NL17SZ14 D

NL17SZ14
Single Inverter with
Schmitt Trigger
The NL17SZ14 is a single inverter with Schmitt trigger in three tiny
footprint packages. The device performs much as LCX multi−gate
products in speed and drive.
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Features
•
Tiny SOT−353, SOT−553 and SOT−953 Packages
Source/Sink 24 mA at 3.0 V
Over−Voltage Tolerant Inputs and Outputs
Pin For Pin with NC7SZ14
Designed for 1.65 V to 5.5 V VCC Operation
Chip Complexity: FET = 20
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free and are RoHS Compliant
VCC
NC
1
1
IN A
GND
2
2
OUT Y
GND
4
3
SC−88A
(SC−70−5/SOT−353)
DF SUFFIX
CASE 419A
LA
M
G
5
*Date Code orientation and/or position may vary
depending upon manufacturing location.
NC
OUT Y
3
4
2
M
Figure 1. Pinout
1
OUT Y
1
= Specific Device Code
= Month Code
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Figure 2. Logic Symbol
PIN ASSIGNMENT (SOT−953)
(SOT−353/SC70−5/SC−88A/SOT−553)
2M
SOT−953
CASE 527AE
SOT−953
PIN ASSIGNMENT
= Device Code
= Date Code*
= Pb−Free Package
(*Note: Microdot may be in either location)
SOT−353/SC70−5/
SC−88A/SOT−553
IN A
LA M G
G
LA MG
G
SOT−553
XV5 SUFFIX
CASE 463B
VCC
IN A
5
MARKING
DIAGRAMS
M
•
•
•
•
•
•
•
Pin
FUNCTION TABLE
Function
Input
Output
Pin
Function
1
IN A
A
Y
1
NC
2
GND
L
H
2
IN A
3
NC
H
L
3
GND
4
OUT Y
4
OUT Y
5
VCC
5
VCC
© Semiconductor Components Industries, LLC, 2013
June, 2013 − Rev. 13
1
Publication Order Number:
NL17SZ14/D
NL17SZ14
MAXIMUM RATINGS
Symbol
VCC
Characteristics
DC Supply Voltage
Value
Units
−0.5 to +7.0
V
−0.5 ≤ VI ≤ +7.0
V
VI
DC Input Voltage
VO
DC Output Voltage
Output in High or LOW State (Note 1)
(SOT−353/SC70−5/SC−88A/SOT−553 Packages)
−0.5 to VCC + 0.5
V
VO
DC Output Voltage
(SOT−953 Package)
−0.5 to VCC + 0.5
−0.5 to + 0.5
V
IIK
DC Input Diode Current
VI < GND
−50
mA
IOK
DC Output Diode Current
(SOT−353/SC70−5/SC−88A/SOT−553 Packages)
VO < GND, VO > VCC
±50
mA
IOK
DC Output Diode Current (SOT−953 Package)
VO < GND
−50
mA
IO
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
IGND
DC Ground Current per Ground Pin
±100
mA
TSTG
Storage Temperature Range
−65 to +150
°C
PD
Power Dissipation in Still Air
SOT−353
SOT−553
186
135
mW
qJA
Thermal Resistance
SOT−353
SOT−553
350
496
°C/W
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature under Bias
+150
°C
MSL
Moisture Sensitivity
FR
Flammability Rating
ESD
ESD Classification
ILATCHUP
Output in High or LOW State (Note 1)
Power−Down Mode (VCC = 0 V)
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Class 2
Class C
N/A
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
mA
±100
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.
3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Supply Voltage
Operating
Data Retention Only
VI
Input Voltage
VO
Output Voltage
(SOT−353/SC70−5/SC−88A/SOT−553 Packages)
(High or LOW State)
VO
Output Voltage (SOT−953 Package)
(High or LOW State)
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 2.5 V ±0.2 V
VCC = 3.0 V ±0.3 V
VCC = 5.0 V ±0.5 V
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2
Min
Max
Units
1.65
1.5
5.5
5.5
V
0
5.5
V
0
5.5
V
0
VCC
V
−55
+125
°C
0
0
0
No Limit
No Limit
No Limit
ns/V
NL17SZ14
DC ELECTRICAL CHARACTERISTICS
Symbol
VT)
VT*
VH
VOH
VOL
IIN
Parameter
Condition
Positive Input
Threshold Voltage
Negative Input
Threshold Voltage
Input Hysteresis
Voltage
High−Level Output
Voltage
VIN = VIH or VIL
Low−Level Output
Voltage
VIN = VIH or VIL
TA = 25°C
−555C 3 TA 3 1255C
VCC
(V)
Min
Typ
Max
Min
Max
Units
1.65
0.6
1.0
1.4
0.6
1.4
V
2.3
1.0
1.5
1.8
1.0
1.8
2.7
1.2
1.7
2.0
1.2
2.0
3.0
1.3
1.9
2.2
1.3
2.2
4.5
1.9
2.7
3.1
1.9
3.1
5.5
2.2
3.3
3.6
2.2
3.6
1.65
0.2
0.5
0.8
0.2
0.8
2.3
0.4
0.75
1.15
0.4
1.15
2.7
0.5
0.87
1.4
0.5
1.4
3.0
0.6
1.0
1.5
0.6
1.5
4.5
1.0
1.5
2.0
1.0
2.0
5.5
1.2
1.9
2.3
1.2
2.3
1.65
0.1
0.48
0.9
0.1
0.9
2.3
0.25
0.75
1.1
0.25
1.1
2.7
0.3
0.83
1.15
0.3
1.15
3.0
0.4
0.93
1.2
0.4
1.2
4.5
0.6
1.2
1.5
0.6
1.5
1.7
0.7
1.7
5.5
0.7
1.4
1.65 to 5.5
VCC − 0.1
VCC
VCC − 0.1
IOH = −3 mA
1.65
1.29
1.52
1.29
IOH = *8 mA
2.3
1.9
2.1
1.9
IOH = *12 mA
2.7
2.2
2.4
2.2
IOH = *16 mA
3.0
2.4
2.7
2.4
IOH = *24 mA
3.0
2.3
2.5
2.3
IOH = *32 mA
4.5
3.8
4.0
3.8
IOH = −100 mA
V
V
V
V
1.65 to 5.5
0.0
0.1
0.1
IOL = 3 mA
1.65
0.08
0.24
0.24
IOL = 8 mA
2.3
0.2
0.3
0.3
IOL = 12 mA
2.7
0.22
0.4
0.4
IOL = 16 mA
3.0
0.28
0.4
0.4
IOL = 24 mA
3.0
0.38
0.55
0.55
IOL = 32 mA
4.5
0.42
0.55
0.55
0 to 5.5
±0.1
±1.0
mA
0
1
10
mA
5.5
1
10
mA
IOL = 100 mA
Input Leakage Current
VIN = 5.5 V or GND
IOFF
Power Off Leakage
Current (SOT−353/
SC70−5/SC−88A/
SOT−553 Packages)
VIN = 5.5 V or
VOUT = 5.5 V
ICC
Quiescent Supply
Current
VIN = 5.5 V or GND
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3
NL17SZ14
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
tPLH
tPHL
Typ
Max
Min
Max
Units
RL = 1 MW, CL = 15 pF
1.65
1.8
2.5 ± 0.2
3.3 ± 0.3
5.0 ± 0.5
2.0
2.0
1.0
1.0
0.5
9.1
7.6
5.0
3.7
3.1
15
12.5
9.0
6.3
5.2
2.0
2.0
1.0
1.0
0.5
15.6
13
9.5
6.5
5.5
ns
RL = 500 W, CL = 50 pF
3.3 ± 0.3
5.0 ± 0.5
1.5
0.8
4.4
3.7
7.2
5.9
1.5
0.8
7.5
6.2
Condition
Propagation Delay
(Figure 3 and 4)
−555C v TA v 1255C
Min
Parameter
Symbol
TA = 255C
VCC
(V)
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
CIN
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
CPD
Power Dissipation Capacitance
(Note 6)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
Typical
Units
u4.0
pF
25
30
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
A or B
VCC
50%
GND
tPLH
Y
OUTPUT
tPHL
RL
CL
INPUT
50% VCC
A 1−MHz square input wave is recommended for
propagation delay tests.
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Order
Number
Package
Type
Tape and
Reel Size†
NL17SZ14DFT2G
SC−88A/SC−70−5/SOT−353
(Pb−Free)
3000 / Tape & Reel
NLV17SZ14DFT2G*
SC−88A/SC−70−5/SOT−353
(Pb−Free)
3000 / Tape & Reel
NL17SZ14XV5T2G
SOT−553
(Pb−Free)
4000 / Tape & Reel
NL17SZ14P5T5G
SOT−953
(Pb−Free)
8000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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4
NL17SZ14
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NL17SZ14
PACKAGE DIMENSIONS
SOT−553
XV5 SUFFIX
CASE 463B
ISSUE B
D
−X−
5
A
4
1
e
2
E
−Y−
3
b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
L
DIM
A
b
c
D
E
e
L
HE
HE
c
5 PL
0.08 (0.003)
M
X Y
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.70
1.20
1.30
0.50 BSC
0.10
0.20
0.30
1.50
1.60
1.70
MIN
0.50
0.17
0.08
1.50
1.10
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
6
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.004
0.008
0.059
0.063
MIN
0.020
0.007
0.003
0.059
0.043
MAX
0.024
0.011
0.007
0.067
0.051
0.012
0.067
NL17SZ14
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
Y
PIN ONE
INDICATOR
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
4
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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For additional information, please contact your local
Sales Representative
NL17SZ14/D