NSD16F3T5G Switching Diode The NSD16F3T5G device is a spin−off of our popular SOT−23 three−leaded device. It is designed for switching applications and is housed in the SOT−1123 surface mount package. This device is ideal for low−power surface mount applications where board space is at a premium. http://onsemi.com Features • Reduces Board Space • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS 3 CATHODE 1 ANODE Compliant NSD16F3T5G MAXIMUM RATINGS Rating Symbol Value Unit Reverse Voltage VR 75 Vdc Forward Current IF 200 mAdc IFM(surge) 500 mAdc Symbol Max Unit Total Device Dissipation, TA = 25°C Derate above 25°C PD (Note 1) 290 2.3 mW mW/°C Thermal Resistance, Junction−to−Ambient RqJA (Note 1) 432 °C/W Total Device Dissipation, TA = 25°C Derate above 25°C PD (Note 2) 347 2.8 mW mW/°C Thermal Resistance, Junction−to−Ambient RqJA (Note 2) 360 °C/W Thermal Resistance, Junction−to−Lead 3 RYJL (Note 2) 143 °C/W TJ, Tstg −55 to +150 Peak Forward Surge Current 3 1 SOT−1123 CASE 524AA STYLE 2 THERMAL CHARACTERISTICS Characteristic Junction and Storage Temperature Range °C © Semiconductor Components Industries, LLC, 2014 May, 2014 − Rev. 1 MARKING DIAGRAM TM T M 1 = Device Code = Date Code ORDERING INFORMATION Device NSD16F3T5G Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. 100 mm2 1 oz, copper traces. 2. 500 mm2 1 oz, copper traces. 2 Package Shipping† SOT−1123 8000/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: NSD16F3/D NSD16F3T5G ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Symbol Characteristic Min Max − − − 1.0 50 30 75 − − − − − 715 855 1000 1250 Unit OFF CHARACTERISTICS mAdc IR Reverse Voltage Leakage Current (VR = 100 Vdc) (VR = 75 Vdc, TJ = 150°C) (VR = 25 Vdc, TJ = 150°C) Reverse Breakdown Voltage (IBR = 100 mAdc) V(BR) Vdc Forward Voltage (IF = 1.0 mAdc) (IF = 10 mAdc) (IF = 50 mAdc) (IF = 150 mAdc) VF mV Diode Capacitance (VR = 0, f = 1.0 MHz) CD − 2.0 pF Forward Recovery Voltage (IF = 10 mAdc, tr = 20 ns) VFR − 1.75 Vdc Reverse Recovery Time (IF = IR = 10 mAdc, RL = 50 W) trr − 6.0 ns Stored Charge (IF = 10 mAdc to VR = 5.0 Vdc, RL = 500 W) QS − 45 pC Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 820 W +10 V 2.0 k 100 mH tr 0.1 mF IF tp t IF trr 10% t 0.1 mF 90% D.U.T. 50 W OUTPUT PULSE GENERATOR 50 W INPUT SAMPLING OSCILLOSCOPE iR(REC) = 1.0 mA IR VR INPUT SIGNAL OUTPUT PULSE (IF = IR = 10 mA; MEASURED at iR(REC) = 1.0 mA) Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp » trr Figure 1. Recovery Time Equivalent Test Circuit http://onsemi.com 2 NSD16F3T5G TYPICAL CHARACTERISTICS 10 100 150°C IR , REVERSE CURRENT (μA) 125°C 10 85°C 55°C 1.0 25°C -55°C -40°C 0.1 125°C 1.0 85°C 0.1 55°C 0.01 25°C 0.01 0.1 0.001 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VF, FORWARD VOLTAGE (V) 0.9 1.0 0 1.1 50 20 30 40 VR, REVERSE VOLTAGE (V) 10 Figure 2. VF vs. IF Figure 3. IR vs. VR 0.62 Cap 0.60 CD, DIODE CAPACITANCE (pF) IF, FORWARD CURRENT (mA) 150°C 0.58 0.56 0.54 0.52 0.50 0.48 0 1 2 4 3 5 VR, REVERSE VOLTAGE (V) Figure 4. Capacitance http://onsemi.com 3 6 7 8 60 70 NSD16F3T5G PACKAGE DIMENSIONS SOT−1123 CASE 524AA ISSUE C −X− D −Y− 1 3 E 2 TOP VIEW A c HE STYLE 2: PIN 1. ANODE 2. N/C 3. CATHODE SIDE VIEW 3X b L2 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS DIM MIN MAX A 0.34 0.40 b 0.15 0.28 b1 0.10 0.20 c 0.07 0.17 D 0.75 0.85 E 0.55 0.65 e 0.35 0.40 HE 0.95 1.05 L 0.185 REF L2 0.05 0.15 SOLDERING FOOTPRINT* 0.08 X Y e 1.20 3X 2X 3X b1 0.34 L 0.26 1 BOTTOM VIEW 0.38 2X 0.20 PACKAGE OUTLINE DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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