NSD914XV2T1 D

NSD914XV2T1
High-Speed
Switching Diode
Features
•
•
•
•
•
High−Speed Switching Applications
Lead Finish: 100% Matte Sn (Tin)
Qualified Maximum Reflow Temperature: 260°C
Extremely Small SOD−523 Package
Pb−Free Package is Available
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1
CATHODE
MAXIMUM RATINGS (TA = 25°C)
Rating
2
Symbol
Max
Unit
Reverse Voltage
VR
100
V
Forward Current
IF
200
mAdc
IFM(surge)
500
mAdc
Peak Forward Surge Current
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR−5 Board (Note 1)
TA = 25°C
Derate above 25°C
Thermal Resistance
Junction-to-Ambient
Junction and Storage Temperature Range
Symbol
1
5D MG
G
2
5D
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
mW
mW/°C
RqJA
635
°C/W
TJ, Tstg
−55 to
150
°C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Symbol
Min
Max
Unit
V(BR)
100
−
Vdc
−
−
25
5.0
nAdc
mAdc
IR
Diode Capacitance
(VR = 0 V, f = 1.0 MHz)
CD
−
4.0
pF
Forward Voltage
(IF = 10 mAdc)
VF
−
1.0
Vdc
Reverse Recovery Time
(IF = IR = 10 mAdc)
trr
−
4.0
ns
May, 2012 − Rev. 4
SOD−523
CASE 502
PLASTIC
200
1.57
PD
Reverse Voltage Leakage Current
(VR = 20 Vdc)
(VR = 75 Vdc)
© Semiconductor Components Industries, LLC, 2012
1
Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage
(IBR = 100 mAdc)
MARKING
DIAGRAM
Max
1. FR−4 @ Minimum Pad.
Characteristic
2
ANODE
1
ORDERING INFORMATION
Device
Package
Shipping†
NSD914XV2T1
SOD−523
3000/Tape & Reel
NSD914XV2T1G
SOD−523
(Pb−Free)
3000/Tape & Reel
Publication Order Number:
NSD914XV2T1/D
NSD914XV2T1
820 Ω
+10 V
2.0 k
tr
0.1 μF
tp
IF
100 μH
IF
t
trr
10%
t
0.1 μF
90%
DUT
50 Ω INPUT
SAMPLING
OSCILLOSCOPE
50 Ω OUTPUT
PULSE
GENERATOR
iR(REC) = 1.0 mA
IR
VR
OUTPUT PULSE
(IF = IR = 10 mA; MEASURED
at iR(REC) = 1.0 mA)
INPUT SIGNAL
Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
Figure 1. Recovery Time Equivalent Test Circuit
100
10
I R , REVERSE CURRENT ( mA)
TA = 85°C
TA = -40°C
10
TA = 25°C
1.0
TA = 125°C
1.0
TA = 85°C
0.1
TA = 55°C
0.01
TA = 25°C
0.1
0.2
0.4
0.6
0.8
1.0
0.001
1.2
0
10
20
30
VF, FORWARD VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68
C D , DIODE CAPACITANCE (pF)
I F, FORWARD CURRENT (mA)
TA = 150°C
0.64
0.60
0.56
0.52
0
2.0
4.0
6.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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2
8.0
40
50
NSD914XV2T1
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
2X
b
0.08
1
M
2
X Y
DIM
A
b
c
D
E
HE
L
L2
TOP VIEW
A
c
RECOMMENDED
SOLDERING FOOTPRINT*
HE
SIDE VIEW
2X
2X
2X
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
L
PACKAGE
OUTLINE
L2
BOTTOM VIEW
1.80
0.48
2X
0.40
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
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Phone: 81−3−5817−1050
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3
ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
NSD914XV2T1/D