 25°C)
50
mJ
TJ
Junction Temperature
150
°C
TA
Operating Ambient Temperature
−40 to 85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
PD
Total Power Dissipation (Note 1)
Derating Above 25°C
SOT−23
225
1.8
mW
mW/°C
PD
Total Power Dissipation (Note 1)
Derating Above 25°C
SC−74
380
3.0
mW
mW/°C
SOT−23
SC−74
556
329
°C/W
2000
V
RqJA
Thermal Resistance Junction−to−Ambient (Note 1)
ESD
Human Body Model (HBM) According to EIA/JESD22/A114
1. Mounted onto minimum pad board.
TYPICAL ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Characteristic
Min
Typ
Max
Unit
OFF CHARACTERISTICS
VBRDSS
Drain to Source Sustaining Voltage (Internally Clamped)
(ID = 10 mA)
14
16
17
V
BVGSO
Ig = 1.0 mA
−
−
8
V
Drain to Source Leakage Current
(VDS = 12 V , VGS = 0 V, TA = 25°C)
(VDS = 12 V, VGS = 0 V, TA = 85°C)
−
−
−
−
20
40
mA
Gate Body Leakage Current
(VGS = 3.0 V, VDS = 0 V)
(VGS = 5.0 V, VDS = 0 V)
−
−
−
−
35
65
mA
Gate Threshold Voltage
(VGS = VDS, ID = 1.0 mA)
(VGS = VDS, ID = 1.0 mA, TA = 85°C)
0.8
0.8
1.2
−
1.4
1.4
V
Drain to Source On−Resistance
(ID = 250 mA, VGS = 3.0 V)
(ID = 500 mA, VGS = 3.0 V)
(ID = 500 mA, VGS = 5.0 V)
(ID = 500 mA, VGS = 3.0 V, TA=85°C)
(ID = 500 mA, VGS = 5.0 V, TA=85°C)
−
−
−
−
−
−
−
−
−
−
1.2
1.3
0.9
1.3
0.9
W
300
200
400
−
−
−
mA
350
490
−
mmhos
IDSS
IGSS
ON CHARACTERISTICS
VGS(th)
RDS(on)
IDS(on)
gFS
Output Continuous Current
(VDS = 0.25 V, VGS = 3.0 V)
(VDS = 0.25 V, VGS = 3.0 V, TA = 85°C)
Forward Transconductance
(VOUT = 12.0 V, IOUT = 0.25 A)
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2
NUD3112
TYPICAL ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
Characteristic
Min
Typ
Max
Unit
DYNAMIC CHARACTERISTICS
Ciss
Input Capacitance
(VDS = 12 V, VGS = 0 V, f = 10 kHz)
−
23
−
pF
Coss
Output Capacitance
(VDS = 12 V, VGS = 0 V, f = 10 kHz)
−
30
−
pF
Crss
Transfer Capacitance
(VDS = 12.0 V, VGS = 0 V, f = 10 kHz)
−
7
−
pF
Min
Typ
Max
Units
Propagation Delay Times:
High to Low Propagation Delay; Figure 1 (VDS = 12 V, VGS = 5.0 V)
Low to High Propagation Delay; Figure 1 (VDS = 12 V, VGS = 5.0 V)
−
−
21
91
−
−
Transition Times:
Fall Time; Figure 1 (VDS = 12 V, VGS = 5.0 V)
Rise Time; Figure 1 (VDS = 12 V, VGS = 5.0 V)
−
−
36
61
−
−
SWITCHING CHARACTERISTICS
Characteristic
Symbol
tPHL
tPLH
tf
tr
nS
nS
VIH
Vin
50%
0V
tPHL
tPLH
VOH
90%
Vout
50%
10%
VOL
tr
tf
Figure 1. Switching Waveforms
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3
NUD3112
TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise specified)
1
VGS = 5.0 V
VDS = 0.8 V
VGS = 3.0 V
0.1
VGS = 2.0 V
0.01
VGS = 1.5 V
I D, DRAIN CURRENT (A)
I D, DRAIN CURRENT (A)
1
0.001
VGS = 1.0 V
0.0001
0.00001
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
0.1
0.01
125°C
0.001
85°C
25°C
0.0001
0.00001
0.8
0.5
−40°C
1.0
1200
1000
800
ID = 0.25 A
VGS = 3.0 V
ID = 0.5 A
VGS = 3.0 V
ID = 0.5 A
VGS = 5.0 V
600
400
200
0
−50
−25
0
25
75
50
TEMPERATURE (°C)
100
125
4500
3500
3000
2500
125°C
25°C
−40°C
1500
1000
500
0
0.6
0.8
1
1.2
1.4
VGS, GATE−TO−SOURCE VOLTAGE (V)
1.6
Figure 5. RDS(ON) Variation vs. Gate−to−Source
Voltage
21
IZ = 10 mA
V Z , ZENER CLAMP VOLTAGE (V)
V Z , ZENER VOLTAGE (V)
85°C
2000
15.98
15.94
15.92
15.90
15.88
15.86
15.84
15.82
15.80
−50
ID = 250 mA
4000
Figure 4. On−Resistance Variation vs.
Temperature
15.96
5.0
Figure 3. Transfer Function
RDS(on), DRAIN−TO−SOURCE RESISTANCE (W)
RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)
Figure 2. Output Characteristics
1.5
2.0 2.5 3.0 3.5
4.0 4.5
VGS, GATE−TO−SOURCE VOLTAGE (V)
−25
0
50
75
25
TEMPERATURE (°C)
100
125
20
19
18
17
16
15
85°C
25°C
14
−40°C
13
0.1
Figure 6. Zener Voltage vs. Temperature
1
10
100
IZ, ZENER CURRENT (mA)
1000
Figure 7. Zener Clamp Voltage vs. Zener
Current
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4
NUD3112
45
1.2
1.1
VGS = 3.0 V
1
125°C
0.9
85°C
40
IGSS, GATE LEAKAGE (mA)
RDS(on), DRAIN−TO−SOURCE RESISTANCE (W)
TYPICAL PERFORMANCE CURVES (TJ = 25°C unless otherwise specified)
0.8
0.7
0.6
25°C
−40°C
0.5
35
30
25
VGS = 5.0 V
20
15
VGS = 3.0 V
10
5
0
−50
0.4
0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
ID, DRAIN CURRENT (A)
Figure 8. On−Resistance vs. Drain Current and
Temperature
−25
0
25
50
75
TEMPERATURE (°C)
100
Figure 9. Gate Leakage vs. Temperature
+12V
Relay
+5V / 3.3V
1.0 k
clamp Zener
Logic
ESD Zener
300 k
ESD Zener
Figure 10. Typical Application Circuit
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5
clamp Zener
125
NUD3112
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AP
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
D
SEE VIEW C
3
HE
E
DIM
A
A1
b
c
D
E
e
L
L1
HE
q
c
1
2
b
0.25
e
q
A
L
A1
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
0°
MILLIMETERS
NOM
MAX
1.00
1.11
0.06
0.10
0.44
0.50
0.13
0.18
2.90
3.04
1.30
1.40
1.90
2.04
0.20
0.30
0.54
0.69
2.40
2.64
−−−
10 °
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
L1
VIEW C
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
0.031
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
0°
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
−−−
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
10°
NUD3112
PACKAGE DIMENSIONS
SC−74
CASE 318F−05
ISSUE N
D
6
5
4
2
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05.
E
HE
1
DIM
A
A1
b
c
D
E
e
L
HE
q
b
e
0.05 (0.002)
q
C
A
L
A1
MIN
0.90
0.01
0.25
0.10
2.90
1.30
0.85
0.20
2.50
0°
MILLIMETERS
NOM
MAX
1.00
1.10
0.06
0.10
0.37
0.50
0.18
0.26
3.00
3.10
1.50
1.70
0.95
1.05
0.40
0.60
2.75
3.00
10°
−
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
INCHES
NOM
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
−
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
STYLE 7:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
SOLDERING FOOTPRINT*
2.4
0.094
0.95
0.037
1.9
0.074
0.95
0.037
0.7
0.028
1.0
0.039
SCALE 10:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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7
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For additional information, please contact your local
Sales Representative
NUD3112/D