NL17SZ126 D

NL17SZ126
Non-Inverting 3-State
Buffer
The NL17SZ126 is a high performance single noninverting buffer
operating from a 1.65 V to 5.5 V supply.
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Features
•
•
•
•
•
•
•
•
VCC
OE
1
VCC
A
5
1
5
GND
IN A
SC−88A (SOT−353)
DF SUFFIX
CASE 419A
M2 MG
G
SOT−553
XV5 SUFFIX
CASE 463B
SOT−953
CASE 527AE
M2 M G
G
J
•
MARKING
DIAGRAM
M
•
•
•
Extremely High Speed: tPD 2.6 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs and Outputs
LVTTL Compatible − Interface Capability With 5.0 V TTL Logic
with VCC = 3.0 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
3−State OE Input is Active HIGH
Replacement for NC7SZ126
Chip Complexity = 36 FETs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
M
1
M2 or J = Specific Device Code
(J with 90 degree clockwise rotation)
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
2
2
OUT Y
GND
4
3
SOT−353/SC−88A/ SOT−553
Y
OE
4
3
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
SOT−953
Figure 1. Pinout (Top View)
OE
OUT Y
IN A
Figure 2. Logic Symbol
© Semiconductor Components Industries, LLC, 2015
April, 2015 − Rev. 13
1
Publication Order Number:
NL17SZ126/D
NL17SZ126
PIN ASSIGNMENT
PIN ASSIGNMENT (SOT−953)
(SOT−353/SC−88A/SOT−553/UDFN)
FUNCTION TABLE
Input
Output
Pin
Function
Pin
Function
1
IN A
OE
A
Y
1
OE
2
GND
H
L
L
2
IN A
3
OE
H
H
H
3
GND
4
OUT Y
L
X
Z
4
OUT Y
5
VCC
5
VCC
X = Don’t Care
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
−0.5 to )7.0
V
VIN
DC Input Voltage
−0.5 to )7.0
V
VOUT
DC Output Voltage (SOT−353/SC−88A/SOT−553 Packages)
−0.5 to VCC +0.5
V
VOUT
DC Output Voltage
(SOT−953 Package)
−0.5 to VCC +0.5
−0.5 to +0.5
V
−50
mA
VOUT < GND, VOUT > VCC
±50
mA
VOUT < GND
−50
mA
Output at High or Low State
Power−Down Mode (VCC = 0 V)
IIK
DC Input Diode Current
IOK
DC Output Diode Current
(SOT−353/SC−88A/SOT−553 Packages)
IOK
DC Output Diode Current (SOT−953 Package)
IOUT
DC Output Sink Current
±50
mA
ICC
DC Supply Current per Supply Pin
±100
mA
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
+150
°C
qJA
Thermal Resistance (Note 1)
SC−70/SC−88A
350
°C/W
PD
Power Dissipation in Still Air at 85°C
SC−70/SC−88A
150
mW
TSTG
Storage Temperature Range
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILATCHUP
ESD Withstand Voltage
Level 1
Oxygen Index: 28 to 34
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
UL 94 V−0 @ 0.125 in
u2000
u200
N/A
V
±100
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
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2
NL17SZ126
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
VCC
DC Supply Voltage
VIN
DC Input Voltage
0
5.5
V
VOUT
DC Output Voltage (SOT−353/SC−88A/SOT−553 Packages)
0
5.5
V
VOUT
DC Output Voltage (SOT−953 Package)
0
VCC
V
*40
+125
°C
0
0
0
0
20
20
10
5.0
ns/V
VCC = 1.8 V $0.15 V
VCC = 2.5 V $0.2 V
VCC = 3.0 V $0.3 V
VCC = 5.0 V $0.5 V
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
TJ = 80°C
Time, Years
TJ = 90°C
Time, Hours
TJ = 100°C
Junction
Temperature °C
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
TJ = 110°C
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
TJ = 120°C
Input Rise and Fall Time
TJ = 130°C
Operating Temperature Range
NORMALIZED FAILURE RATE
TA
tr, tf
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate versus Time Junction
Temperature
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3
NL17SZ126
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Condition
Min
0.75 VCC
0.7 VCC
VIH
High−Level Input
Voltage
1.65 to 1.95
2.3 to 5.5
VIL
Low−Level Input
Voltage
1.65 to 1.95
2.3 to 5.5
VOH
High−Level Output
Voltage
VIN = VIH
VOL
Low−Level Output
Voltage
VIN = VIL
IIN
Input Leakage Current
IOZ
3−State Output
Leakage
IOFF
Power Off Leakage
Current (SOT−353/
SC−88A/SOT−553
Packages)
ICC
Quiescent Supply
Current
*405C v TA v 1255C
TA = 255C
VCC
(V)
Typ
Max
Min
Max
0.75 VCC
0.7 VCC
0.25 VCC
0.3 VCC
Unit
V
0.25 VCC
0.3 VCC
V
IOH = −100 mA
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
1.65
1.8
2.3
3.0
4.5
1.55
1.7
2.2
2.9
4.4
V
IOH = −4 mA
IOH = −8 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65
2.3
3.0
3.0
4.5
1.29
1.9
2.4
2.3
3.8
1.52
2.15
2.80
2.68
4.20
1.29
1.9
2.4
2.3
3.8
V
IOL = 100 mA
1.65
1.8
2.3
3.0
4.5
0.0
0.0
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
IOL = 4 mA
IOL = 8 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65
2.3
3.0
3.0
4.5
0.08
0.10
0.15
0.22
0.22
0.24
0.30
0.40
0.55
0.55
0.24
0.30
0.40
0.55
0.55
V
VIN = 5.5 V or GND
0 to 5.5
$0.1
$1.0
mA
VIN = VIH or VIL
0 V v VOUT v 5.5 V
1.65 to 5.5
$0.5
$5.0
mA
VIN = 5.5 V or
VOUT = 5.5 V
0
1.0
10
mA
VIN = 5.5 V or GND
5.5
1.0
10
mA
AC ELECTRICAL CHARACTERISTICS (tR = tF = 3.0 ns)
Symbol
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
Parameter
Propagation Delay
AN to YN
(Figures 4, and 5,
Table 1)
Output Enable Time
(Figures 6, 7 and 8,
Table 1)
Output Disable Time
(Figures 6, 7 and 8,
Table 1)
Condition
*405C v TA v 1255C
TA = 255C
VCC
(V)
Min
Typ
Max
Min
Max
Unit
ns
RL = 1 MW
CL = 15 pF
1.8 $ 0.15
2.0
9.5
12
2.0
12.5
RL = 1 MW
CL = 15 pF
2.5 $ 0.2
1.0
3.4
7.5
1.0
8.0
RL = 1 MW
RL = 500 W
CL = 15 pF
CL = 50 pF
3.3 $ 0.3
0.8
1.2
5.2
5.7
0.8
1.2
5.5
6.0
RL = 1 MW
RL = 500 W
CL = 15 pF
CL = 50 pF
5.0 $ 0.5
0.5
0.8
4.5
5.0
0.5
0.8
4.8
5.3
RL = 250 W
CL = 50 pF
1.8 $ 0.15
2.0
10.5
2.0
12.5
2.5 $ 0.2
1.8
8.5
1.8
9.0
3.3 $ 0.3
1.2
6.2
1.2
6.5
5.0 $ 0.5
0.8
5.5
0.8
5.8
2.5 $ 0.2
1.5
8.0
1.5
8.5
2.5 $ 0.2
1.5
8.0
1.5
8.5
3.3 $ 0.3
0.8
5.7
0.8
6.0
5.0 $ 0.5
0.3
4.7
0.3
5.0
RL and R1= 500 W CL = 50 pF
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4
9.0
ns
ns
NL17SZ126
CAPACITIVE CHARACTERISTICS
Symbol
Condition
Typical
Unit
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
COUT
Output Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance
(Note 6)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
9
11
pF
CIN
Parameter
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
OE = VCC
VCC
INPUT
50%
A
OUTPUT
GND
tPHL
tPLH
CL *
RL
50% VCC
Y
Figure 4. Switching Waveform
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for
propagation delay tests.
Figure 5. tPLH or tPHL
2
INPUT
VCC
INPUT
R1 = 500 W
VCC
OUTPUT
CL = 50 pF
OUTPUT
RL = 500 W
CL = 50 pF
RL = 250 W
A 1−MHz square input wave is recommended for
propagation delay tests.
A 1−MHz square input wave is recommended for
propagation delay tests.
Figure 6. tPZL or tPLZ
Figure 7. tPZH or tPHZ
2.7 V
Vmi
Vmi
OE
0V
tPZH
tPHZ
VOH − 0.3 V
Vmo
On
VCC
≈0V
tPZL
On
tPLZ
Vmo
≈ 3.0 V
VOL + 0.3 V
GND
Figure 8. AC Output Enable and Disable Waveform
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5
NL17SZ126
Table 1. Output Enable and Disable Times
tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns
VCC
Symbol
3.3 V $ 0.3 V
2.7 V
2.5 V $ 0.2 V
Vmi
1.5 V
1.5 V
VCC/2
Vmo
1.5 V
1.5 V
VCC/2
DEVICE ORDERING INFORMATION
Package Type
Shipping†
NL17SZ126DFT2G
SC70−5/SC−88A/SOT−353
(Pb−Free)
3000 / Tape & Reel
NLV17SZ126DFT2G*
SC70−5/SC−88A/SOT−353
(Pb−Free)
3000 / Tape & Reel
NL17SZ126XV5T2G
SOT−553
(Pb−Free)
4000 / Tape & Reel
NL17SZ126P5T5G
SOT−953
(Pb−Free)
8000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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6
NL17SZ126
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
J
C
K
H
SOLDER FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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7
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NL17SZ126
PACKAGE DIMENSIONS
SOT−553, 5 LEAD
CASE 463B
ISSUE B
D
−X−
5
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
A
L
4
1
2
E
−Y−
3
b
e
HE
c
5 PL
0.08 (0.003)
M
MILLIMETERS
NOM
MAX
0.55
0.60
0.22
0.27
0.13
0.18
1.60
1.70
1.20
1.30
0.50 BSC
0.10
0.20
0.30
1.50
1.60
1.70
DIM
A
b
c
D
E
e
L
HE
X Y
MIN
0.50
0.17
0.08
1.50
1.10
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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8
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.020 BSC
0.004
0.008
0.059
0.063
MIN
0.020
0.007
0.003
0.059
0.043
MAX
0.024
0.011
0.007
0.067
0.051
0.012
0.067
NL17SZ126
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
X
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
A
Y
5
4
PIN ONE
INDICATOR
HE
E
1
2 3
DIM
A
b
C
D
E
e
HE
L
L2
L3
C
TOP VIEW
SIDE VIEW
e
L
5X
5X
L3
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.175 REF
0.05
0.10
0.15
−−−
−−−
0.15
SOLDERING FOOTPRINT*
5X
0.35
5X
0.20
5X
L2
5X
BOTTOM VIEW
b
PACKAGE
OUTLINE
0.08 X Y
1.20
1
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
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any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
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9
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For additional information, please contact your local
Sales Representative
NL17SZ126/D