Portable & Wearable Solutions Brochure

Smart Phone
Vbat
Battery
Protection
Mini
PMIC
DC-DC
Converter
Battery
Power
Discretes
LDO
Small Signal
Discretes
Load
Switch
Switches &
Op Amps
Standard
Logic
ESD/EMI
Protection
Building Block Components
Subsystem Power Supplies
Battery
Charger
WLAN/BT/FM/GPS/NFC Module
Vbat
Power
Management
Unit (PMU)
Fuel
Gauge
Wireless
Charging
USB
Protection
Power
Protection
Clock
Buffer
Core
DC-DC
Cellular
Modem SoC
Applications
Processor
USB/MHL
Switches
PA
DC-DC
Front End
Module
PA
Camera PMIC
Memory
USB
Temp
Sensor
Power
Adapter
Tunable
RF
CODEC
Head
Phone
Amp
Speech
DSP
MEMs
Sensors
Camera
ESD + EMI
Protection
Active EMI
Suppression
Camera
SIM/Memory
Card Interface
Speaker
Amp
Image Sensor
Processor
Vbat
Lens AF
Driver
Camera
EEPROM
Image
Sensor
Lens
OIS
Hall
Sensor
Gyro
Flash
Flash
Driver
Audio
Protection
LED
Backlight
Display
Protection
Audio
Haptic
Motor
Motor
Driver
Display
Driver
Touch
Controller
ALS +
Proximity
Sensor
AMOLED
Power
LCD
Display
Touch Display & UI
Wearable
Battery
Charger
Battery
Mini
PMIC
Battery
Protection
LDO
DC-DC
Converter
Power
Discretes
Small Signal
Discretes
Switches &
Op Amps
Standard
Logic
ESD/EMI
Protection
Load
Switch
Subsystem Power Supplies
Wireless
Charging
Fuel
Gauge
USB
Protection
Power
Protection
Building Block Components
WLAN/BT/FM/GPS/NFC Module
Microcontroller
Memory
USB
Image Signal
Processor
Sensors
Power
Adapter
SIM/Memory
Card Interface
Speaker
Amp
Camera
Protection
LED
Backlight
CODEC
Audio
Protection
Head
Phone
Amp
Audio
Page 2
Display
Protection
Audio
DSP
Haptic
Motor
Motor
Driver
MEMs
Sensors
Camera
Lens AF
Driver
Image
Sensor
Hall
Sensor
Camera
EEPROM
Lens
Display
Driver
Touch
Controller
ALS +
Proximity
Sensor
AMOLED
Power
LCD/
AMOLED
Display
Touch Display & UI
Portable & Wearable Solutions
AF Voice
Coil Motor
CAMERA MODULES
Camera Module
OIS VCM (3-Axis)
Image Sensor
AF, OIS Driver, Gyro
AF System
Camera PMU
Hall
Element
AF VCM
Data
EEPROM
Image
Sensor
AF
Driver
Clock
Reset
MCLK
Image Signal
Processor
I2C
I2C
Application
Processor
OIS System
OIS VCM
Hall
Element
Lens
ON Semiconductor
OIS
Position
OIS
Driver
SPI
OIS
Gyro
Power
GND
Connector
Page 3
CAMERA MODULES
Mobile CMOS Imaging Sensors
The portable CMOS imaging sensor portfolio from ON Semiconductor provides options for all applications, whether a leading flagship
model, a super sleek thin model, or a standard mainstream model that needs a great performing front and rear camera sensor.
Key Features
•Superior image quality with world-leading pixel technology
•Fast frame rates for the best action shots
•Low light sensitivity delivering low light image quality
•High-Definition (HD) and 4K Video
Resolution
(MP)
Optical Format
Pixel Size
(mm)
Sensor Type
Frame Rate
MT9V115
VGA
1/13”
1.75
SOC
VGA 30 fps
ASX370
VGA
1/7”
3.0
SOC
VGA 30 fps
MT9M114
1.2
1/6”
1.9
SOC
720P 30 fps
AR0260
2.1
1/6”
1.4
SOC
1080P 30 fps
AR0261
2.1
1/6”
1.4
Raw
1080P 60 fps
AR0330
3.5
1/3”
1.75
Raw
1080P 60 fps
AR0543
5.0
1/4”
1.4
Raw
5 MP 15 fps
AR0841
8.0
1/4”
1.4
Raw
8 MP 30 fps
AR0842CP
8.0
1/4”
1.1
Raw - Clarity+
8 MP 30 fps
AR0833
8.0
1/3.2”
1.4
Raw
8 MP 30 fps
AR0835
8.0
1/3.2”
1.4
Raw
8 MP 42 fps
AR1335
13
1/3.2”
1.1
Raw
13 MP 30 fps
AR1820HS
18
1/2.3”
1.25
Raw
18 MP 24 fps
Device
Page 4
Portable & Wearable Solutions
LC898123F40 DSP-based Optical Image Stabilization (OIS) and Auto Focus (AF) controller/driver includes integrated Flash memory,
analog circuits, H-bridge and constant current drivers. The integrated Flash enables fast wakeup and simplifies Host-side software
implementation.
Key Features
•Integrated DSP software filter
•Integrated Flash memory (40 KB)
•Integrated OSC, LDO, and Hall amplifier
•Digital Gyro I/F
•4-channel, 14-bit ADC; 3-channel, 8-bit DAC
I2C
IF
OSC
H-Bridge
Const Current
for AF
D-Gyro
IF
H-Bridge
Const Current
for OIS
Flash
(40 KBytes)
DA
Control Logic
Position
Sensor
AD
DSP
PWM Logic
LC898123F40 Block Diagram
Type
VDD Min
(V)
VDD Max
(V)
VM Min
(V)
VM Max
(V)
Driver
(mA)
CPU IF
LC898122/122A
Feedback
2.6
3.6
2.6
3.6
220/150
I2C
LC898123AXD
Feedback
2.6
3.6
2.6
3.6
195/120
I2C
LC898123F40*
Feedback
2.6
3.3
2.6
3.3
200/150
I2C
8-Bit
Device
D/A
A/D
Package(s)
8-Bit
12-Bit
WLCSP-30
8-Bit
12-Bit
WLCSP-35
14-Bit
WLCSP-35
* Pending 3Q16
ON Semiconductor
Page 5
CAMERA MODULES
Optical Image Stabilization Drivers
CAMERA MODULES
Closed Auto-Focus Drivers
LC898217XC closed loop auto focus driver includes integrated driver, loop digital filter, and EEPROM. System implementation requires
only a Hall sensor and by-pass condenser. LC898217XC enables fast and accurate auto focusing, with low power consumption, from
an extremely small footprint.
Key Features
•Integrated equalizer circuit
•Integrated EEPROM memory (128 byte)
•Integrated OSC, LDO, and Hall amplifier
•Integrated Constant Current Driver and Linear Compensation
•1-channel, 11-bit ADC; 2-channel, 8-bit DAC
OSC
LDO
I2C IF
EEPROM
DA
Hall
Sensor
Hall
Amp
Constant
Current
Driver
DA
Equalizer
AD
Control Logic
LC898217XC Block Diagram
Type
VDD Min
(V)
VDD Max
(V)
VM Min
(V)
VM Max
(V)
Driver
(mA)
CPU IF
D/A
A/D
Package(s)
LC898212XC/D
Feedback
2.6
3.6
2.6
3.6
130
I2C
8-Bit
10-Bit
WLCSP-12
LC898214XC/D
Feedback
2.6
3.6
—
—
120
I2C
8-Bit
10-Bit
WLCSP-8
LC898217XC
Feedback
2.6
3.3
—
—
110
I2C
8-Bit
11-Bit
WLCSP-10
Device
Page 6
Portable & Wearable Solutions
CAMERA MODULES
Camera Module PMICs
Key Features
•Mid-size integration
•Complements main PMU under minimum supervision
•CSP package saves space on a flex or dedicated PCB
•High performance
•High efficiency and low quiescent current for battery life
•Low noise (<50 µVRMS) for high resolution performance
•Fully programmable through I2C to adapt default output voltages
and power up and down sequencing
•Modular approach
•5 or 6 regulators for 2D / 3D modules and back / front cameras
NCP6915
PVIN1
2.2 uF
System Supply
VBG
100 nF
Core
AGND
SW1
DCDC 1
600 mA
FB1
VIN1
System Supply
VIN2
Enabling
1 uF
Thermal
Protection
Power Up
& Down
Sequencer
HWEN
SDA
Processor I2C
I2C
SCL
Device
ON Semiconductor
10 uF
PGND1
1.0 uF
System Supply
or
DCDC Out
DCDC1 Out
1 uH
DC-DC
(mA)
LDO1
200 mA
VOUT1
LDO2
200 mA
VOUT2
LDO3
200 mA
VOUT3
LDO4
200 mA
VOUT4
LDO5
300 mA
VOUT5
LDO
(mA)
1.0 uF
1.0 uF
1.0 uF
1.0 uF
1.0 uF
Package(s)
NCP6925
2 x 1000
5 x 300
CSP-36
NCP6924
2 x 1000
2 x 300, 2 x 150
CSP-30
NCP6914
1 x 800
4 x 300
CSP-20
NCP6915
1 x 600
1 x 300, 4 x 150
CSP-16
Page 7
Low-Voltage Portable LED Driver Topologies
White LED and RGB tricolor LEDs are widely used for backlighting small color LCD panels and keyboards, as well as indicators. High
brightness LEDs are used as flash light sources in smart phones and digital cameras. These applications require optimized solutions
which can maximize battery lifetime, as well as minimize the PCB area and height. ON Semiconductor has a variety of solutions using
linear, inductive, and charge pump topologies. The inductive solution offers the best overall efficiency, while the charge pump solution
takes up a minimal amount of space and height due to the use of low profile ceramic capacitors as the energy transfer mechanism.
Linear drivers are ideal for color indicator as well as simple backlighting applications.
VBAT
Vbat
22 μH
LCD MODULES
PWM/
1-Wire
1 μF
1 μF
GND
VIN SWIRE SW
LV52204
FB
FCAP GND
Vbat
4.7 F
1 F
C2P
C1N
Vout
LCD MODULES
GND
GND
GND
Charge Pump Topology
Page 8
1 F
EN/PWM
Fsel
Vsel
10 Ω
Inductive Boost Topology
C1P
NCP5603
1 F
PWM
FSEL
VSEL
220 nF
C2N
GND
Portable & Wearable Solutions
Charge Pump/White and RGB LED Drivers — for LCD Backlight, LED Flash/Torch and Indicator
Device
Input
Voltage
Range
(V)
Number
of
Outputs
NCP5603
2.85 5.5
1
NCP5623B/C
Total
LED-LED
Output
Charge Pump Current
Current Regulation Operating Matching,
(mA)
Mode
Mode
Typ
200 mA DC,
350 mA
Voltage 1X, 1.5X, 2X
—
pulse
3
2.7 - 5.5 (Independent)
90
Current
1X, 2X
Operating
Number of
Quiescent
Current Level/ Current, Typ
Profile
(mA)
Dimming
Method
Shutdown
Current
(mA)
PWM
Depends on
system
1
2.5 typ
I2C
32/ quasi-log
0.35
0.8 typ
±0.5%
Package
Notes
•Backlight
DFN-10 •4.5 / 5 V output
•Short circuit protection
•RGB illumination
•Backlight
LLGA-12 •Built-in “gradual illumination”
•B & C versions have different
I2C addresses
Inductive Boost and Buck Topology
Inductive-Boost White-LED Drivers — for Backlighting and Torch/Flash Applications
Device
Input
Voltage
Range
(V)
Max
Output
Volt, Typ
(V)
Output
Current
(mA)
Condition
Number of LEDs/
Configuration
Switching Mode/ Dimming
Frequency
Method
Efficiency
(%)
Operating
Quiescent Shutdown
Current, Typ Current, Typ
(mA)
(mA)
Package
Notes
NCP1529
2.7 - 5.5
3.9
1
Vout 1.2 V,
Vin 3.6 V
1
PWM/PFM
1.7 MHz
PWM
96
28
0.3
TSOP-5,
uDFN-6
•Flash/Torch
•Auto-switching between
PWM and PFM mode at
light load
NCP1422
1.0 - 5.0
5
800
Vout 3.3 V,
Vin 2.5 V
1 for flash
PFM,
up to 1.2 MHz
PWM
94
1.3 µA
0.05
DFN-10
•Flash/Torch
•Internal synchronous
rectification
NCP5005
2.7 - 5.5
24
40
Over 5 LED,
Vin 3.6 V
2 to 5/ series
PFM,
up to 2.25 MHz
PWM
90
—
0.3
TSOP-5
•Backlight
•Isw = 350 mA
LV52204
2.7 - 5.5
40
30
Vout 30 V,
Vin 3.7 V
2 to 10 / Series
600 kHz
1-wire &
PWM
90
3
0.1
UDFN-6
•Backlight
•Isw = 750 mA
LV52205
2.7 - 5.5
40
30
Vout 30 V,
Vin 3.7 V
2 to 11 / Series
600 kHz
PWM
90
3
0.1
UDFN-6
•Backlight
•Isw = 750 mA
LV52206
2.7 - 5.5
40
30
Vout 30 V,
Vin 3.7 V
2 to 10 / Series
600 kHz/1.2 MHz
1-wire &
PWM
90
3
0.1
WLP-9
•Backlight
•Different pin config
LV52207
2.7 - 5.5
40
30
Vout 30 V,
Vin 3.7 V
2 to 10 / Series
600 kHz/1.2 MHz
1-wire &
PWM
90
3
0.1
WLP-9
•Backlight
•Isw = 750 mA
Multifunction LED Drivers
Device
Input
Voltage
Range
(V)
Main Backlight
LED Driver
LV5207LP
3.0 to 4.5
4-Ch
(3-Ch Avail)
LV5216
3.0 to 4.5
10-CH
ON Semiconductor
RGB LED Driver 1
External
Control
Topology
Serial Control
Package
Notes
R,G,B Independent ON/OFF
4
Charge Pump
I2C Control Bus
VCT-24
•7 LED channels total
•LED current programmable in 32 steps
R,G,B and 6 Main
4
Charge Pump
I2C Control Bus
WLP-36
•LED current programmable in 32 steps
Page 9
LCD MODULES
S
Charge Pump Topology
LCD Display Bias
The LV52133A0XA and LV52133A5XA generate user-programmable dual-out votages with a single inductor. Each device features short
circuit protected output stages, small footprint, and ultra-low standby current.
2.5 to 5.5 V
Vbat
4.7 μH
Key Features
•Dual-outputs with single-inductor architecture
•Adjustable output voltages via I2C
•Short Circuit Protection
LX
PGND
2.2 μF
LCD MODULES
Device
Input Voltage Range
LV52133A0XA
2.5 to 5.5 V
LV52133A5XA
Page 10
Default Output Voltage
VOUT1 = +5.0 V
VOUT2 = -5.0 V
VOUT1 = +5.5 V
VOUT2 = -5.5 V
VIN
VBST
4.7 μF
4.7 μF
CP
CN
VOUT1
SGND
VOUT2
SDA
EN1
SCL
EN2
4.7 μF
4.7 μF
+5 V
-5 V
LCD MODULES
Output Voltage Setting Range
Output Current
Standby Current
Package
VOUT1: +4.1 to +5.7 V
VOUT2 : -4. V to -5.7 V
(100 mV step)
200 mA (VOUT1);
100 mA (VOUT2)
0.3 mA
WLP-15J
Portable & Wearable Solutions
LC898302A
LC898301
The LC898302A is a haptic driver able to drive LRA and ERM. The drive
frequency is automatically adjusted to the resonance frequency of the
linear vibrator without external components.
The LC898301 is an extended supply range version of the LC898300
LRA driver, compatible with cellular battery voltage. The architecture
chosen enables strong vibration in minimal board space. Moreover, the
LC898301 exhibits superior vibration performance.
Unique Features
•Drive LRAs with automatic tuning and breaking
•Drive ERM; drive voltage controlled via PWM
Unique Features
Other Features
•Supply voltage = +3.0 to +5.5 V
•Iout max = 200 mA
•Bridge RDS(on) = 2 x 2 W (4 x 2 W MOSFETs embedded)
•Low standby current
Benefits
•High efficiency
•Easy handling (no adjustment for any LRA)
•Strong vibration
•Automatically adjust driving frequency (ON Semiconductor
patent)
•Minimized start-up and brake period (Quick stop)
•Automatically stop braking to avert counter vibration
LCD MODULES
S
Haptic Drivers
Other Features
•Supply voltage = +3.0 to +5.5 V
•Iout max = 200 mA
•Bridge RDS(on) = 2 x 2 W (4 x 2 W MOSFETs embedded)
•No peripheral component required (only 0.1 µF cap)
•Low power consumption
Benefits
Device
LC898302A
Description
Package
Haptic Driver for LRA and ERM
WLCSP-6
VDD (2.7 to 4.5 V)
LDO
•Fault-detection
•Battery direct supply
•Fully configurable through
I2C
•High efficiency
•Easy handling (no adjustment for any LRA)
•Strong vibration
POR
H-Bridge
Driver
PWM
Drive Signal
Generator
OUT1
OUT2
Device
LRA
ERM
Description
Package
LC898301XA
Haptic Driver for LRA
WLCSP-8
LC898301AXA
Haptic Driver for LRA with Immersion System
WLCSP-8
MODE
OSC
VDD (3.0-5.5 V)
TSD
DVDD (1.8 V)
VSS
LDO
Block Diagram
EN
<I2C IF>
SCL
SDA
Drive Signal
Generator
H-Bridge with
Power Control
Register
Setting
OSC
OUT1
OUT2
Linear
Vibrator
RSTB
VSS
Block Diagram
ON Semiconductor
Page 11
Ambient Light & Proximity Sensors
NOA1305 Features
•Design flexibility/customization (i.e., EEPROM if
desired for trimming)
•0.0125 lux detection with customizable filtering
(i.e., Photopic Light Response)
•Dark current and temperature compensation
•Lowest power consumption per resolution bit
•I2C Interface (including High Speed Mode) and
no effect on bus during power down
LCD MODULES
Voltage
Supply
Vin = 3.3 V
hν
1k
VDD
16-Bit
ADC
Voltage
Supply
0.1 μF
SCL
I2C
Bus
SD
LV0104CS
LED
Drivers
MCU
CPU
LEDs
SCL
When the Sunlight is Strong,
Extending the Dynamic Range
by Lowering Gain
LCD MODULES
VCC
SW
0.1 μF
Control
Logic
SDA
SDA
Ambient
Light
1 μF
Sensor
VSS
SCL
VCC
Approximates
Human Eye
Response
1k
Amp
OUT
Gain Cont.
I/O
CPU
ADC
Current-Voltage
Conversion
Simple
2-Wire I2C
Interface
LA0151CS
GND
GND
Device
Special Features
IO Typ @ E V = 100 Lux
(mA)
Output Interface
Vin Range
(V)
TA Range
(°C)
Package
LA0151CS
2-Stage Gain Switching
8 (high gain)
Analog, linear current
2.2 - 5.5
-30 to +85
ODCSP-4
LV0104CS
Integrated Sleep Mode
—
I2C, 16-bit ADC
2.3 - 3.6
-30 to +85
ODCSP-4
LV0111CF
Standby Function
21
Analog, logarithmic current
2.3 - 5.5
-30 to +85
ODCSP-4J
NOA1212
Dark Current Compensation
51 (high gain)
Analog, linear current
2.0 - 5.5
-40 to +85
CUDFN-6
NOA1213
Dark Current Compensation
—
Analog
2.0 - 5.5
-40 to +85
CUDFN-6
NOA1305
Dark Current Compensation
—
I2C, 16-bit ADC
2.4 - 3.6
-40 to +85
CUDFN-6
NOA3302
Proximity Sensor
—
I2C, 16-bit ADC
2.3 - 3.6
-40 to +80
CWDFN-8
Page 12
Portable & Wearable Solutions
RF Antenna Tuning Solutions
ON Semiconductor offers a family of dyanamic tunable RF components designed to enhance antenna performance of smartphones. The devices
optimally combine tuning range, RF quality factor (Q), and frequency operation, providing a superior solution to existing fixed-match approaches.
These components form a flexible and comprehensive solution that can be customized to meet the RF tuning needs of any smartphone designfrom open-loop matching approaches, to advanced closed-loop tuning systems. Our tunable RF solutions are ideally suited for LTE-A networks with
advanced features to support, including: Carrier Aggregation, MIMO, and ASDiv functionality.
•Reduced power consumption
•Enables thinner smartphone designs
•Faster data rates
•Greater coverage area of cell sites
•Fewer dropped or missed calls
S
50 Ohm
Test Port
Tunable
Match
Attenuators
WiFi Filter
Front End
Sense IC
Control IC
Sense
Measurements
Baseband
&
Transceiver
DAC
Values
Closed-Loop Tuning
Think of the different ways in which you use your smartphone in a given day — texting
a friend, typing an email, gaming, or making a phone call. Each of these use cases
affect how your handset performs.
Closed-loop tuning systems provide the most advanced system for adapting to
use case changes. These systems take real- time impedance measurements and
optimize antenna performance to overcome the impact of various use-case effects.
Software Client
Sense IC
Driver
Control IC
Driver
Tuning
Algorithm
Passive Tunable Integrated Circuits (PTIC)
Passive Tunable Integrated Circuits can be used to replace traditional
‘fixed-match’ devices for multi-band GSM/WCDMA/LTE smart phones,
tunable antenna matching networks, and active antennas.
•High tuning range (5:1) and operation up to 24 V
•Frequency range from 700 MHz to 2.7 GHz
•High quality factor (Q) for low loss
•High power handling capability
•Capacitor values from 1.2 pF to 8.2 pF
•TCP Series*
* Pending 3Q16
ON Semiconductor
PTIC Controllers
The PTIC Controller is a high-voltage digital-to-analog device specifically
designed to provide control and bias in a tunable solution. It is
compatible with all ON Semiconductor PTICs.
•Compliant with timing needs of cellular and other
wireless system requirements
•Integrated boost converter with three to six
programmable outputs (up to 24 V)
•Low power consumption
•Auto-detection of SPI (30- or 32-bit) or MIPI RFFE
interfaces (1.2 V or 1.8 V)
•TCC Series*
Page 13
RF
Coupler
Integrated Passive Devices (IPD)
•Combines multiple resistors, capacitors and inductors onto a film substrate; typical applications include RF baluns, filters, and
matching networks
•Reduces PCB footprint and component height versus discrete implementations, while also improving performance (reduced parasitics)
•Simplifies logistics, inventory managememt and pick-and-place assembly by elimination of multiple discrete passive SKUs
Available Components
•Copper inductors, IPD2 11 µm thick,
IPD1 5 µm thick. Minimum spacing 3 µm,
minimum line width 5 µm, current handling
>50 mA/µm, achieves Q-factors up to 45
•MIM capacitors, 0.62 nF/mm2 , typical
tolerance ±5%
•TiN resistors, 9 Ω/sq
Discrete Solution
IPD Solution
2.4 GHz LPF Designs for ZigBee®
RF
Sub-Micron Tolerances — Trace Spacing/Width Down to 3/5 mm
•Flip-chip or wirebond pad finish options
•Additional back-end processing available
Inductor Within IPD (SEM Photo)
Picked & Diced Wafer Edge
Page 14
Portable & Wearable Solutions
Single Ended Buffers
Clock Buffer with Integrated LDO
Key Features — NB3RL02
•Low additive noise: −149 dBc/Hz at 10 kHz offset
phase noise
•0.37 ps (rms) output jitter
•Limited output slew rate for EMI reduction
(1 to 5 ns rise/fall time for 10−50 pF loads)
•Regulated 1.8 V externally available I/O supply
•ESD performance exceeds JESD 22
•2000 V Human−Body Model (A114−A)
•200 V Machine Model (A115−A)
•1000 V Charged−Device Model
(JESD22−C101−A Level III)
•WLCSP-8 package
NB3RL02 has two CMOS outputs with clock request lines. Systems in need of
TCXO clock will request clock from NB3RL02, and NB3RL02 powers the TCXO
and delivers the requested clock.
NB3RL02
VLDO
2.2 μF
LDO
VBATT
1 μF
CLK_REQ_1
CLK_OUT_1
MCLK_IN
CLK_REQ_2
CLK_OUT_2
TCXO
Li
DTV
TCXO REQ
TCXO CLK
TCXO REQ
TCXO CLK
GND
WLAN
NB3RL02 Reduces Cost by Eliminating Multiple TCXOs
Key Features — NB3L02, NB3L03
•800 mV single ended outputs
•Low additive noise: -144 dBc/Hz at 10 kHz offset
phase noise
•ESD performance exceeds JESD 22: 2 kV Human
Body Model
•WLCSP-6 package
RF
Clock Buffers for Wireless LAN and WiMax
NB3L02 and NB3L03 are low-skew, low jitter, 1:2 and 1:3 clock buffers.
The MCLK_IN pin has an AC coupling capacitor and will directly accept a
square or sine wave clock input, such as a temperature compensated crystal
oscillator (TCXO). The minimum acceptable input amplitude of the sine wave
is 300 mV peak-to-peak.
NB3L02
VBATT
LDO
GND
CLK_OUT_1
MCLK_IN
CLK_OUT_2
NB3L02 Simplified Block Diagram
ON Semiconductor
Page 15
BelaSigna® Audio Processors
The BelaSigna line of audio processors is optimized for portable applications, delivering superior audio clarity without compromising size or battery
life.BelaSigna offers ultra-low power consumption, design flexibility, and a miniature package by providing a highly integrated hardware solution with
a dual-core architecture featuring an open-programmable DSP core with a highly configurable coprocessor.
Features and Benefits
•Ultra-low power consumption
•Design flexibility
•Miniature size
•Computational Efficiency
•Audio fidelity
•Comprehensive development
tools
Real-time adaptive processing
SELECTIVITY
SPATIAL
z
y
010100001...
x
TEMPORAL
100111000...
FREQUENCY
Capture & Digitization
Extraction
Description
MIPS
Max
Dynamic
Range
(dB)
RAM
(kB)
BelaSigna 300
24-bit Audio Processor for Portable
Communication Devices
240
110/88
BelaSigna 250
16-bit Audio Processor,
Full Stereo 2-in, 2-out
60
88
Device
Comparison
Enhancement
Interfaces
Power
Consumption
Standby
Current
(mA)
Analog
Audio
Package(s)
110
I2C, SPI, I2S,
PCM, GPIO,
1-5 mA typical
40
4/1
WLCSP-35,
DFN-44
42
I2C, SPI, I2S, PCM,
GPIO, UART
5 mA at 20 MHz
50
2/2
LFBGA-64,
LFBGA-57
BelaSigna R281
Always-Listening, Voice Trigger Solution
High-performance solution designed to process and enhance audio in
real-time for a louder, fuller, and deeper sound. For more information,
please visit aftermaster.com
•Will detect a single, user-trained trigger phrase, asserting
awake-up signal when this phrase is detected
•~300 mW power consumption for true “always-on” operation
without affecting battery Standby life
•Available in QFN and WLCSP packages
AUDIO
BelaSigna 300 AM
with AfterMaster HD Technology
Hello,
BelaSigna
Page 16
Portable & Wearable Solutions
Developing a portable audio device from initial concept and design through to production can be a complex and lengthy process. Success, however,
often depends on shortening product development cycles, enabling faster time-to-market.
ON Semiconductor addresses this need by providing designers with a complete solution, no matter which development path they chose. In addition
to a variety of software algorithm bundles, BelaSigna audio processors are also complemented by an advanced suite of development tools. The fully
integrated set of development tools enable manufacturers to quickly and easily develop, debug and test algorithm software for ON Semiconductor’s
audio DSP systems.
Evaluation and Development Kit Contents
Software
EDK Software and Documentation*
Integrated Development Environment (IDE)
Advanced Editor
Debugger
Project Manager
Automated Build System
Project Wizard
EEPROM Manager
Assembler
Sample Applications
System Libraries
Documentation Set
WOLA Toolbox
SignaKlara™ Blockset
CTK Developer Kit (CTK DK)
CAA Drivers
Hardware
Evaluation and Development Board (EDB)
Communication Accelerator Adaptor (CAA)
RS-232 serial cable
USB cable
I2C cable
Universal power supply (input 100-240 VAC, ~60/50Hz; output
9 VDC, 1.1A)
AUDIO
* The EDK includes one year of software updates.
Optional Hardware
Rapid Prototyping Module (RPM)
Available for Purchase
RPM Motherboard
Available for Purchase
Supplementary hardware, such as the Communication Accelerator Adaptor and Evaluation and Development Board, are also available for purchase.
Contact your local ON Semiconductor sales office at www.onsemi.com/salessupport for information on purchasing or renewing software subscriptions.
ON Semiconductor
Page 17
+
Solution Evaluation
Algorithm Development
To evaluate audio processors and signal
processing software, ON Semiconductor
offers a solution that is easy to demonstrate,
evaluate and design in. Developers can
use software tools to develop their own
signal processing algorithms to run on the
BelaSigna hardware.
To support the algorithm development process,
ON Semiconductor offers an Evaluation and
Development Kit (EDK) featuring an Integrated
software Development Environment (IDE) for
composing, compiling and debugging algorithm
code. A Communication Accelerator Adaptor
(CAA) connects the IDE running on a PC to a
Rapid Prototyping Module (RPM) or Evaluation
and Development Board (EDB)*. Using these
components, developers can implement and
immediately validate the performance of their
proprietary algorithms, third-party algorithms,
or other software integrated with BelaSigna
bundles directly on BelaSigna hardware.
RPM
PC
IDE
CAA
RPM or EDB*
Integrated Development Environment (IDE)
ON Semiconductor’s Integrated Development Environment is a fully integrated
software development environment that enables developers to code, compile,
debug and validate algorithms. Features include:
6
5
4
3
1
•Team based programming that greatly simplifies project management by
allowing multiple developers to simultaneously work on the same design.
2
•Project wizard with templates based on sample algorithms, automatic
no-maintenance project builder and system libraries to reduce development
time.
•Integrated debugger providing full source code debugging and scriptable
interface, customized expression watch, register, and memory views with
changed value highlighting.
7
8
9
Debug perspective showing (1) source code, (2) disassembly, (3) debug,
(4) breakpoint, (5) expression, (6) register, (7) command console, (8) content
assist, and (9) memory views.
AUDIO
•Sample application source code provides complete sample algorithms plus
samples of most basic application components.
•Advanced editor with content assist (command completion), syntax
highlighting and integrated help enables context-sensitive, dynamic reference
lookup.
6
1
2
4
3
•Full user and reference documentation set integrated with the IDE;
dynamically searchable while editing.
•Interactive scripting console allowing developers to script activities within
the IDE using a Python-like language, and to execute/test automated scripts
that can interface with the chip and the development environment.
Page 18
7
5
8
Development perspective showing (1) advanced editor with (2) content assist,
(3) dynamic help, (4) workspace navigator, (5) cheat sheets for common tasks,
(6) outline view, (7) tasks, and (8) console views. Console shows build output
and is a tabbed overlay with search, bookmark and error views.
Portable & Wearable Solutions
PASSED
Hardware Testing & Prototyping
ON Semiconductor enables form-factor
hardware testing and prototyping with an
RPM, optionally attached to a motherboard,
that connects directly to a CAA. The RPM’s
plug-in design enables developers to quickly
transition from development in a simulation
environment to testing a complete portable
audio system. To facilitate development and
testing even further, the RPM can be moved
directly from the motherboard to a prototype
for final hardware assessment.
Production & Final Testing
PC
CTK DK
CAA
RPM or Proto
To prepare portable audio products for the
market, the CTK Run-time and CAA enable
manufacturers to store firmware and data on
an attached EEPROM, tune parameters on
a unit-by-unit basis, configure the chip, and
run final tests. By attaching a CAA directly to
a Printed Circuit Board Assembly (PCBA), the
CTK DK can be used to develop a customized
software-controlled production flow to
meet the specific needs of your production
environment.
PCBA
Communication Accelerator Adapter (CAA)
The Communication Accelerator Adaptor is a universal hardware adaptor that facilitates
high-speed communication between host PCs (using USB 1.1 or 2.0) and ON Semiconductor
development boards (EDB, RPM Motherboard). The CAA is reprogrammable and can also be
used to transfer final software to products in a production or final test environment.
Rapid Prototyping Module (RPM)
AUDIO
The Rapid Prototyping Module enables manufacturers to easily demonstrate and evaluate
the audio performance and power consumption of ON Semiconductor audio processors in a
real world environment. The small-footprint RPM is designed for easy attachment to existing
portable audio devices while maintaining full portability. The RPM also facilitates fast and
easy prototyping, and once concepts and possible configurations are tested and evaluated,
the resulting integrated design will reduce risk and enable a faster time-to-market.
For added flexibility, a companion motherboard is also available that makes it easy to
demonstrate and evaluate BelaSigna audio DSPs on their own, without the need for a
product prototype. The motherboard also enables programming of the RPM. Full layout and
schematic information for the RPM is provided with the board.
Evaluation and Development Board (EDB)
The Evaluation and Development Board enables the development, demonstration, testing
and debugging of signal processing software. The EDB provides all peripherals needed for
measurement and validation, including additional inputs and outputs for extra testing. By
facilitating early validation of developed sound processing algorithm performance, the EDB
helps to reduce overall development time.
* EDB for BelaSigna 200 and 250 only.
ON Semiconductor
Page 19
Portable Sound Solution ASSP
LC823450 series high resolution, ultra-low power portable audio system solution
Key Features
•Ultra low power consumption
•Integrated 1656 KByte SRAM
•ARM® Cortex®-M3 Dual Core
•Proprietary 32-bit DSP Core (LPDSP32)
•DSP audio code available for MP3 codec, FLAC
codec, Noise Cancel, Zoom Mic
•High resolution 32-bit & 192 KHz audio processing
capability
•Integrated analog blocks for low-power Class D HP amplifier,
system PLL, dedicated audio PLL
•Hard wired audio functions for MP3 encoder and decoder, EQ
(6-band equalizer), ASRC (Asynchronous Sample Rate Converter)
•Integrated interfaces for USB2.0 HS device or host (not OTG),
eMMC, SD card I/F
•ASRC with jitter hiding function, DSP code for SBC/AAC, UART
with DMA & FIFO support for low power Bluetooth® audio
JTAG
(LPDSP)
Sys PLL
20 MHz
(1-50 MHz)
OSC
Aud PLL
I2C
ADDA
2ch/2ch
PCM
2ch
D-AMP
2ch
Key
10-bit
ADC
6ch
Small LCD
SPI
S-Flash
(Quad)
SF(QSPI)
w/ Cache
Battery
32.768 kHz
AUDIO
Design Focus
LC823450TA
Voice Recorder
LC823450XC
Wearable
LC823450XD
High End
Page 20
ARM®
Cortex®-M3
ARM®
Cortex®-M3
ROM
258 KByte
RAM
1.5 MByte
Audio Engine
PCM
2ch
ADDA
2ch/2ch
Device
RC OSC
RTC
Frequency
(MHz)
160 @ 1.2 V Typ
100 @ 1.0 V Typ
160 @ 1.2 V Typ
100 @ 1.0 V Typ
160 @ 1.2 V Typ
100 @ 1.0 V Typ
H/W
• MP3 Encoder
• MP3 Decoder
SSRC, ASRC, EQ, etc.
USB2.0
Host
or
Device
XMC(2CS)
and
LCD
or
8/16bit
NOR
SRAM
8bit
Color
LCD
UART
I2C
Multiple
Timer
2ch * 4
SDRAM
eMMC
eMMC
SD/MS
SD
UART
2ch
DMA
8ch
RAM
(KByte)
(M3)
SDRAMC
(1CS)
S/W (LPDSP32)
• WMA Decoder
• AAC Decoder
• Noise Cancel, etc.
Plain Timer
(w/ WDT)
1ch * 3
SWD or SWV
GPcIO
90ch
ARM Cortex-M3 SD Card I/F
Cores
Channels
SD/MS
WiFi Module, etc.
Bluetooth
w/ CTS, HCI Module
RTS
SW
etc
Features
Package
1656
Single
3
Class D HP Amplifier
TQFP-128L
1656
Single
2
External LCD I/F (8-bit)
WLCSP-154
1656
Dual
3
Class D HP Amplifier;
External LCD I/F (8-bit);
HW MP3 Encoder
WLCSP-154
Portable & Wearable Solutions
Portable Sound Solution ASSP
Ultra Low Power
•Over 120 hours playback with 2 x AAA battery (70% longer than
popular portable music players)
•Advanced power management technology
•4.8 mA @ 128 Kbps by MP3 hardware decoding
•0.11 mW/MHz @ 1.0 V while Cortex®-M3 Single Core operation
•Integrated low power D class amplifier
Small Footprint
Sys PLL
20 MHz
(1-50 MHz)
OSC
Aud PLL
ADDA
2ch/2ch
PCM
2ch
I2C
ADDA
2ch/2ch
PCM
2ch
D-AMP
2ch
Key
10-bit
ADC
6ch
Small LCD
SPI
S-Flash
(Quad)
SF(QSPI)
w/ Cache
Battery
32.768 kHz
RTC
RC OSC
ARM®
Cortex®-M3
ARM®
Cortex®-M3
ROM
258 KByte
RAM
1.5 MByte
Audio Engine
H/W
• MP3 Encoder
• MP3 Decoder
(M3)
USB2.0
Host
or
Device
XMC(2CS)
and
LCD
or
8/16bit
NOR
SRAM
8bit
Color
LCD
SDRAMC
(1CS)
S/W (LPDSP32)
• WMA Decoder
• AAC Decoder
• Noise Cancel, etc.
SSRC, ASRC, EQ, etc.
UART
I2C
Multiple
Timer
2ch * 4
GPcIO
90ch
5.52 mm
SDRAM
eMMC
eMMC
SD/MS
SD
UART
2ch
DMA
8ch
Plain Timer
(w/ WDT)
1ch * 3
SWD or SWV
SD/MS
5.33 mm
JTAG
(LPDSP)
WiFi Module, etc.
Bluetooth
w/ CTS, HCI Module
RTS
SW
etc
•5.52 mm x 5.33 mm WLCSP-154 suitable for
portable, wearable audio
•Highly integrated SoC (CPU+DSP+AUDIO)
•Hi-Resolution Recording/Playback capability
•Cortex®-M3 dual core
•Proprietary 32-bit DSP (LPDSP32)
•1656 Kbyte internal SRAM
Turn Key Software Support
Application
Layer
Middleware
Layer
System APF
✘
IPL2APP
✘
IPL
✔
EVT MD
✔
STG MD
✔
AUD MD
✔
SYS MD
✔
USB MD
✔
✔
✘
BT Protocol
Stack
Library
Common
✔
APL DR
✘
File System
✔
SD/eMMC
Driver
✔
Timer Driver
✔
MTM Driver
✔
SFC Driver
✔
INTC Driver
✔
UARTDR
✔
SPI Driver
✔
Audio Driver
✔
DSP Loader
✔
SDIO Driver
✘
DSP Lib
✔
OS
AD Converter ✔
Driver
RTC Driver
✔
USB Driver
✔
I2C Driver
✔
IO EXP
✘
Driver
CODEC Driver ✘
Power Driver ✔
H/W
ON Semiconductor
✔
MP Ready
✘
User Depending
Reference Code
Internal ROM
Further Discussion Needed
Provide C Source Code
Provide Library or Binary Code
Sample Application May Not Use
Page 21
AUDIO
•Suitable for portable, wearable digital music
• Support wireless synchronized stereo playback
Portable Sound Solution ASSP Evaluation Kit
The LC823450XGEVK is an audio processing system Evaluation Kit used to demonstrate the LC823450. This part can record and playback, and
offers high-resolution 32-bit & 192 kHz audio processing capability. It is possible to cover most of the functions necessary for portable audio with
only this LSI. It has Dual CPU and DSP with high processing capability, and internal 1656K-Byte SRAM, which make it possible to implement large
scale program. And it has integrated analog functions (low-power Class D HP amplifier, PLL, ADC etc.) so that PCB space and cost can be reduced,
and it has various interface (USB, SD, SPI, UART, etc.) to make extensibility high. Also it is provided with various function including SBC/AAC codec by
DSP and UART and ASRC (Asynchronous Sample Rate Converter) for Bluetooth audio. Low power consumption makes it suitable for portable audio
devices, such as wireless headsets.
9
11
12
4
5
LC823450
Audio CODEC
USB Connector
Serial Flash
eMMC
Switches
microSD
LCD
Radio
Frequency
24-bit
LC823450
CODEC
Line
IN
Head
Phone
7
Power
Supply
Control
Measurement
Switch
USB
LCD
SWD−IF
UART
I/O
LC823450XGEVK Block Diagram
16
3
1
2
3
4
5
6
7
8
eMMC
6
2
15
microSD
Digital-Mic
IN
D-class AMP Output
1
14
Serial
Flash
Bluetooth®
8
13
Audio
Memory
10
9
10
11
12
13
14
15
16
16
Bluetooth®
UART Connector
Power Supply Control
Digital Mic
ICE Connector
Headphone
Line Input
LEDs
Key Features
•File Transfer Connecting to PC with USB
•MP3 Recording with USB Bus Power Supply
•MP3 Playback with USB Bus Power Supply
•Measurement of Current Consumption
LC823450XGEVK Evaluation Board
AUDIO
Page 22
Portable & Wearable Solutions
Audio Amplifiers
Category
Description
Class
VIN
(V)
Pout
(W)
IQ
(mA)
THD+N
(%)
P SRR
(dB)
Package(s)
NCP2820
Speaker Amplifier
2.65 W Class D Amplifier, fast start up
D
2.5 to 5.5
2.65 W, 4 W, 5 V, 1% THD
2.15
0.05
65
CSP-9
NCP2823
Speaker Amplifier
3 W Class D Amplifier
D
2.5 to 5.5
2.65 W, 4 W, 5 V, 1% THD
1.8
0.08
77
CSP-9
NCP2890
Speaker Amplifier
1.0 W Audio Power Amplifier
AB
2.2 to 5.5
1.0 W, 8 W, 5 V, 0.1% THD
1.5
0.02
72
CSP-9, Micro8
NCP2993
Speaker Amplifier
1.3 W Class AB Amplifier, fast start up,
zero pop
AB
2.5 to 5.5
1.25 W, 8 W, 5 V, 1% THD
1.5
0.02
80
CSP-9
NCP4894
Speaker Amplifier
1.8 W Differential Class AB Amplifier
AB
2.5 to 5.5
1.8 W, 8 Ω, 5 V, 1% THD
1.9
0.006
85
CSP-9, Micro-10,
DFN-10
NCP2811
Headphone Amplifier
63 mW Stereo Headphone Amplifier,
true ground reference
AB
2.9 to 5
63 mW, 16 Ω, 1% THD
6.5
0.01
100
CSP-12, UQFN-12,
TSSOP-14
NCP2817
Headphone Amplifier
31 mW Long Play Stereo Headphone
Amplifier, true ground reference
AB
1.6 to 5.5
31 mW, 16 Ω, 1% THD
2.3
0.019
100
CSP-12
AUDIO
Device
ON Semiconductor
Page 23
Low Power Comparators
VCC
Headphones + Mic
> 1 kΩ
Hook Switch Detection
L
ON/OFF
R
Vref
NCS2220A
VCC
L R
Vref
Hook
Switch
Mic
Detect
Mirophone and
Headphone Detection
Handsfree Head Set
CELL PHONE
Hook Switch
Typical Detection Circuit
Device
Configuration
VS Min
(V)
VS Max
(V)
IQ/Channel
(mA)
tRESP(H-L)
(ms)
IOUT
(mA)
Output Type
Package(s)
NCS3402
2
2.5
16
0.47
18
10
Open Drain
SOIC-8
NCS2220
2
0.85
6
7.5
0.5
60
Complementary
UDFN-8, UQFN-8
NCS2200A
1
0.85
6
9
0.46
70
Complementary
UDFN-6
NCS2202A
1
0.85
6
9
0.46
70
Open Drain
UDFN-6
NCV2393
2
2.7
16
9
0.8
20
Open Drain
SOIC-8
NCS2200
1
0.85
6
10
0.7
70
Complementary
SOT-23-5, SC-70-5, DFN-6
NCS2202
1
0.85
6
10
0.7
70
Open Drain
SOT-23-5, SC-70-5
LMV339
4
2.7
5
35
0.5
84
Open Drain
SOIC-14, TSSOP-14
LMV393
2
2.7
5
35
0.5
84
Open Drain
Micro8, SOIC-8, UDFN-8
LMV331
1
2.7
5
40
0.5
84
Open Drain
SOT-23-5, SC-70-5
Ear Jack Detection Interface
AUDIO
NCS2300 integrates a comparator, OR gate, and N-channel MOSFET to
detect the presence of a stereo headset with a microphone. A built in
resistor-divider provides an internal reference voltage for detecting the
left audio channel. The logic output indicating headset presence can
then be connected to the baseband GPIO. NCS2302 includes the send/
end button detection functionality.
Key Features
•Supply voltage: 1.6 - 2.5V
•Low quiescent supply current: 7 µA typical
•UDFN-6 for NCS2300
UQFN-10 for NCS2302
Page 24
S/E_REF S/E_DET VDD2 S/E
NCS2302
VDD
MIC
VDD
VDD
270 k
1M
VDD
DET
VDD
1M
1M
L_DET
GND_DET
VDD
GND
VDD
NCS2302 Block Diagram
Portable & Wearable Solutions
USB3.1
USB3.0
USB2.0
Camera/Display Lines
#Pairs ?
Data Rate?
PROTECTION
External Interface
High Speed Differential Data
Protection Solutions
ESD8xxx
ion
rotect
ESD P
EMI Fi
lter
• <0.3 pF, Lowest VC in Industry
• Unidirectional and Bidirectional
• Singles and Arrays
EMI8xxx
• >30 dB CM Attenuation
• Low & High Freq Performance Class
• 1, 2, 3 Pair
SDR50
SDR104
SIM
Audio
Speaker
Headphone
Microphone
Low Speed Single Ended Data/Audio
Single Ended Data
ESD5xxx
ion
rotect
ESD P
EMI Fi
lter
• 5 - 15 pF, Lowest VC in Industry
• Unidirectional and Bidirectional
• Singles and Arrays
EMI71xx
• >40 dB Attenuation @ Antenna Freq
• <1.5 dB Attenuation @ Data Freq
• Up to 6 Lines
Other Lines
General Purpose
ESD Protection
TVS8xxx
Charging
USB Vbus
Battery Contacts
ON Semiconductor
High Surge TVS Protection
• Ipp Up to 70 A, Lowest VC in Industry
• 5 to 24 V Options
• Single Line
Page 25
USB3.1 Type-C Protection
PROTECTION
Features
• Unidirectional
• <8 V clamping voltage @ 16 A TLP
(±8 kV SED)
• ±15 kV IEC61000-4-2 Level 4 rated,
contact and air discharge
Device
Type
C Max @ 1 MHz
(pF)
C Max @ 5 MHz
(pF)
Package
ESD8018
8 Line Flow-Through Array
0.32
0.25
UDFN-10
ESD8106
6 Line Flow-Through Array
0.32
0.25
ESD9X
GND
GND
ESD8018
RX1+
TX1+
ESD8018
TX1–
RX2+
Vbus
CC1
SBU2
(Config Detect: Vconn or PD comm)
D–
SBU1
Vbus
D–
D+
D+
(Sideband Use: AUX Signal)
Vbus
CC2
Vbus
TX2–
RX2–
RX2+
TX2+
GND
ESD9X
Type-C Hybrid Top Mount Connector
(Top Layer)
GND
Top layer
Bottom layer
Type-C Hybrid Top Mount Connector
(Bottom Layer)
USB3.1 Type-C Port Control
Features
• Current optimized for USB control
• Low capacitance enables high speed operation
Device
VGDS
(V)
VGS(off)
(V)
IGSS
(nA)
IDSS
(mA)
|ysf|
(mS)
CISS
(pF)
Package
TF412S
-30
-0.18 to -1.5
1
1.2 to 3.0
5.0
4
SOT-883
VCONN1
Impedance
Control
VCONN2
RA
RA
Control
IC
Page 26
Portable & Wearable Solutions
PROTECTION
Single Line Protection
ESD
Type
C
(pF)
Vr
(V)
Vc
(V)
Package
Bidirectional
Bidirectional
Unidirectional
Bidirectional
Bidirectional
Unidirectional
Bidirectional
Bidirectional
Bidirectional
Bidirectional
0.2
15
0.9
0.3
15
0.55
0.3
0.3
5
5
5
5
5
3.3
5
3.3
3.3
3.3
3.3
3.3
19
19
17
16
15
11
10
10
6.5
6.5
X3DFN-2
X3DFN-2
SOD-923-2
X3DFN-2
SOD-923-2
X3DFN-2, SOD-923-2
X3DFN-2
DSN-2
X3DFN-2
DSN-2
Device
ESD8011
ESD5481
ESD9L
ESD8451
ESD9B
ESD8351
ESD8111
ESD8101
ESD5111
ESD5101
18
16
8kV
Competitors
ON Semiconductor
14
Current (A)
12
6kV
10
8
4kV
6
2kV
4
2
0
0
2
4
6
8
10
12
14
16
Voltage (V)
Low Cap ESD Protection Vc Benchmarking
High Surge TVS
Device
TVS8501
TVS8501
ON Semiconductor
TLP testing – P2P equivalent parts (same package, Vz, <0.6 pF)
Vrwm
(V)
Ipp
(A)
Package
5
10 - 12
70
60
UDFN-2
UDFN-2
Page 27
Audio Filtering for HiFi
PROTECTION
EMI7112 Features
• >40 dB @ 750 MHz to 2.4 GHz
• Cross-talk < –65 dB, THD+N < 0.006%
• HiFi quality capable
-80
-85
EMI7112 Ch1 1 Vrms
EMI7112 Ch2 1 Vrms
THD+N, dB
-90
-95
-100
-105
-110
-115
20
200
2000
20000
Frequency, Hz
EMI7112 THD + N
-65
-75
Crosstalk, B
-85
-95
-105
SMA #7 B/A 1 Vpp
SMA #8 B/A 1 Vpp
SMA #9 B/A 1 Vpp
SMA #10 B/A 1 Vpp
SMA #11 B/A 1 Vpp
SMA #12 B/A 1 Vpp
-115
-125
-135
20
200
2000
20000
Frequency, Hz
EMI7112 Crosstalk with 1 Vpp Input Voltage
Page 28
Portable & Wearable Solutions
Function
Device
Series
Filter CM Noise
Attenuation
> 25 dB range
RF Receivers
Signal Integrity
Maximum
Data Rate
Interfaces Supported
Protect Chipset
Vc @ 8 kV Minimum Chipset
(TLP)
Geometry
EMI813x
700 MHz – 1.1 GHz
LTE, GSM,
4 Gb/s
USB2.0; MHL1-2; HDMI1.3/4; MIPI CSI-2
11.6 V
14 nm
EMI814x
1.3 GHz – 3 .0 GHz
LTE, WCDMA, WiFi, GPS
8 Gb/s
USB3.0; MIPI CSI-3; MHL3.0; HDMI2.0
11.6 V
14 nm
Key Antenna Frequency Windows
0
-5
-10
SCC21, dB
-15
-20
-25
-30
D
pr eep
ov es
ed t A
An tte
te nu
nn at
a R ion
ec =
ep
tio
n
Im
-35
-40
-45
ON Semiconductor
Competitors
EMI814x
EMI813x
-50
100.00
ON Semiconductor
Frequency, MHz
1000.00
Page 29
PROTECTION
Common Mode Filters for High Speed Interfaces
ARM® Core DC-DC Converters
Key Features
•High regulating performance from 0.6 V to 1.4 V
• Modular efficiency with fragmented power stage
• Dynamic voltage scaling per output steps of 6.25 mV by I2C
• Tight accuracy of ±1%, due to differential sensing
•Fast transient response
• Proprietary PFM to PWM transition with equivalent performance to PWM only
• Thermally handle high peak current demands up to 10 ms
• Flexible design to transient handling output capacitor from 22 µF to 100 µF
POWER MANAGEMENT
PWM Efficiency DCDC Converter Modular Output
Vin = 3.6 V, Vout = 1.20 V, Fsw = 3.0 MHz, Lossless Inductor(s)
0.95
Efficiency (%)
0.9
0.85
1
2
3
5
10
0.8
Number of Modules
0.75
0.7
0.10
1.00
Load Current (A)
VIN
(V)
VOUT
(V)
IOUT
(A)
f SW
(MHz)
Control
Features
Package
NCP6338
2.3 – 5.5
0.6 – 1.4
6.0
3.0
I²C; VSEL
Modular power stage; Differential sensing
WLCSP-30
NCP6335
2.3 – 5.5
0.6 – 1.4
4.0
3.0
I²C; VSEL
Transient load helper
WLCSP-20
NCP6343
2.3 – 5.5
0.6 – 1.4
3.5
3.0
I²C
Dynamic voltage scaling
WLCSP-15
Device
Page 30
Portable & Wearable Solutions
Peripheral DC-DC Converters
NCP6314C auto mode, Vout = 1.8 V
100
95
Key Features
•High efficiency conversion - up to 94% - over large input &
output voltage range
•High switching frequency - up to 6.0 MHz - reduces external
component size (inductor down to 220 nH)
•Design flexibility with adjustable resistor bridge, independent
enable control, power good or mode selection pin
90
Efficiency (%)
85
80
75
70
2.7 V
60
3.6 V
55
5.5 V
50
1
10
100
1000
10000
Output Current (mA)
Small inductor down to 220 nH
Small capacitor: 10 μF  Cost and space savings
Battery or
System Supply
AVIN
AGND
Processor or
System Supply
EN
Power State
Indicator
PG
PVIN
Core
Thermal
Protection
Enabling
DCDC
SW
2A
1.5-6 MHz
FB
1 μH
10 μF
Battery or
System Supply
DCDC Out
22 μF
PGND
Control
Power Good (B version)  Limit external component count
Mode Selection (C version)  Design flexibility
VIN
(V)
VOUT
(V)
IOUT
(A)
f SW
(MHz)
Operating Mode
Features
Package(s)
NCP1521B
2.7 – 5.5
0.9 – 3.3
0.6
1.5
PFM/PWM
—
TSOP-5, UDFN-6
NCP1522B
2.7 – 5.5
0.9 – 3.3
0.6
3
PFM/PWM
—
TSOP-5, UDFN-6
NCP1529
2.7 – 5.5
0.9 – 3.3
1.0
1.7
PFM/PWM
—
TSOP-5, UDFN-6
Device
NCP6324
2.5 – 5.5
0.6 – 5.0
2.0
3
PFM/PWM
Mode Selection
WDFN-8
NCP6332B
2.3 – 5.5
0.6 – 5.0
1.2
3
PFM/PWM
Power Good
UDFN-8
NCP6332C
2.3 – 5.5
0.6 – 5.0
1.2
3
PFM/PWM
Mode Selection
UDFN-8
NCP6334B
2.3 – 5.5
0.6 – 5.0
2.0
3
PFM/PWM
Power Good
UDFN-8
NCP6334C
2.3 – 5.5
0.6 – 5.0
2.0
3
PFM/PWM
Mode Selection
UDFN-8
NCP6354
2.3 – 5.5
0.6 – 5.0
2.0
3
PWM
Power Good
UDFN-8
ON Semiconductor
Page 31
POWER MANAGEMENT
65
Mid Scale Power Management Integration
Key Features
POWER MANAGEMENT
•Extensive IP library
•Flexibility for platforms derivatives with full programmability by I2C
•Offers real time load management with Dynamic Voltage Scaling
•High performance
•High efficiency (up to 96%) and low quiescent current (<100 µA) to improve battery life
•Low noise LDO (30 µVrms @ 100 Hz-100 kHz ) meets the latest sensors requirements
•Quick turn around and time to market solutions
•WLCSP, QFN packages
Core
•Vin 2.3 - 5.5 V
•Bandgap
•Oscillator
•Biasing
LDOs
•Vin 2.3 - 5.5 V
•Vout 0.6 - 5.5 V
•Up to 6.0 A/
channel
•Dynamic voltage
scaling
•Low noise, low Iq
•High PSRR
•Vin 1.7 - 5.5 V
•Vout from 1.0 3.3 V
•Up to 300 mA/
channel
•10-bit ADC
•I2C / OTP
•Sequencer
•External sync
•Individual enable
•Power Good
DC-DC
(mA)
LDO
(mA)
Package(s)
NCP6925
2 x 1000
5 x 300
CSP-36
NCP6924
2 x 1000
2 x 300, 2 x 150
CSP-30
NCP6914
1 x 800
4 x 300
CSP-20
NCP6915
1 x 600
1 x 300, 4 x 150
CSP-16
Device
Page 32
Features &
Monitors
BUCKs
Customization
•Flash LED
•Load switch
•Boost/bypass
•Buck/boost
•Battery charger
•Clock Generator
•Memory
•Wireless Power
Portable & Wearable Solutions
Key Features
•Sized for micro USB connector (USB BC1.2) with 1.5 A, 1.6 A,
1.8 A, 2.5 A charging current
•Automatic input current limit adapts charging current to the
maximum capability of the power source; proven charging time
decrease by 10 minutes
•Integrated 28 V over voltage protection with unique negative
voltage support
•Up to 1 A embedded boost USB OTG saves BOM cost
•Automatically disconnects battery at end of charge, with
reconnect in few seconds in case of peak current activity (GSM
for instance)
•Instant turn-on at cable insertion when battery is weak
•Enable smart fast charging ports with input voltage capability up
to 16 V (NCP1855)
Device
Charging
Pre-Charge OTG Boost
Current Max Current Max Current Max
(A)
(mA)
(mA)
NCP1850
NCP1855 Charging Profile for 4.2 V, 2500 mAh Battery Pack,
Input Source Limited to 1 A
VCC
Max
(V)
OVP
(V)
Automatic
Protected
Battery
Input Current
Dual Path
USB PHY Temperature
Limiting
Management Supply (mA)
Sensing
I2C
+28
400 kHz
Yes
Yes (external)
30
Threshold
WLCSP-25
Package
1.5
450
250
7
NCP1851
1.6
300
500
7
+28
400 kHz / 3.4 MHz
Yes
Yes (external)
50
JEITA
Flip-Chip-25
NCP1852
1.8
300
500
7
+28/–20
400 kHz / 3.4 MHz
Yes
Yes (external)
50
JEITA
Flip-Chip-25
NCP1854
2.5
300
500
7
+28
400 kHz / 3.4 MHz
Yes
Yes (external)
50
JEITA
Flip-Chip-25
NCP1855
2.5
300
500
16
+28
400 kHz / 3.4 MHz
Yes
Yes (external)
50
JEITA
Flip-Chip-25
+28 V
Overvoltage
Protection
1000 mA
5 V Boost
USB
Transceiver
Supply
NCP1855
Battery
Charging
State
Machine
15.5 V Operating
Switching
Battery Charger
Current &
Voltage
Monitoring
Dynamic
Power Path
Management
300 mA
Precharge
Battery
NTC
I2C
400 kHz
3.4 MHz
Automatic
Input Current
Limiter
ON Semiconductor
Page 33
POWER MANAGEMENT
Switching Battery Chargers
LC709203F High Accuracy Fuel Gauge LSI
Fuel Gauge for 1 Cell Li+ with Low Power and with No Sense Resistor
Conventional Display
Key Features
•Accuracy of remaining capacity ±2.8% (0 ~ +50°C)
•Active mode current of 15 μA
•Hibernate mode current of 2 μA
•Standby mode current (RAM retention) of 0.1 µA
•No need for sense resistor for current detection
POWER MANAGEMENT
With
LC709203F
Standby Time
120 h
Call Time
75 min
77%
Correct
Operating Time
Detailed Display of
Remaining Capacity
Conventional
System
Battery
Conventional
System
Fuel
Gauge
Battery
Fuel
Main
Gauge
Board
Main
Board
5 mΩ
Sense
Resistor
5 mΩ
Sense
Resistor
ON Semiconductor
System
ON Semiconductor
Battery
ON Semiconductor Solution
(No Sense Resistor)
•No power loss
•No heat generation
System
Fuel
Gauge
Battery
Fuel
Main
Gauge
Board
Main
Board
No Sense Resistor
No Sense Resistor
Page 34
Portable & Wearable Solutions
Li-ion Battery Protection
VDD
VDD
BATT
Controller IC
VSS
D0
For Discharge
Controller
C0
VSS
D0
VM
For Charge
For Discharge
Dual MOSFET
C0
VM
For Charge
2-in-1 Configuration
(Controller + Dual MOSFET Integrated Package)
VGSS Max
(V)
IS (DC)
(A)
RSS(ON) @ VGS = 4.5 V
Min/Typ/Max
(mW)
RSS(ON) @ VGS = 2.5 V
Min/Typ/Max
(mW)
QG Typ
(V)
Package(s)
±12
6
15.0/17.5/20.0
19.5/24.5/29.5
3
CPH-6
Configuration
Polarity
VSSS Max
(V)
CPH6636R
Dual
N-Channel
24
ECH8693R
Dual
N-Channel
24
±12
11
5.6/8.5/10.4
7.8/13.0/18.2
13
ECH-8
ECH8695R
Dual
N-Channel
24
±12.5
11
5.6/7.0/9.1
7.5/9.5/13.3
10
ECH-8
ECH8697R
Dual
N-Channel
24
±12
10
7.7/11.0/14.3
11.4/19.0/26.6
—
ECH-8
EFC4619R
Dual
N-Channel
24
±12
6
13.5/19.8/23.0
18.5/27.0/35.0
21.7
EFCP
EFC4621R
Dual
N-Channel
24
±12
9
10.8/15.5/18.0
14.9/23.0/30.0
29
EFCP
EFC4626R
Dual
N-Channel
24
±12
5
29.2/37.5/46.2
42.6/54.0/72.4
7.5
EFCP
EFC6601R
Dual
N-Channel
24
±12
13
6.6 / 9.5/11.5
9.0/13.0/17.0
48
EFCP
EMH2418R
Dual
N-Channel
24
±12
8.5
9.1/13.0/16.9
13.8/23.0/32.2
—
EMH
EFC3C001NUZ*
Dual
N-Channel
20
±10
6
17.0/23.0/30.0
24.5/35.0/56.0
15
EFCP
EMH2407
Dual
N-Channel
20
±12
6
13.0/19.0/25.0
16.0/28.0/39.0
6.3
EMH
EFC4627R
Dual
N-Channel
12
±10
6
18.5 / 23.9/29.5
29.3 / 37.7/50.5
13.4
EFCP
EFC6602R
Dual
N-Channel
12
±12
18
3.1 / 4.5/ 5.9
5.2/7.5/11.0
55
EFCP
EFC6604R
Dual
N-Channel
12
±12
13
6.0 / 7.5/ 9.0
10.0/12.6/17.7
29
EFCP
EFC8811R
Dual
N-Channel
12
±8
27
1.8 / 2.3/ 3.2
2.7/4.0/6.3
100
EFCP
Device
EMH2417R
Dual
N-Channel
12
±12
8
8.7/12.4/16.1
10.8/15.4/20.0
—
EMH
LC05132C01MT
2 in 1***
N-Channel
24
±12
8
8.8/11.2/14.0
12.0/15.0/21.0
—
WDFN-6
LC05111CMT
2 in 1**
N-Channel
24
±12
8
8.8/11.2/14.0
12.0/15.0/21.0
—
WDFN-6
LC05112CMT
2 in 1
N-Channel
24
±12
8
8.8/11.2/14.0
12.0/15.0/21.0
—
WDFN-6
LC06111TMT*
2 in 1
N-Channel
12
±12
10
6.6/8.4/10.6
11.2/14.0/19.6
—
WDFN-6
* Pending 3Q16. ** Auto wakeup, 0 V charge. *** Reset function. NOTE: RSS(ON) = RDS(ON) x 2.
ON Semiconductor
Page 35
POWER MANAGEMENT
BATT
Voltage and Current Protection
USB Host
USB Device
Over Current Protection protects USB Host from
short circuit, over load or hot plugs faults on
USB device.
Over Voltage Protection protects USB Device
from overshoot, host dc-dc feedback failure, or
any over voltage faults on USB host.
POWER MANAGEMENT
Device
Type
VIN Min VIN Max
(V)
(V)
OVP
(V)
UVLO
(V)
Current Limit
(mA)
RDS(ON)
(mW)
Features
Package(s)
2.95
—
65
Status FLAG
WDFN-10
NCP347 Over Voltage
1.2
28
5.63; 5.85;
5.9; 7.2
NCP348 Over Voltage
1.2
28
6.02; 6.4
3.25
—
65
Status FLAG
WDFN-10
NCP349 Over Voltage
1.2
28
5.68; 6.02;
6.4; 6.85
2.95; 3.25
—
65
Status FLAG
DFN-6
NCP360 Over Voltage
1.2
20
5.675; 6.25;
7.07; 7.2
3
—
210
Status FLAG;
Thermal SD
TSOP-5; SOT-23-5;
UDFN-6
NCP361 Over Voltage and Over
Current
1.2
20
5.675
3
750
300
Status FLAG;
Thermal SD
TSOP-5; SOT-23-5;
UDFN-6
NCP367 Over Voltage and Over
Current, with battery over
charged detection
1.2
28
5.85; 6.07;
6.84; 7.2
1.85 Adjustable up
to 2800
50
VBAT Detect;
Thermal SD
DFN-8
NCP370 Over Voltage and Over
Current
-28
28
6.6
2.7
1750
130
Status FLAG;
Thermal SD
LLGA-12
NCP372 Over Voltage
-30
30
6.3
2.7
—
130
Status FLAG;
Thermal SD
LLGA-12
NCP373 Over Voltage, with reverse
Over Current Limit 1.2
30
5.77
2.7
400; 1300
130
Status FLAG;
Thermal SD
LLGA-12
NCP374 Over Voltage, with reverse
Over Current Limit 1.2
30
5.77
2.7
750
80
Status FLAG;
Thermal SD
TLLGA-12
NCP380
Over Current, Single
Channel USB
2.5
5.5
—
2.3
Fixed or
Adjustable up
to 2100
55
Thermal SD; UL
Listed
TSOP-5; TSOP-6;
SOT-23-5; UDFN-6
NCP382
Over Current, Dual Channel
USB
2.5
5.5
—
2.35
Fixed or
Adjustable up
to 2000
80
Thermal SD; UL
Listed
DFN-8; SOIC-8
NCP383
Over Current, Dual Channel
USB
2.7
5.5
—
2.45
Adjustable up
to 2800
45
Thermal SD; UL
Listed
UDFN-10
NCP391 Over Voltage
1.2
28
7.4
2.95
—
120
Status FLAG;
Thermal SD
WLCSP-6
NCP392
Adjustable Front End
Over Voltage
2.8
28
5.95; 6.8;
13.8; 15.5
2.8
—
34
100 V Surge
Capability
WLCSP-12
Page 36
Portable & Wearable Solutions
LDO Regulators
Device
IO Typ
(mA)
Iq Typ
(mA)
Vin Max
(V)
VO
(V)
P SRR
(dB)
Noise
(mVrms)
Package(s)
450
20
6
1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14
90
10
CSP-4, XDFN-4
NCP4589
300
55
5.3
1.2, 1.8, 2.5, 2.8, 3.0, 3.3
70
90
SC-88A-5/SC-70-5/SOT-323-5; SOT-23-5; XDFN-6
NCP4683
300
50
6
1.2, 1.8, 1.85, 2.8, 2.85, 3.1, 3.3
65
65
SC-88A-5/SC-70-5/SOT-323-5; UDFN-4
50
6
1.0, 1.05, 1.1, 1.2, 1.25, 1.3, 1.5, 1.8, 2.1, 2.6, 2.8,
2.85, 3.0, 3.1, 3.3, 3.45, 3.5
75
60
uDFN-4
NCP114
300
NCP703
300
12
5.5
1.8, 1.9, 2.8, 3.0, 3.3, 3.5
68
13
TSOP-5/SOT-23-5; XDFN-6
NCP160
250
20
6
1.8, 2.5, 2.8, 2.85, 3.0, 3.3, 3.5, 4.5, 5.0, 5.14
90
10
CSP-4, XDFN-4
NCP700B
200
70
6
1.8, 2.5, 2.8, 3.0, 3.3
82
10
TSOP-5/SOT-23-5; WDFN-6
NCP702
200
10
5.5
1.8, 2.8, 3.0, 3.3
70
11
TSOP-5/SOT-23-5; XDFN-6
NCP4680
150
50
6
0.8, 0.9, 1.0, 1.2, 1.5, 1.8, 2.3, 2.5, 2.8, 3.0, 3.3
75
60
SC-88A-5/SC-70-5/SOT-323-5; XDFN-4
75
60
uDFN-4
NCP103
150
50
6
1.0, 1.05, 1.1, 1.2, 1.25, 1.3, 1.5, 1.8, 2.1, 2.6, 2.8,
2.85, 3.0, 3.1, 3.3, 3.45, 3.5
NCP170
150
0.5
5.5
1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3
40
85
SOT-563, XDFN-4
NCP716
80
4.7
24
1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3, 5.0
52
65
SC-70-5, xDFN6
NCP715
50
4.7
24
1.2, 1.5, 1.8, 2.5, 2.8, 3.0, 3.3, 5.0
52
65
xDFN-6
ON Semiconductor
POWER MANAGEMENT
NCP161
Page 37
AirFuel™ Wireless Charging
Loosely Coupled Wireless Charging Features
•Spatial Freedom; no alignment or direct contact to transmitter is required
•Charge multiple devices at once through surfaces
•Can charge in the presence of metal objects such as coins or keys
Auto/Consumer
Interfaces
4 - 20 V
Front-End
4 - 12 V
Power Conversion
and Monitor
Bridge
uC/AP
PA
4 - 28 V
RF
Tuning
Power
Management
ASIC
100 V Surge
OVP
4 - 12 V
Power Switch
POWER MANAGEMENT
uC/AP
6.78 MHz
Battery
Charger
Receiver for Smartphone
Transmitter
uC/AP
6.78 MHz
1 - 20 V
Front-End
4 - 12 V
Power Conversion
and Monitor
Bridge
Auto/Consumer
Power
Battery
Charger
Receiver for Accessory
Contact ON Semiconductor
AirFuel Magnetic Resonance System Blocks
Type
VCC Max
(V)
NSR1030Q
Full Bridge
NSR2030Q
Full Bridge
Device
Page 38
PD Max
(W)
Peak Current Typ
(A)
Package(s)
30
30
1
UDFN-4
30
60
2
UDFN-4
Portable & Wearable Solutions
Full Bridge Rectifier for Inductive Wireless Charging
Key Features – NMLU1210
•Full Bridge Rectification block - up of 3.2 A of operation
•Low RDS(ON) minimizes conduction losses
•Low profile UDFN-8 package (4 x 4 x 0.55 mm)
SCHOTTKY
Device
VLL
(V)
ID
(A)
RDS(ON) Max @ VGS = 10 V
(W)
VR
(V)
VF
(A)
IF
(A)
Package(s)
NMLU1210
20
3.2
0.017
20
0.45
3.2
UDFN-8
L1_1
Vout
Vout
C1
C2
A1
A2
D1
AC
Input
S1 G1
L1_2
D2
DC
Output
G2 S2
GND2
GND1
GND1
AC-DC
Drivers
+
Controller
+
V/I Sensing
Transmitter
ON Semiconductor
POWER MANAGEMENT
MOSFET
GND2
NMLU1210
AC-DC
DC-DC
Step Down
and Control
Receiver
Page 39
Advanced Load Switches
ON Semiconductor provides a comprehensive range of load switches, suitable for a variety of different power trees.
•Copackaged MOSFET plus CMOS controllers – value-added features plus high performance
•Monolithic CMOS smart load switches – value added features, low cost
•Discrete MOSFETs – simple, high performance
VCC
EN
PG
POWER MANAGEMENT
Smart Load Switch
ecoSWITCH™ Integrated
Load Switch
Page 40
NCP45xxx Integrated Load Switch Feature
•Simple/clean design
•No current consumption in standby power mode
•Small PCB footprint
•Low RDS(ON) due to charge pump driving NMOS
•Adjustable soft-start time (SR)
•Adjustable integrated discharge
•Fault protection
•Power rail monitoring & sequencing
Thermal,
Undervoltage
&
Short-Circuit
Protection
Bandgap
&
Biases
Control
Logic
Charge
Pump
Delay and
Slew Rate
Control
SR
Type
VIN
GND
BLEED
VOUT
ron
(mW)
I Max
(A)
VI Min
(V)
VI Max
(V)
IQ
(mA)
Discharge
Slew Rate
(ms)
Features
Package(s)
NCP330 26 at 3.3 V
3
1.8
5.5
100
-
2000
Reverse blocking
TDFN-4
NCP333 55 at 3.3 V
1.5
1.2
5.5
1
Auto
95
-
WLCSP-4
NCP334 47 at 3.3 V
2
1.2
5.5
1
-
71
-
WLCSP-4
NCP335 47 at 3.3 V
2
1.2
5.5
1
Auto
71
-
WLCSP-4
NCP336 23 at 3.3 V
3
1.2
5.5
1
-
810
-
WLCSP-6
NCP337 23 at 3.3 V
3
1.2
5.5
1
Auto
810
-
WLCSP-6
NCP338 27 at 1.8 V
2
1
3.6
0.6
Auto
20
-
WLCSP-6
Device
NCP339
26 at 3.3 V
3
1.2
5.5
2
-
2700
Reverse blocking
WLCSP-6
NCP432
50 at 1.8 V
1.5
1
3.6
0.6
-
20
-
WLCSP-4
NCP433
50 at 1.8 V
1.5
1
3.6
0.6
Auto
20
-
WLCSP-4
NCP434 43 at 1.8 V
2
1
3.6
0.6
-
61
-
WLCSP-4
NCP435 43 at 1.8 V
2
1
3.6
0.6
Auto
61
-
WLCSP-4
NCP436
23 at 1.8 V
3
1
3.6
1
-
27
-
WLCSP-6
NCP437
23 at 1.8 V
3
1
3.6
1
Auto
27
-
WLCSP-6
NCP45524 18.0
6
0.5
13.5
-
Adj
-
Power good
DFN-8
NCP45525 18.0
6
0.5
13.5
-
Adj
Adj
-
DFN-8
NCP45560 2.4
24
0.5
13.5
-
Adj
Adj
Power good; Fault
DFN-12
NCP45540 3.3
20
0.5
13.5
-
Adj
Adj
Power good; Fault
DFN-12
NCP45541
3.3
20
0.5
13.5
-
Adj
Adj
Power good
DFN-12
NCP45520 9.5
10.5
0.5
13.5
-
Adj
-
Power good; Fault
DFN-8
NCP45521 9.5
10.5
0.5
13.5
-
Adj
Adj
Fault
DFN-8
Portable & Wearable Solutions
Simple Load Switches
Vin USB
System
MOSFET
PMU/Charging IC
Switching Charger – Step Down
Polarity
Configuration
V (BR)DSS Min
(V)
VGS Max
(V)
MCH3333A
P-Channel
Single
-30
±10
2
0.215
MCPH-3
SCH1345
P-Channel
Single
-20
±10
4.5
0.049
SOT-563
NTLUS3A39PZ
P-Channel
Single
-20
±8
5.2
0.039
UDFN-6
NTLUD3A260PZ
P-Channel
Dual
-20
±8
1.7
0.2
UDFN-6
NTLUS3A18PZ
P-Channel
Single
-20
±8
8.2
0.018
UDFN-6
NTLUD3A50PZ
P-Channel
Dual
-20
±8
4.5
0.048
UDFN-6
NTLJS3A18PZ
P-Channel
Single
-20
±8
8.2
0.018
WDFN-6
NTTFS3A08PZ
P-Channel
Single
-20
±8
15
0.067
µ8FL
SCH1331
P-Channel
Single
-12
±10
3
0.084
SOT-563
NTLUS3C18PZ
P-Channel
Single
-12
±8
7
0.024
UDFN-6
MCH6351
P-Channel
Single
-12
±10
9
0.016
MCPH-6
MCH6353
P-Channel
Single
-12
±10
5.5
0.035
MCPH-6
EMH2314
P-Channel
Dual
-12
±10
6
0.037
EMH-8
ECH8308
P-Channel
Single
-12
±10
10
0.013
ECH-8
SCH1430
N-Channel
Single
20
±12
2
0.125
SOT-563
SCH1433
N-Channel
Single
20
±10
3.5
0.064
SOT-563
MCH6448
N-Channel
Single
20
±9
8
0.022
MCPH-6
EMH2408
N-Channel
Dual
20
±12
4
0.045
EMH-8
ECH8420
N-Channel
Single
20
±12
14
0.0068
ECH-8
EMH2418R
N-Channel
Dual
24
±12
8.5
0.0169
EMH-8
NTLUS4930N
N-Channel
Single
30
±20
6.3
0.033
UDFN-6
NTLUS4C12N
N-Channel
Single
30
±20
9.1
0.015
UDFN-6
NTLJS4114N
N-Channel
Single
30
±12
6
0.035
WDFN-6
NTLJD4116N
N-Channel
Dual
30
±12
3.7
0.07
WDFN-6
MCH6431
N-Channel
Single
30
±20
5
0.091
MCPH-6
MCH3486
N-Channel
Single
60
±20
2
0.192
MCPH-3
Device
ON Semiconductor
ID Max
(A)
RDS(ON) Max @ VGS = 4.5 V
(W)
Package(s)
Page 41
POWER MANAGEMENT
Secondary
Charging Pass
(Wireless)
Optimized Schottky Diodes
As wireless devices become smaller and thinner, more compact, energy efficient components are necessary. Optimized DSN2 Schottky
diodes offer best in class thermal efficiency, and are considerably smaller than equivalent current handling devices. A lower forward
voltage - compared to similar devices – also improves energy efficiency.
10
Lower
Efficiency
SOD-323 EP
DSN2 0502
2.5
Flat Lead
1.4
73%
Smaller
1.3
0.6
POWER MANAGEMENT
TOP VIEW
TOP VIEW
QFN/DFN
57%
Thinner
0.65
0.28
SIDE VIEW
Higher
Efficiency
DSN
Cin
PWM
Vin SW
DSN2
1
SOD-323 EP
0.1
0.01
0.001
0.1
SIDE VIEW
0.2
0.4
0.5
VF, Forward Voltage (V)
Package Size
Energy Efficiency
Cout
VBAT
Cin
0.6
PWM
Vin SW
LED
FB
0.3
Dimensions in mm. Not to scale.
Thermal Efficiency
VBAT
IF, Forward Current (A)
Gull Wing
Vout
Cout
AGnd FB
Rs
DC-DC Boost Converter for LED Backlighting
DC-DC Buck Converter
Schottky Diodes in SOD-923 Package
Part Number
Schottky Diodes in DSN2 Package
Device
NSR01F30NX
NSR01L30NX
NSR02F30NX
NSR02L30NX
NSR05F20NX
NSR05F30NX
NSR05F40NX
NSR10F20NX
NSR10F30NX
NSR10F40NX
NSR20F20NX
NSR20F30NX
NSR20F40NX
IF
(A)
0.1
0.1
0.2
0.2
0.5
0.5
0.5
1.0
1.0
1.0
2.0
2.0
2.0
VR
(V)
30
30
30
30
20
30
40
20
30
40
20
30
40
VF @
Rated IF
(mV)
500
530
550
580
390
400
420
430
450
490
450
480
520
IR @
Rated VR
(mA)
50
3
50
3
75
75
75
100
100
100
150
150
150
DSN2
Package
0201
0201
0201
0201
0402
0402
0402
0502
0502
0502
0603
0603
0603
Schottky Diodes in X3DFN-2 Package
Device
NSR01L30MX
NSR01F30MX
NSR02F30MX
Page 42
IF
(A)
100
100
200
VR
(V)
30
30
30
Max VF
@ 10 mA
(mV)
460
350
290
Max IR
@ 10 V
(mA)
0.2
5
15
Features
Low Leakage
Low VF
Low VF
VR (V)
IF (mA)
Features
NSR0620P2
20
500
Low Leakage
NSR0140P2
30
70
Low Leakage
NSR0130P2
30
100
Low Leakage
NSR0230P2
30
200
Low VF
NSR0530P2
30
500
Low VF
NSR0240P2
40
200
Low Leakage
NSR0340P2
40
200
Low VF
NSR0170P2
70
70
Low Leakage
Schottky Diodes in SOD-523 Package
VR
(V)
IF
(mA)
NSR0520V2
20
500
Low VF
RB520S30
30
200
Low Leakage
RB521S30
30
200
Low VF
NSR0240V2
40
250
Low Leakage
NSR0340V2
40
250
Low VF
Device
Features
Schottky Diodes in Other Packages
VR
(V)
IF
(A)
Features
Package
SS2003M
30
2
Low VF
SOT-363
SS3003CH
30
3
Low VF
SOT-457
Device
Portable & Wearable Solutions
Bipolar Transistors and Digital Transistors
Bipolar Transistors
Low VCE(sat) BJTs
ON Semiconductor offers a wide portfolio of general purpose
Bipolar Transistors. Below are the most common micro-packaged
BJTs.
ON semiconductor is the leader in Low VCE(sat) BJTs with a
portfolio that includes devices up to 6 A.
General Purpose Transistors
Technology
IC(max)
(mA)
Package
2SC5658M3
NPN
50
100
SOT-723
BC846BM3
NPN
65
100
SOT-723
2SA2029M3
PNP
50
100
SOT-723
BC856BM3
PNP
65
100
SOT-723
NST3904DP6
Dual NPN
40
200
SOT-963
NST3906DP6
Dual PNP
40
200
SOT-963
NST3946DP6
Comp NPN/PNP
40
200
SOT-963
NST847BDP6
Dual NPN
45
100
SOT-963
NST857BDP6
Dual PNP
45
100
SOT-963
NST847BPDP6
Comp NPN/PNP
45
100
SOT-963
NST3904F3
NPN
40
200
SOT-1123
NST3906F3
PNP
40
200
SOT-1123
NST847BF3
NPN
45
100
SOT-1123
NST857BF3
PNP
45
100
SOT-1123
Device
Device
Polarity
NSS12100M3
PNP
NSS12100XV6
PNP
NSS12500UW3
PNP
NSS12501UW3
NPN
NSS12601CF8
NPN
NSS20101J
NPN
NSS20500UW3
PNP
NSS20501UW3
NPN
NSS20601CF8
NPN
NSS35200CF8
PNP
NSS40200UW6
PNP
NSS40500UW3
PNP
NSS40501UW3
NPN
NSS40600CF8
PNP
NSS40601CF8
NPN
VCE
(V)
12
12
12
12
12
20
20
20
20
35
40
40
40
40
40
VCE(sat)
Hfa @
IC DC 1 A, Beta 10, 5 V, 100 mA,
(A)
Typ (mV)
Typ
1
280
250
1
280
250
5
55
250
5
31
300
6
30
300
1
220
500
5
60
250
5
31
300
6
31
300
2
79
253
2
100
250
5
65
250
5
38
300
6
50
250
6
31
300
Package
SOT-723
SOT-563
WDFN-3
WDFN-3
ChipFET
SC-89
WDFN-3
WDFN-3
ChipFET
ChipFET
WDFN-6
WDFN-3
WDFN-3
ChipFET
ChipFET
Digital Transistors
As space becomes more constrained in wireless devices, integration becomes more desirable. Incorporating bias resistors into bipolar
transistors performs this integration without degrading the performance of the transistor.
Digital Transistors
PIN 1
BASE
(INPUT)
R1
PIN 3
COLLECTOR
(OUTPUT)
R2
PIN 2
EMITTER
(GROUND)
ON Semiconductor
Part Body
Number
113E
114E
114T
114Y
115E
115T
123E
123J
123T
124E
124X
143E
143T
143Z
144E
144T
144W
R1
(W)
1K
10K
10K
10K
100K
100K
2.2K
2.2K
2.2K
22K
22K
4.7K
4.7K
4.7K
47K
47K
47K
R2
(W)
1K
10K
None
47K
100K
None
2.2K
47K
None
22K
47K
4.7K
None
47K
47K
None
22K
Package(s)
SOT-723, SOT-1123
SOT-723, SOT-963, SOT-1123
SOT-723, SOT-963, SOT-1123
SOT-723, SOT-963, SOT-1123
SOT-723
SOT-723, SOT-963, SOT-1123
SOT-723, SOT-1123
SOT-723, SOT-963, SOT-1123
SOT-723, SOT-963, SOT-1123
SOT-723, SOT-963, SOT-1123
SOT-723, SOT-1123
SOT-723, SOT-963, SOT-1123
SOT-723, SOT-1123
SOT-723, SOT-963, SOT-1123
SOT-723, SOT-963, SOT-1123
SOT-723, SOT-1123
SOT-723, SOT-963, SOT-1123
Page 43
POWER MANAGEMENT
Low VCE(sat) BJTs
VCE(max)
(V)
Power Bank Controller with Portable Device Communication,
USB Type-C, & Quick/Fast Charge for 1-Cell Li-Ion and Li-Poly Battery
LC709501F Key Features
•Simple configuration (one main LSI)
•Scalability for Power (by external FETs)
•5 V, 9 V, 12 V (cover Fast/Quick Charge)
•Smart Phone Data interface (USB Host I/F)
Base Features
POWER MANAGEMENT
Intelligent Battery Management
•Buck Charge to Power Bank Battery
•Boost Charge to Smart Phone Battery
•Pass through Charge to smart Phone Battery
•Automatic USB detection
•Over voltage/Over current detection
•Redundant battery safety
✔ Quick Charge
87%
Current
Run Time
Temperature
Battery Health
✔ Data I/F via USB
FET
-716mA
03hr 53min
22.7°C
Good
START FAST CHARGE
FET
Power Bank
Controller
LC709501F
FET x2
Reference Board
Protection
Power Bank Solution
Hard Configuration
Device
Output for
Charge
(V)
Input
Output
Device
Communication
Package
LC709501FQD-A01*
5/9/12
Micro B
Type A
USB2.0 FS
QFN-52
LC709501FQD-A03*
5/9/12
Type C
TypeC
-
QFN-52
* Pending 3Q16.
Page 44
Portable & Wearable Solutions
POWER MANAGEMENT
Switch FET 1
USB Socket
Switch FET 1
EMI Filter
USB Socket
EMI Filter
Support Devices for Power Bank Application
DC/DC FET 1
Switch FET 2
Switch FET 3
DC/DC FET 2
Switch FET 4
Power Bank
Controller
LC709501F
Lib-Protection
LC06111TMT
Switch MOSFETs
Configuration
Polarity
VDSS Max
(V)
VGSS Max
(V)
ID Max
(A)
RDS(ON) @
VGS = 2.5 V
Typ/Max
(mW)
ECH8310
Single
P-Channel
-30
±20
9
—
ECH8315
Single
P-Channel
-30
±20
7
—
31/44
19/25
ECH-8
MCH3375
Single
P-Channel
-30
±20
1.6
—
374/523
227/295
MCPH-3
SCH1337
Single
P-Channel
-30
±20
2
—
182/255
115/150
SCH-6
MCH3484
Single
N-Channel
20
±5
4.5
33/40
—
—
MCPH-3
MCH3481
Single
N-Channel
20
±9
2
105/147
80/104
—
MCPH-3
ECH8420
Single
N-Channel
20
±12
14
7.5/10.5
5.2/6.8
—
ECH-8
ECH8410
Single
N-Channel
20
±20
12
—
13/18.2
7.5/10
ECH-8
Function
Switch FET 1
Switch FET 2
Switch FET 3
Switch FET 4
Device
RDS(ON) @
VGS = 4.5 V
Typ/Max
(mW)
RDS(ON) @
VGS = 10 V
Typ/Max
(mW)
Package(s)
20/28
13/17
ECH-8
DC-DC MOSFETs
Configuration
Polarity
VSSS Max
(V)
VGSS Max
(V)
ID Max
(A)
RDS(ON) @
VGS = 2.5 V
Typ/Max
(mW)
ECH8310
Single
P-Channel
-30
±20
9
—
20/28
13/17
ECH8315
Single
P-Channel
-30
±20
7
—
31/44
19/25
ECH-8
NTTFS4H05N
Single
P-Channel
25
±20
94
—
—/4.8
—/3.3
WDFN-8
ECH8410
Single
N-Channel
20
±20
12
—
13/18.2
7.5/10
ECH-8
VGSS Max
(V)
IS (DC)
(A)
RSS(ON) @ VGS = 4.5 V
Min/Typ/Max
(mW)
RSS(ON) @ VGS = 2.5 V
Min/Typ/Max
(mW)
QG Typ
(V)
Package(s)
±12
10
6.6/8.4/10.6
11.2/14.0/19.6
—
WDFN-6
Function
DC/DC FET 1
DC/DC FET 2
Device
RDS(ON) @
VGS = 4.5 V
Typ/Max
(mW)
RDS(ON) @
VGS = 10 V
Typ/Max
(mW)
Package(s)
ECH-8
Li-Ion Battery Protection
Device
LC06111TMT*
Configuration
Polarity
VSSS Max
(V)
2 in 1
N-Channel
12
* Pending 3Q16.
ON Semiconductor
Page 45
Serial EEPROM Memory
Features
•Broad density range: 1 kb to 2 Mb
•Wide operating Vcc range: 1.8/1.7 V to 5.5 V
•High endurance: 1 million program/erase cycles
•Wide temperature range: industrial and extended
EasyPRO™ is a user-friendly, portable
programming tool for ON Semiconductor
serial EEPROMs (I2C, SPI, Microwire)
EEPROMs
Data
Transmission
Standard
I2C
INTERFACE & MEMORY
SPI
Microwire
Device
Density
Organization*
VCC Min
(V)
VCC Max
(V)
fCLK Max
(MHz)
Package(s)
CAT24M01
CAT24C512
CAT24C256
CAT24C128
CAT24C64
LE2464CXA
CAT24C32
CAT24C16
LE24162LBXA
LE24163LBXA
LE2416RLBXA
CAT24C08
CAT24C04
LE24L042CS-B
CAT24C02
CAT25M02
CAT25M01
CAT25512
CAT25256
CAT25128
CAT25640
CAT25320
CAT25160
CAT25080
CAT25040
CAT25020
CAT25010
CAT93C86
CAT93C86B
CAT93C76
CAT93C76B
CAT93C66
CAT93C56
CAT93C46
CAT93C46B
CAT93C46B
1 Mb
512 kb
256 kb
128 kb
64 kb
64 kb
32 kb
16 kb
16 kb
16 kb
16 kb
8 kb
4 kb
4 kb
2 kb
2 Mb
1 Mb
512 kb
256 kb
128 kb
64 kb
32 kb
16 kb
8 kb
4 kb
2 kb
1 kb
16 kb
16 kb
8 kb
8 kb
4 kb
2 kb
1 kb
1 kb
1 kb
128k x 8
64k x 8
32k x 8
16k x 8
8k x 8
8k x 8
4k x 8
2k x 8
2k x 8
2k x 8
2k x 8
1k x 8
512 x 8
512 x 8
256 x 8
256k x 8
128k x 8
64k x 8
32k x 8
16k x 8
8k x 8
4k x 8
2k x 8
1k x 8
512 x 8
256 x 8
128 x 8
2k x 8 & 1k x 16
2k x 8 & 1k x 16
1k x 8 & 512 x 16
1k x 8 & 512 x 16
512 x 8 & 256 x 16
256 x 8 & 128 x 16
128 x 8 & 64 x 16
128 x 8 & 64 x 16
128 x 8 / 64 x 16
1.8
1.8
1.8
1.8
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.7
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8 / 1.65
1.8
1.8 / 1.65
1.8
1.8
1.8
1.8 / 1.65
1.8 / 1.65
5.5
5.5
5.5
5.5
5.5
3.6
5.5
5.5
3.6
3.6
3.6
5.5
5.5
3.6
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
5.5
1
1
1
1
1
0.4
1
0.4
0.4
0.4
0.4
0.4
0.4
0.4
0.4
10
10
20
20
20
20
20
20
20
20
20
20
3
4
3
4
2
2
2
4
4
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8, WLCSP-4
WLCSP-6
SOIC-8, TSSOP-8, UDFN-8, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
WLCSP-6
WLCSP-5
WLCSP-6
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
WLCSP-4
SOIC-8, TSSOP-8, UDFN-8, TSOT23-5, WLCSP-4, WLCSP-5
SOIC-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8
SOIC-8, TSSOP-8, UDFN-8
SOIC-8, TSSOP-8, UDFN-8
* Organization for Microwire devices is selectable.
Page 46
Portable & Wearable Solutions
Serial NOR Flash Memory
LCD Panel
Touch Rx
Features
•SPI interface
•Supply voltage 1.65 to 1.95 V
•Minimum erase size (4 KB/64 KB)
•Fast write perfomance (Sector Erase/Page Program)
•Low standby current; support for deep standby mode
Pixels
Touch Tx
VCOM
Touch and Display
Driver Controller
SPI
FPC
Image
Data
FLASH
LE25Sxxx
Touch
Data
Application
Processor
INTERFACE & MEMORY
Main Board
LCD Module Diagram
SPI
Bluetooth
Controller
SPI
FLASH
LE25Sxxx
NFC
Controller
UART
PCM
GPIO
Density
Power Supply
(V)
LE25S20
2 Mb
LE25S81
8 Mb
LE25S161
16 Mb
ON Semiconductor
UART
PCM
GPIO
Bluetooth Block Diagram
Device
FLASH
LE25Sxxx
NFC Block Diagram
Erase Size
Sector Erase Time
(ms)
Page Program Time
(ms)
Read/Write/Standby Current, Typ
(mA)
Package
1.65 - 1.95
4 KB/64 KB/2 Mb
80
3.0
6.0/15.0/0.010
WLCSP-8
1.65 - 1.95
4 KB/64 KB/8 Mb
80
0.3
6.0/18.0/0.010
WLCSP-8
1.65 - 1.95
4 KB/64 KB/16 Mb
15
0.4
6.0/6.5/0.009
UDFN-8, WLCSP-8
Page 47
Omniclock Programmable Clock Synthesizers
INTERFACE & MEMORY
Key Features
•Single PLL
•Input Frequency Range:
•Crystal: 3 – 50 MHz (low cost ESR crystal compatible)
•Clock: 3 – 200 MHz (single-ended only)
•Up to 3 single-ended (LVCMOS/LVTTL) outputs, or up to 1 differential (LVPECL, LVDS, HCSL
or CML) output + 1 single-ended (LVCMOS/LVTTL) output
•Output Frequency Range: 8 kHz (Min), 200 MHz (Max)
•Programmable Spread Spectrum Capabilities for EMI Suppression
•Center Spread (0.125% steps): ± 0.125% to ± 3%
•Down Spread (0.25% steps): -0.25% to -4%
•Modulation Rate: 30 kHz – 130 kHz
•PLL Bypass mode
•Individual Output Enable pin for each output and Power Down Capability
•Individual Output Voltage pins per output, allowing setting of output voltage
(1.8 V, 2.5 V or 3.3 V; equal to or less than VDD)
•Automatic Gain Control (Crystal Power Limiting)
•Programmable internal input crystal load capacitors
•Programmable Output Drive current
•Up to 4 independent configurations using SELx pins
•Supply Voltage: 3.3 V ±10%; 2.5 V ± 10%; 1.8 V ± 0.1 V
•Temperature Range: -40°C to +85°C
•Available in QFN-16 (3 mm x 3 mm) and WDFN-8 (2 mm x 2 mm) packages
VDD
PD#
SEL0
SEL1
Input
Decoder
Crystal/Clock Control
Configuration
Memory
Output Control
VDDO0
Frequency and SS
Reference
Clock
XIN/CLKIN
Clock Buffer/
Crystal
Oscillator and
AGC
Crystal
XOUT
PLL Block
Phase
Detector
Charge
Pump
Output
Divider
VCO
CMOS/
DIFF
Buffer
CLK0
OE0
VDDO1
Feedback
Divider
Output
Divider
CMOS/
DIFF
Buffer
CLK1
OE1
VDDO2
Output
Divider
CMOS
Buffer
CLK2
PLL Bypass Mode
OE2
GND
GNDO
Block Diagram
Page 48
Portable & Wearable Solutions
Omniclock Programmable Clock Synthesizers
Using Omniclock in Your System
Customer provides
configuration file to
ON Semiconductor sales
channel
ON Semiconductor
programs device in
factory with desired
customer configuration,
and creates
customer-specific part
number
INTERFACE & MEMORY
Customer orders blank
Omniclock devices
Customer uses free GUI
and supplied evaluation
board to configure the
blank device to the
desired parameters:
frequency, drive strength,
spread spectrum, etc.
Configuration GUI
Individual OE
Individual
Vddo
Supply Voltage
(V)
Number of
Configurations
Number of
Outputs
Package
NB3H63143G
Yes
Yes
2.5 / 3.3
4
3
QFN-16
NB3H60113G
No
No
2.5 / 3.3
1
3
DFN-8
NB3V63143G
Yes
Yes
1.8
4
3
QFN-16
NB3V60113G
No
No
1.8
1
3
DFN-8
Device
ON Semiconductor
Page 49
EMI Reduction with Spread Spectrum Clocks
Spread spectrum frequency modulator clock generators reduce electromagnetic interference (EMI) at
the clock source, allowing system wide EMI reduction on all clock dependent signals.
Frequency
(MHz)
Without Spread
Spectrum
(dB)
With Spread
Spectrum
(dB)
Reduction
(dB)
46.9
-28
-28.4
0.4
3rd Harmonic
143.9
-31.1
-36.9
5.8
5th Harmonic
238.5
40
-47.1
7.1
Fundamental
7th Harmonic
333.1
-50.7
-57.6
6.9
9th Harmonic
434.9
-43.7
-50.9
7.2
11th Harmonic
524.7
-41.8
-49
7.2
Device
VDD Typ
(V)
fin Typ
(MHz)
fout Typ
(MHz)
Deviation Type
Features
Package(s)
P3MS650100H
1.8; 2.5; 3.3
15-30; 15-60
15-30; 15-60
±1.4% @ 24 MHz
Power Down
WDFN-4
P3MS650103H
1.8; 2.5; 3.3
15-30; 15-60
15-30; 15-60
±0.45% @ 24 MHz
Power Down
WDFN-4
2.3-3.6
18-36
18-36
±0.4 to ±2.5
High Drive, PDB
WDFN-8
P3PSL450AH
1.8
15-60
15-60
Analog
PDB
WDFN-8
PCS3PS550A
2.3-3.6
18-36
18-36
±0.4 to ±2.5
PDB
WDFN-8
P3PS550AH
INTERFACE & MEMORY
4-PLL Audio/Video Clock Generator with Spread Spectrum Clock
Key Features – P1P40167
•Eliminates multiple crystals by using one device to
generate multiple clocks
27 MHz Clock
•Integrated loop filter
or Crystal Input
•Input: 27 MHz crystal or external input
Optional Tuning
•Outputs:
Capacitors
•27 MHz reference output
SCLK
•Fixed output frequency of 48 MHz and 22.5792 MHz
•Configurable spread spectrum 37 MHz output
SDATA
•Selectable audio clock frequency of 22.5792 MHz or
24.576 MHz
•LVCMOS input and outputs
•Serial interface to control output enable/disable, SS
selection and PLL frequency selection
•1.8 V supply voltage
Page 50
VDO
3
VDDO
2
Crystal
Oscillator
27M
I2C
Control
Logic
PLL1
(Spread)
37M
PLL2
48M
PLL3
22/24M
PLL4
22M
2
VSS
P1P40167 Block Diagram
Portable & Wearable Solutions
Cascadable I/O Expanders
Features
•I2C and SMBus interfaces
•1 MHz SCL clock frequency
•30 mA SDA sink capability
3.3 V
12 V
Button
LED
SCL
SDA
SCL
SDA
I/O
I/O
INT
I/O
I/O
μC
GPIO
Vext
LEDs
I/O
I/O
I/O
I/O
I/O
Slot 2 Slot 3
3.3 V
AUXEN
PWRFLT
Hot-Plug
Controller
12 V
MOSFETs
3.3 V
PCA96xxE
PCA95xxE
I/O Expander
I/O
I/O
Backplane
Systems
AUXEN
PWRFLT
Hot-Plug
Controller
12 V
PRSNT2
PRSNT2
I/O
I/O I/O I/O
Keypad
Control
ADM1033
Thermal Sensor
and
Fan Controller
Device
I/O
Cascadable
VCC Min
(V)
VCC Max
(V)
Interrupt
Output
PCA9535E
16
64 Programmable Slave Addresses
1.65
5.5
4
QFN-24, SOIC-24, TSSOP-24
PCA9655E
16
64 Programmable Slave Addresses
1.65
5.5
4
QFN-24, SOIC-24, TSSOP-24
PCA9654E
8
8 Slave ID Addresses
1.65
5.5
4
ON Semiconductor
I/O
LED Blink/
Pullups
PWM
4
Package
SOIC-16, WQFN-16, TSSOP-16
Page 51
INTERFACE & MEMORY
Temperature
Control
Logic and Digital Interfaces
•MiniGates™ and Standard Logic - condition logic signals
•Bus Switches and Analog Switches - low-cost signal routing and multiplexing
•Voltage Translators - interface sub-systems with different operating voltages
•I2C Interface – increase # of I/O ports, level shifting, repeaters
•Custom Logic Solutions - create “valued-added interface”
Module #1
Peripheral 1
I/O
Expander
Peripheral 2
I2C
μC #1
On-board translations
• SPI
Translator
• I2C
• SMBus
Translation
Translator
I/O Expanders
• Increase No
of I/O Ports
MiniGates
• Buffering
• Control Logic
Mem# 2
Memory
Control
Peripheral 3
INTERFACE & MEMORY
Mem# 1
Analog/Bus Switches
• Signal Routing
• Audio Routing
MiniGate™ Family
Operating
Voltage
(V)
Drive
Current
(mA)
Propagation
Delay
(ns)
SC-88
TSOP-5
HC (High Speed CMOS)
2.0 – 6.0
5.2 @ 5 V
7
MC74HC1GxxDF
MC74HC1GxxDT
VHC (Very High Speed
CMOS)
2.0 – 5.5
8@5V
4.5
MC74VHC1GxxDF
MC74VHC1GxxDT
LCX (Low-Voltage CMOS,
Xtra Drive)
1.65 – 5.5
24 @ 5 V
2.9
NL17SZxxDF
VCX (Very High Speed
CMOS, Xtra Drive)
0.9 – 3.6
24 @ 3.6 V
1.5
SG (Super Low Voltage
Gate)
0.9 – 3.6
8 @ 3.3 V
2.5
Page 52
SOT-553
NL17SZxxXV5
UDFN
SOT-9
NLU1GxxCMU
NL17SHxxP5
NLX1GxxCMU
NL17SZxxP5
NL17SGxxMU
NL17SGxxP5
NL17SVxxX5
NL17SGxxDF
Portable & Wearable Solutions
Logic Translators
Dual supply voltage logic translators connect ICs and
PCBs together that operate at different supply voltages.
PCB #1
PCB #2
Translator
Key Features
•Industry’s first devices with independent power
supplies (VL < VCC, VL = VCC, or VL > VCC)
•High 100 pF capacitive drive capability
•Overvoltage tolerant enable and I/O pins
•Non-preferential power-up sequencing
•Power-off protection
Translator
μC #1
μC #2
PCB-to-PCB
Translation
On-board
translations
• SPI
• I2C
• SMBus
Translator
EEPROM
Autosense Bidirectional
Translator
(Push-Pull Output)
P
One−Shot
VL
Bidirectional
Translator
(with Direction Pin)
VCC
R1
VL
VCC
V???
1k
VCCA
A
Block Diagram
N
One−Shot
VCCB
B
I/O VL
PU1
I/O VCC
P
One−Shot
OE
R2
RPullup
10 k
One−Shot
Block
Gate
Bias
One−Shot
Block
EN
I/O VL
INTERFACE & MEMORY
Unidirectional Translator
Autosense Bidirectional
Translator
(Open-Drain Output)
V???
DIR
PU2
RPullup
10 k
A
EN
N
?
I/O VCC
Product Preview
1k
N
One−Shot
Attributes
• High Data Rate
• Low Power Consumption
• High Data Rate
• Low Power Consumption
• High Data Rate
• Low Power Consumption
• Flexible PCB Design
• High Data Rate
• Low Power Consumption
• Flexible PCB Design
Trade-Offs
• Fixed Input & Output Pins
• Modest Output Current
• Modest Bandwidth
• Directional Control Pin Required
•SPI
•GPIO
•SPI
•GPIO
•I2C, SMBus, PMBus
•GPIO
• SDIO Cards
• 1-Wire Bus
•GPIO
• NLSX3012 (2-Bit, UDFN-8)
• NLSX3014 (4-Bit, UQFN-12)
• NLSX3013 (8-Bit, CSP-20)
• NLSX3018 (8-Bit, UDFN-20)
• NLSX4014 (4-Bit, UQFN-12)
• NLSX5011 (1-Bit, UULGA-6, UDFN-6)
• NLSX5012 (2-Bit, UDFN-8)
• NLSX5014 (4-Bit, UDFN-12)
• NLSX3373 (2-Bit, UDFN-8)
• NLSX3378 (4-Bit, CSP-12)
• NLSX4373 (2-Bit, UDFN-8)
• NLSX4378 (4-Bit, CSP-12)
• NLSV1T45 (1-Bit, ULLGA-6)
• NLSV2T245 (2-Bit, UQFN-10)
• NLSV2T3236 (2-Bit, UQFN-10)
• NLA16T245 (16-Bit, TSSOP-48)
Applications
• NLSV1T34 (1-Bit, ULLGA-6)
• NLSV1T240/244 (1-Bit, UDFN-6)
• NLSV2T240/244 (2-Bit, UDFN-8)
Sample Device
• NLSV4T240/244 (4-Bit, UDFN-12)
(I/O Channels,
• NLSV4T3234 (4-Bit, CSP-11)
Package)
• NLSV8T240/244 (8-Bit, UDFN-20)
ON Semiconductor
Page 53
Analog Switches
Data Type
Configuration
VCC Min
(V)
VCC Max
(V)
RON Max
(W)
IIkg Max
(mA)
C
(pF)
BW
(MHz)
Package(s)
NLAS7213
USB 2.0/UART
DPST
1.65
4.5
10
1
5
1100
UQFN-8
NLAS4717
USB 1.1/UART
Dual SPDT
1.8
5.5
4.5
1
110
40
Flip-Chip-10, Micro-10
NLAS4717EP
USB 1.1/UART
Dual SPDT
1.8
5.5
4.5
1
38
90
WQFN-10, Flip-Chip-10
NLAS7222A
USB 2.0/UART
DPDT
3
3.6
9
1
7
500
WQFN-10
NLAS7222B
USB 2.0/UART
DPDT
1.65
4.5
8
1
8
500
UQFN-10
NLAS7222C
USB 2.0/UART
DPDT
1.65
4.5
8
1
10
500
UQFN-10
NLAS7242
USB 2.0/UART
DPDT
1.65
4.5
7.5
1
7.5
900
UQFN-10
NL3HS2222
USB 2.0/UART
DPDT
1.65
4.5
8
1
7.5
950
UQFN-10
NCN9252
USB 2.0/UART
DP3T
1.65
4.5
6
1
16
525
UQFN-12
NLAS3899B
SIM card
Dual DPDT
1.65
4.3
4
1
20
280
WQFN-16, QFN-16
NS5S1153
USB 2.0/UART/Negative Audio
DPDT
-0.5
5
4.6
35
7
900
UQFN-10
NCN1154
USB 2.0/UART/Negative Audio
DP3T
-0.5
6
3
50
9
850
UQFN-12
NCN1188
USB 2.0/MHL 1.1/Negative Audio
DP3T
-0.5
6
-
-
-
-
UQFN-12
NL3HS644
4-Lane MIPI Switch
SPDT
1.65
4.5
12
0.1
12
1050
WLCSP-36
NLAS3257
Low Capacitance
SPDT
1.65
4.5
9
1
7.5
900
XLLGA-6
NLAS3157
Low Capacitance
SPDT
1.65
4.5
9
1
7.5
900
ULLGA-6
Device
INTERFACE & MEMORY
Page 54
Portable & Wearable Solutions
Small Signal MOSFETs
VGS Max
(V)
ID Max
(A)
RDS(ON) Max @
VGS = 4.5 V
(W)
RDS(ON) Max @
VGS = 2.5 V
(W)
RDS(ON) Max @
VGS = 1.8 V
(W)
Package(s)
Polarity
Configuration
NTNS3193NZ
Single
N-Channel
20
±8
0.23
1.4
1.9
2.2
XLLGA-3
NTNS3A91PZ
Single
P-Channel
-20
±8
0.21
1.6
2.4
3.3
XLLGA-3
NTNS3164NZ
Single
N-Channel
20
±8
0.22
0.7
1
2
SOT-883
NTNS3A65PZ
Single
P-Channel
-20
±8
0.23
1.3
2
3.4
SOT-883
NTNUS3171PZ
Single
P-Channel
-20
±8
0.15
3.5
4
5.5
SOT-1123
NTK3139P
Single
P-Channel
-20
±6
0.78
0.48
0.67
0.95
SOT-723
NTK3134N
Single
N-Channel
20
±6
0.89
0.35
0.45
0.65
SOT-723
NTK3043N
Single
N-Channel
20
±10
0.26
3.4
4.5
10
SOT-723
NTZS3151P
Single
P-Channel
-20
±8
0.9
0.142
0.2
0.24
SOT-563
NTUD3170NZ
Dual
N-Channel
20
±8
0.22
1.5
2
3
SOT-963
NTZD3152P
Dual
P-Channel
-20
±6
0.4
0.9
1.2
2
SOT-563
NTZD3154N
Dual
N-Channel
20
±6
0.5
0.55
0.7
0.9
SOT-563
NTZD5110N
Dual
N-Channel
60
±20
0.3
2.5
-
-
SOT-563
NTUD3169CZ
Complementary
N-Channel
-20
±8
0.22
1.5
2
3
P-Channel
20
±8
0.25
5
6
7
NTZD3155C
Complementary
N-Channel
20
±6
0.54
0.55
0.7
0.9
P-Channel
-20
±6
0.43
0.9
1.2
2
ON Semiconductor
SOT-963
SOT-563
Page 55
INTERFACE & MEMORY
Device
V (BR)DSS
Min
(V)
Sales and Design Assistance from ON Semiconductor
ON Semiconductor Technical Support
www.onsemi.com/support
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