SHENZHENFREESCALE SUD50N03-06P

SUD50N03-06P
N-Channel
30 V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (W)
ID (A)b
0.0065 at VGS = 10 V
84b
0.0095 at VGS = 4.5 V
59b
VDS (V)
30
D TrenchFETr Power MOSFET
D 175 _C Junction Temperature
D Optimized for Low-Side Synchronous Rectifier
Operation
D 100 % Rg Tested
*
APPLICATIONS
D DC/DC Converters
D Synchronous Rectifiers
TO-252
D
Drain Connected to Tab
G
D
G
S
Top View
S
Ordering Information:
SUD50N03-06P
SUD50N03-06P–E3 (Lead (Pb)–free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 _C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
TC = 25 _C
Continuous Drain Currenta
TC = 100 _C
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
Single Pulse Avalanche Current
L=0
0.1
1 mH
Avalanche Energy
TA = 25 _C
Operating Junction and Storage Temperature Range
V
84b
ID
59b
IDM
100
IS
25
IAS
45
EAS
101.25
TC = 25 _C
Maximum Power Dissipation
Unit
A
mJ
88
PD
W
8.3a
TJ, Tstg
_C
–55 to 175
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
Maximum Junction
Junction-to-Ambient
to Ambienta
Steady State
Maximum Junction-to-Case
RthJA
RthJC
Typical
Maximum
15
18
40
50
1.4
1.7
Notes
a. Surface Mounted on FR4 Board, t v 10 sec.
b. Based on maximum allowable Junction Temperature, package limitation current is 50 A.
* Pb containing terminations are not RoHS compliant, exemptions may apply
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Unit
_C/W
C/W
SUD50N03-06P
N-Channel
30 V (D-S) 175 °C MOSFET
SPECIFICATIONS (TJ = 25 _C UNLESS OTHERWISE NOTED)
Parameter
Typa
Symbol
Test Condition
Min
Max
V(BR)DSS
VGS = 0 V, ID = 250 mA
30
VGS(th)
VDS = VGS, ID = 250 mA
1.0
IGSS
VDS = 0 V, VGS = " 20 V
" 100
VDS = 30 V, VGS = 0 V
1
50
Unit
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
VDS = 30 V, VGS = 0 V, TJ = 125 _C
On-State Drain Currentb
ID(on)
VDS = 5 V, VGS = 10 V
3.0
A
0.0053
VGS = 10 V, ID = 20 A, TJ = 125 _C
rDS(on)
gfs
0.0065
0.0105
VGS = 4.5 V, ID = 20 A
Forward Transconductanceb
0.0078
VDS = 15 V, ID = 20 A
nA
mA
50
VGS = 10 V, ID = 20 A
Drain-Source
Drain
Source On
On-State
State Resistanceb
V
W
0.0095
20
S
Dynamica
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Gate Resistance
Rg
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
Gate-Drain Chargec
Qgd
Turn-On Delay Timec
td(on)
Rise Timec
3100
VGS = 0 V, VDS = 25 V, f = 1 MHz
1
1.9
3.1
21
30
10
VDS = 15 V, VGS = 4.5 V, ID = 50 A
W
nC
7.5
VDD = 15 V, RL = 0.3 W
ID ^ 50 A, VGEN = 10 V, Rg = 2.5 W
td(off)
Fall Timec
pF
p
255
tr
Turn-Off Delay Timec
565
tf
12
20
12
20
30
45
10
15
ns
Source-Drain Diode Ratings and Characteristic (TC = 25 _C)
Pulsed Current
ISM
Diode Forward Voltageb
VSD
IF = 100 A, VGS = 0 V
1.2
1.5
V
trr
IF = 50 A, di/dt = 100 A/ms
35
70
ns
Source-Drain Reverse Recovery Time
100
A
Notes
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width v 300 ms, duty cycle v 2 %.
c. Independent of operating temperature.
TYPICAL CHARACTERISTICS (25 _C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
200
100
VGS = 10 thru 6 V
5V
80
I D – Drain Current (A)
I D – Drain Current (A)
160
120
80
4V
40
60
40
TC = 125 _C
20
25 _C
–55 _C
3V
0
0
0
2
4
6
8
VDS – Drain-to-Source Voltage (V)
2/5
10
0
1
2
3
4
VGS – Gate-to-Source Voltage (V)
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5
SUD50N03-06P
N-Channel
30 V (D-S) 175 °C MOSFET
TYPICAL CHARACTERISTICS (25 _C UNLESS NOTED)
Transconductance
On-Resistance vs. Drain Current
120
0.0150
TC = –55 _C
0.0125
rDS(on) – On-Resistance (W)
g fs – Transconductance (S)
100
25 _C
80
125 _C
60
40
0.0100
VGS = 4.5 V
0.0075
VGS = 10 V
0.0050
20
0.0025
0
0.0000
0
10
20
30
40
50
0
20
40
ID – Drain Current (A)
80
100
40
50
ID – Drain Current (A)
Capacitance
Gate Charge
10
4000
V GS – Gate-to-Source Voltage (V)
Ciss
3500
3000
C – Capacitance (pF)
60
2500
2000
1500
Coss
1000
Crss
500
VDS = 15 V
ID = 50 A
8
6
4
2
0
0
0
5
10
15
20
25
30
0
10
VDS – Drain-to-Source Voltage (V)
20
30
Qg – Total Gate Charge (nC)
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
2.0
100
1.5
I S – Source Current (A)
rDS(on) – On-Resistance
(Normalized)
VGS = 10 V
ID = 20 A
1.0
0.5
0.0
–50
TJ = 25 _C
10
1
–25
0
25
50
75
100
125
TJ – Junction Temperature (_C)
3/5
TJ = 150 _C
150
175
0
0.3
0.6
0.9
1.2
VSD – Source-to-Drain Voltage (V)
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1.5
SUD50N03-06P
N-Channel
30 V (D-S) 175 °C MOSFET
THERMAL RATINGS
Maximum Drain Current vs.
Ambiemt Temperature
Safe Operating Area
1000
30
Limited
by rDS(on)
10, 100 ms
100
I D – Drain Current (A)
I D – Drain Current (A)
24
18
12
6
10
1 ms
10 ms
100 ms
1
TA = 25 _C
Single Pulse
0.1
0
1s
10 s
100 s
dc
0.01
0
25
50
75
100
125
150
175
0.1
1
10
100
VDS – Drain-to-Source Voltage (V)
TA – Ambient Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10–4
10–3
10–2
10–1
1
10
100
1000
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10–4
10–3
10–2
10–1
1
10
Square Wave Pulse Duration (sec)
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100
SUD50N03-06P
N-Channel
30 V (D-S) 175 °C MOSFET
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