SUD50N03-06AP Datasheet

SUD50N03-06AP
New Product
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) ()
ID (A)a, e
0.0057 @ VGS = 10 V
90
0.0078 @ VGS = 4.5 V
77
VDS (V)
30
D TrenchFETr Power MOSFET
D Optimized for Low–Side Synchronous
Rectifier Operation
D 100% Rg Tested
Qg (Typ)
30
RoHS
COMPLIANT
APPLICATIONS
D DC/DC Converters
D Synchronous Rectifiers
TO-252
D
G
Drain Connected to Tab
G
D
S
Top View
S
N-Channel MOSFET
Ordering Information: SUD50N03-06AP—E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
TC = 70_C
TA = 25_C
75a, e
ID
30b, c
25b, c
TA = 70_C
Pulsed Drain Current
IDM
Source Drain Diode Current
Continuous Source-Drain
TC = 25_C
TA = 25_C
Avalanche Current Pulse
L=0
0.1
1 mH
Single Pulse Avalanche Energy
TC = 70_C
TA = 25_C
55a, e
IS
6.7b, c
IAS
45
EAS
101
mJ
83
58
PD
W
10b, c
7b, c
TA = 70_C
Operating Junction and Storage Temperature Range
A
100
TC = 25_C
Maximum Power Dissipation
V
90a, e
TC = 25_C
Continuous Drain Current (TJ = 175_C)
Unit
TJ, Tstg
_C
–55 to 175
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Case
Symbol
Typical
Maximum
t p 10 sec
RthJA
12
15
Steady State
RthJC
1.5
1.8
Unit
_C/W
Notes:
a. Based on TC = 25_C.
b. Surface mounted on 1” x 1” FR4 board.
c. t = 10 sec
d. Maximum under steady state conditions is 50_C/W.
e. Calculated based on maximum junction temperature. Package limitation current is 50 A.
Document Number: 73540
S–52237—Rev. A, 24-Oct-05
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SUD50N03-06AP
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VDS
VGS = 0 V, ID = 250 A
30
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VDS/TJ
VDS Temperature Coefficient
VGS(th)/TJ
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = 250 A
IGSS
Gate-Source Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
rDS(on)
Forward Transconductancea
gfs
25
ID = 250 A
VGS(th) Temperature Coefficient
V
mV/_C
– 6.3
2.4
V
VDS = 0 V, VGS = "20 V
"100
nA
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 55_C
10
VDS w 5 V, VGS = 10 V
1.2
50
A
A
A
VGS = 10 V, ID = 20 A
0.0046
0.0057
VGS = 4.5 V, ID = 20 A
0.0062
0.0078
VDS = 15 V, ID = 30 A
70
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
Turn-On Delay Time
3800
VDS = 15 V, VGS = 0 V, f = 1 MHz
305
VDS = 15 V, VGS = 10 V, ID = 30 A
Turn-On Delay Time
Rise Time
1.4
12
18
10
15
30
45
tf
8
12
td(on)
26
40
230
345
25
40
9
14
td(off)
Fall Time
nC
0.9
tr
Turn-Off Delay Time
45
f = 1 MHz
td(off)
Fall Time
95
30
11
tr
Turn-Off Delay Time
62
VDS = 15 V, VGS = 4.5 V, ID= 25 A
9
td(on)
Rise Time
pF
p
615
VDD = 15 V, RL = 0.5 ID ^ 30 A, VGEN = 10 V, Rg = 1 VDD = 15 V, RL = 0.6 ID ^ 25 A, VGEN = 4.5 V, Rg = 1 tf
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward
Currenta
Body Diode Voltage
IS
55c
TC = 25_C
ISM
VSD
100
IS = 6.7 A
0.9
1.5
A
V
Body Diode Reverse Recovery Time
trr
65
100
ns
Body Diode Reverse Recovery Charge
Qrr
38
60
nC
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
IF = 6
6.7
7A
A, di/dt = 100 A/s
A/s, TJ = 25_C
50
15
ns
Notes
a. Pulse test; pulse width v 300 s, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
c. Calculated based on maximum junction temperature. Package limitation current is 50 A.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 73540
S–52237—Rev. A, 24-Oct-05
SUD50N03-06AP
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
20
VGS = 10 V thru 4 V
80
I D – Drain Current (A)
I D – Drain Current (A)
100
60
40
16
TC = –55_C
12
TC = 25_C
8
TC = 125_C
3V
20
4
0
0.0
0.5
1.0
1.5
2.0
2.5
0
0.0
3.0
0.5
VDS – Drain-to-Source Voltage (V)
1.0
0.012
4000
C – Capacitance (pF)
rDS(on) – On-Resistance ()
5000
0.009
VGS = 4.5 V
0.006
VGS = 10 V
60
80
3.5
4.0
3000
2000
Coss
Crss
0
40
3.0
Ciss
1000
0.000
20
2.5
Capacitance
On-Resistance vs. Drain Current
0
2.0
VGS – Gate-to-Source Voltage (V)
0.015
0.003
1.5
0
100
5
ID – Drain Current (A)
10
15
20
25
VDS – Drain-to-Source Voltage (V)
On-Resistance vs. Junction Temperature
Gate Charge
10
1.9
ID = 20 A
1.7
rDS(on) – On-Resistance
(Normalized)
VGS (V)
8
VDS = 15 V
6
VDS = 24 V
4
2
VGS = 4.5 V
1.5
VGS = 10 V
1.3
1.1
0.9
0
0
13
26
39
Qg (nC)
Document Number: 73540
S–52237—Rev. A, 24-Oct-05
52
65
0.7
–50
–25
0
25
50
75
100
125
150
175
TJ – Junction Temperature
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SUD50N03-06AP
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
rDS(on) vs VGS vs. Temperature
0.05
100.000
0.04
rDS(on) On-Resistance ()
I S – Source Current (A)
10.000
TJ = 150_C
1.000
TJ = 25_C
0.100
0.03
0.02
125_C
0.01
0.010
25_C
0.001
0.0
0.00
0.2
0.4
0.6
0.8
1.0
0
1.2
1
2
VSD – Source-to-Drain Voltage (V)
3
4
5
6
7
8
9
10
VGS – Gate-to-Source Voltage (V)
Threshold Voltage
Single Pulse Power, Junction-to-Ambient
600
2.3
2.1
500
1.9
400
Power (W)
VGS(th) – (V)
ID = 250 A
1.7
1.5
1.3
1.1
300
200
0.9
TA = 25_C
100
Single Pulse
0.7
0.5
–50
–25
0
25
50
75
100
125
150
0
0.001
175
0.01
TJ – Temperature (_C)
0.1
1
10
100
1000
Time (sec)
Safe Operating Area
1000
*Limited by rDS(on)
100
10 µs
100 µs
ID (A)
10
1 ms
10 ms
100 ms
1
1s
10s
100s
DC
0.10
0.01
0.001
0.1
TA = 25_C
Single Pulse
1
10
100
VDS (V)
*VGS u minimum VGS at which rDS(on) is specified
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Document Number: 73540
S–52237—Rev. A, 24-Oct-05
SUD50N03-06AP
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Current De-Rating
Power De-Rating
100
90
80
70
60
Power
Drain Current (A)
75
50
50
40
Limited by Package
30
25
20
10
0
0
0
25
50
75
100
125
TC – Case Temperature (_C)
Document Number: 73540
S–52237—Rev. A, 24-Oct-05
150
175
25
50
75
100
125
150
175
TC – Case Temperature (_C)
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SUD50N03-06AP
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Duty Cycle = 0.5
Normalized Effective Transient
Thermal Impedance
0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
10–3
10–2
10–1
1
Square Wave Pulse Duration (sec)
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Case
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.5
0.2
0.1
0.1
0.05
Single Pulse
0.02
0.01
10–4
10–3
10–2
Square Wave Pulse Duration (sec)
10–1
1
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and
Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see
http://www.vishay.com/ppg?73540.
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Document Number: 73540
S–52237—Rev. A, 24-Oct-05
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
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(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
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therein, which apply to these products.
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Document Number: 91000
Revision: 18-Jul-08
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