Si4532ADY Datasheet

Si4532ADY
Vishay Siliconix
N- and P-Channel 30 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
N-Channel
30
P-Channel
- 30
RDS(on) ()
• Halogen-free According to IEC 61249-2-21
Available
• TrenchFET® Power MOSFETs
• 100 % Rg Tested
• Compliant to RoHS Directive 2002/95/EC
ID (A)
0.053 at VGS = 10 V
4.9
0.075 at VGS = 4.5 V
4.1
0.080 at VGS = - 10 V
- 3.9
0.135 at VGS = - 4.5 V
- 3.0
S2
D1
SO-8
S1
1
8
D1
G1
2
7
D1
S2
3
6
D2
G2
4
5
D2
G2
G1
Top View
Ordering Information:
Si4532ADY-T1-E3 (Lead (Pb-free)
Si4532ADY-T1-GE3 (Lead (Pb-free and Halogen-free)
S1
D2
N-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
N-Channel
Parameter
Symbol
10 s
P-Channel
Steady State
10 s
Steady State
Drain-Source Voltage
VDS
30
- 30
Gate-Source Voltage
VGS
± 20
± 20
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 70 °C
4.9
3.7
3.9
2.9
IDM
Pulsed Drain Current
Continuous Source Current (Diode Conduction)a
Maximum Power Dissipationa
ID
IS
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
PD
V
- 3.9
- 3.0
- 3.1
- 2.4
- 1.0
20
1.7
0.94
- 1.7
2
1.13
2
1.2
1.3
0.73
1.3
0.76
TJ, Tstg
Unit
- 55 to 150
A
W
°C
THERMAL RESISTANCE RATINGS
N-Channel
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Symbol
t  10 s
Steady State
Steady State
RthJA
RthJF
P-Channel
Typ.
Max.
Typ.
Max.
55
62.5
54
62.5
90
110
87
105
40
50
34
45
Unit
°C/W
Note:
a. Surface mounted on 1" x 1" FR4 board.
Document Number: 71133
S11-1908-Rev. D, 26-Sep-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4532ADY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
VGS(th)
IGSS
IDSS
VDS = VGS, ID = 250 µA
N-Ch
1
VDS = VGS, ID = - 250 µA
P-Ch
-1
VDS = 0 V, VGS = ± 20 V
N-Ch
± 100
VDS = 0 V, VGS = ± 20 V
P-Ch
± 100
VDS = 30 V, VGS = 0 V
N-Ch
1
V
VDS = - 30 V, VGS = 0 V
P-Ch
-1
VDS = 30 V, VGS = 0 V, TJ = 55 °C
N-Ch
5
VDS = - 30 V, VGS = 0 V, TJ = 55 °C
P-Ch
-5
ID(on)
RDS(on)
gfs
VSD
VDS 5 V, VGS = 10 V
N-Ch
20
VDS - 5 V, VGS = - 10 V
P-Ch
- 20
VGS = 10 V, ID = 4.9 A
N-Ch
0.044
VGS = - 10 V, ID = - 3.9 A
P-Ch
0.062
0.080
VGS = 4.5 V, ID = 4.1 A
N-Ch
0.062
0.075
VGS = - 4.5 V, ID = - 3 A
P-Ch
0.105
0.135
VDS = 15 V, ID = 4.9 A
N-Ch
11
VDS = - 15 V, ID = - 2.5 A
P-Ch
5
IS = 1.7 A, VGS = 0 V
N-Ch
0.80
1.2
IS = - 1.7 A, VGS = 0 V
P-Ch
- 0.82
- 1.2
N-Ch
8
16
P-Ch
10
20
N-Ch
1.4
P-Ch
2
nA
µA
A
0.053

S
V
Dynamicb
Total Gate Charge
Gate-Source Charge
Qg
N-Channel
VDS = 10 V, VGS = 10 V, ID = 4.9 A
Qgs
Gate-Drain Charge
Qgd
P-Channel
VDS = - 4 V, VGS = - 10 V, ID = - 3.9 A
Gate Resistancee
Rg
f = 1 MHz
td(on)
N-Channel
VDD = 10 V, RL = 10 
ID  1 A, VGEN = 10 V, Rg = 6 
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Source-Drain Reverse Recovery Time
tr
td(off)
tf
1.2
P-Ch
1.9
N-Ch
0.4
1.6
3.2
P-Ch
1.5
6.2
12
N-Ch
12
20
P-Ch
8
15
N-Ch
10
20
P-Ch
9
18
N-Ch
23
45
P-Ch
21
40
N-Ch
8
15
P-Ch
10
20
IF = 1.7 A, dI/dt = 100 A/µs
N-Ch
25
40
IF = - 1.7 A, dI/dt = 100 A/µs
P-Ch
27
40
P-Channel
VDD = - 10 V, RL = 10 
ID  - 1 A, VGEN = - 10 V, Rg = 6 
trr
N-Ch
nC

ns
Notes:
a. Pulse test; pulse width  300 µs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 71133
S11-1908-Rev. D, 26-Sep-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4532ADY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
20
20
VGS = 10 V thru 5 V
16
4V
I D - Drain Current (A)
I D - Drain Current (A)
16
12
8
4
12
8
TC = 125 °C
4
3V
25 °C
0
0.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0
4.0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
5
600
0.15
500
0.12
Ciss
C - Capacitance (pF)
R DS(on) - On-Resistance ()
- 55 °C
0.09
VGS = 4.5 V
0.06
VGS = 10 V
400
300
200
Coss
0.03
100
Crss
0
0.00
0
4
8
12
ID - Drain Current (A)
16
0
20
6
12
On-Resistance vs. Drain Current
24
30
Capacitance
10
1.8
VDS = 10 V
ID = 4.9 A
R DS(on) - On-Resistance (Normalized)
VGS - Gate-to-Source Voltage (V)
18
VDS - Drain-to-Source Voltage (V)
8
6
4
2
0
0
2
4
6
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 71133
S11-1908-Rev. D, 26-Sep-11
8
VGS = 10 V
ID = 4.9 A
1.6
1.4
1.2
1.0
0.8
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4532ADY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
0.15
0.12
10
ID = 4.9 A
0.09
TJ = 150 °C
R DS(on) -
I S - Source Current (A)
20
TJ = 25 °C
0.06
0.03
0.00
1
0
0.2
0.4
0.6
0.8
1.0
1.2
VSD - Source-to-Drain Voltage (V)
0
1.4
Source-Drain Diode Forward Voltage
2
4
6
8
VGS - Gate-to-Source Voltage (V)
10
On-Resistance vs. Gate-to-Source Voltage
0.4
30
0.2
0.0
Power (W)
V GS(th) Variance (V)
24
ID = 250 µA
- 0.2
18
12
- 0.4
6
- 0.6
- 0.8
- 50
- 25
0
25
50
75
100
125
150
0
10 -3
10 -2
10 -1
TJ - Temperature (°C)
Threshold Voltage
1
Time (s)
10
100
600
Single Pulse Power
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 90 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
10 -3
4. Surface Mounted
10 -2
10 -1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Document Number: 71133
S11-1908-Rev. D, 26-Sep-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4532ADY
Vishay Siliconix
N-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
P-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
20
20
TC = - 55 °C
VGS = 10 V thru 6 V
16
5V
I D - Drain Current (A)
I D - Drain Current (A)
16
12
8
4V
4
25 °C
125 °C
12
8
4
2V
3V
0
0
0
2
4
6
VDS - Drain-to-Source Voltage (V)
8
0
1
6
7
Transfer Characteristics
0.30
1000
0.24
800
C - Capacitance (pF)
R DS(on) - On-Resistance ()
Output Characteristics
2
3
4
5
VGS - Gate-to-Source Voltage (V)
0.18
VGS = 4.5 V
0.12
VGS = 10 V
Ciss
600
400
0.06
200
0.00
0
Coss
Crss
0
3
6
9
ID - Drain Current (A)
12
On-Resistance vs. Drain Current
Document Number: 71133
S11-1908-Rev. D, 26-Sep-11
15
0
6
12
18
24
VDS - Drain-to-Source Voltage (V)
30
Capacitance
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4532ADY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
1.8
VDS = 10 V
ID = 3.9 A
R DS(on) - On-Resistance (Normalized)
VGS - Gate-to-Source Voltage (V)
10
8
6
4
2
2
4
6
8
Qg - Total Gate Charge (nC)
1.4
1.2
1.0
0.8
0.6
- 50
0
0
VGS = 10 V
ID = 3.9 A
1.6
10
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
30
0.40
RDS(on) - On-Resistance ()
TJ = 150 °C
I S - Source Current (A)
- 25
10
TJ = 25 °C
1
0.32
ID = 3.9 A
0.24
0.16
0.08
0.00
0
0.3
0.6
0.9
1.2
VSD - Source-to-Drain Voltage (V)
1.5
0
Source-Drain Diode Forward Voltage
2
4
6
8
VGS - Gate-to-Source Voltage (V)
10
On-Resistance vs. Gate-to-Source Voltage
30
0.8
0.6
24
0.4
Power (W)
VGS(th) Variance (V)
ID = 250 µA
0.2
18
12
0.0
6
- 0.2
- 0.4
- 50
- 25
0
25
50
75
TJ - Temperature (°C)
Threshold Voltage
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6
100
125
150
0
10 -2
10 -1
1
Time (s)
10
100
Single Pulse Power, Junction-to-Ambient
Document Number: 71133
S11-1908-Rev. D, 26-Sep-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Si4532ADY
Vishay Siliconix
P-CHANNEL TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 87 °C/W
0.02
3. T JM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
10 -3
4. Surface Mounted
10 -2
10 -1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.02
0.05
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71133.
Document Number: 71133
S11-1908-Rev. D, 26-Sep-11
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This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Information
Vishay Siliconix
SOIC (NARROW): 8-LEAD
JEDEC Part Number: MS-012
8
6
7
5
E
1
3
2
H
4
S
h x 45
D
C
0.25 mm (Gage Plane)
A
e
B
All Leads
q
A1
L
0.004"
MILLIMETERS
INCHES
DIM
Min
Max
Min
Max
A
1.35
1.75
0.053
0.069
A1
0.10
0.20
0.004
0.008
B
0.35
0.51
0.014
0.020
C
0.19
0.25
0.0075
0.010
D
4.80
5.00
0.189
0.196
E
3.80
4.00
0.150
e
0.101 mm
1.27 BSC
0.157
0.050 BSC
H
5.80
6.20
0.228
0.244
h
0.25
0.50
0.010
0.020
L
0.50
0.93
0.020
0.037
q
0°
8°
0°
8°
S
0.44
0.64
0.018
0.026
ECN: C-06527-Rev. I, 11-Sep-06
DWG: 5498
Document Number: 71192
11-Sep-06
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Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR SO-8
0.172
(4.369)
0.028
0.022
0.050
(0.559)
(1.270)
0.152
(3.861)
0.047
(1.194)
0.246
(6.248)
(0.711)
Recommended Minimum Pads
Dimensions in Inches/(mm)
Return to Index
APPLICATION NOTE
Return to Index
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Document Number: 72606
Revision: 21-Jan-08
Legal Disclaimer Notice
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
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Revision: 02-Oct-12
1
Document Number: 91000