NCS2300 Series Advance Information High Voltage Comparators The NCS2300 Series are ultra–low power comparators. These devices consume only 11 A of supply current. They operate at a wide voltage range of 1.7 V to 12 V. Additional features include no output phase inversion when transitioning in/out of tri–state mode, internal hysteresis which allows for clean output switching, and rail–to–rail input performance. The NCS2300 Series are available in the tiny SOT23–5 or SOT23–6 package with two industry standard pinouts. The NCS2301/3 Series in the SOT23–6 package features an enable function which can be externally controlled. This lowers current consumption to 1.8 A and allows for users to implement these devices in power sensitive applications such as portable electronics. SOT23–5 (TSOP–5, SC59–5) SN SUFFIX CASE 483 5 1 SOT23–6 (TSOP–6, SC59–6) SN SUFFIX CASE 318G 6 1 Features • Rail–to–Rail Input/Output Performance • Low Supply Current of 11 A • No Phase Inversion/Glitchless transitioning in or out of PIN CONNECTIONS Tri–State Mode • Complementary or Open Drain Output Configuration • Available with the Enable Function • Tiny SOT23–5 and SOT23–6 Package Portable Electronics Window Comparator Voltage Detector Zero–Crossing Detectors Personal Digital Assistants Non–inverting Input Inverting Input Output 1 VCC Non–Inverting Input 2 3 5 VEE 4 Inverting Input Style 1 Pinout (SN1T1) Typical Applications • • • • • http://onsemi.com Output 1 VEE Non–Inverting Input 2 3 5 VCC 4 Inverting Input Style 2 Pinout (SN2T1) SOT23–5 + - Output Output 1 6 5 VEE VCC Non–Inverting Input 2 5 3 4 Enable Inverting Input Style 1 Pinout (SN1T1) This device contains 121 active transistors. Output 1 6 5 VCC VEE Non–Inverting Input 2 5 3 4 Enable Inverting Input Style 2 Pinout (SN2T1) SOT23–6 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 11 of this data sheet. This document contains information on a new product. Specifications and information herein are subject to change without notice. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 11 of this data sheet. Semiconductor Components Industries, LLC, 2002 January, 2002 – Rev. 0 1 Publication Order Number: NCS2300/D NCS2300 Series MAXIMUM RATINGS Symbol Value Unit Supply Voltage Range (VCC to VEE) Rating VS 12 V Non–inverting/Inverting Input to VEE – –0.1 to (VCC + 0.1) V Thermal Resistance, Junction to Air RJA 248 °C/W Operating Junction Temperature TJ 150 °C Operating Ambient Temperature TA –40 to +105 °C Storage Temperature Range Tstg –65 to +150 °C Output Short Circuit Duration Time (Note 1) tS Indefinite s ESD Tolerance (Note 2) Human Body Model Machine Model – V 1000 120 1. The maximum package power dissipation limit must not be exceeded. TJ(max) TA PD RJA 2. ESD data available upon request. ELECTRICAL CHARACTERISTICS (For all values VCC = 5.0 V, VEE = 0 V, TA = 25°C, unless otherwise noted.) (Note 3) Characteristics Symbol Min Typ Max Unit – 2.5 – – 0.5 5.0 VEE – 0.1 – VCC + 0.1 – 1.0 A Input Hysteresis TA = 25°C TA = 0°C to 70°C TA = –40°C to 105°C VHYS Input Offset Voltage TA = 25°C TA = 0°C to 70°C TA = –40°C to 105°C VIO Common Mode Voltage Range VCC 2.5 V VCM Output Leakage Current ILEAK – Common Mode Rejection CMRR – 80 – dB IIB – 0.001 10 nA Power Supply Rejection PSRR – 80 – dB Supply Current VIN+ VIN– VCC = 2.7 V TA = 25°C TA = 0°C to 70°C TA = –40°C to 105°C VCC = 5.0 V TA = 25°C TA = 0°C to 70°C TA = –40°C to 105°C ICC – 11 – A Output Voltage High State Isource = 8.0 mA TA = 25°C TA = 0°C to 70°C TA = –40°C to 105°C VOH – VCC – 0.3 – V Input Bias Current 3. The limits over the extended temperature range are guaranteed by design only. http://onsemi.com 2 mV mV V NCS2300 Series ELECTRICAL CHARACTERISTICS (For all values VCC = 5.0 V, VEE = 0 V, TA = 25°C, unless otherwise noted.) (Note 4) Characteristics Symbol Min Typ Max Unit VOL – 0.3 – V tPHL tPLH – – 1.4 1.2 – – Output Voltage Fall Time CL = 50 pF tFALL – 32 – ns Output Voltage Rise Time CL = 50 pF tRISE – 23 – ns tPU – 35 100 s ICC(OFF) – 1.8 – A Enable Voltage (High) VEN(HIGH) – – 2.2 V Enable Voltage (Low) VEN(LOW) 1.1 – – V VENHYS – 75 – mV IEN – 275 – nA ITRI–LEAK – 3.0 – nA Enable Settling Time tEN(ON) – 45 – s Disable Settling Time tEN(OFF) – 2.0 – s Output Voltage Low State Isink = 8.0 mA TA = 25°C TA = 0°C to 70°C TA = –40°C to 105°C s Propagation Delay 10 mV Overdrive, CL = 50 pF Power–up Time Disabled Supply Current Enable Pin = 0 Enable Hysteresis Enable Pull–up Current Tri–state Leakage Current 4. The limits over the extended temperature range are guaranteed by design only. http://onsemi.com 3 NCS2300 Series 1000 8.0 ICC, SUPPLY CURRENT (µA) ICC, SUPPLY CURRENT (µA) 9.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 –50 –25 0 25 50 75 10 0.1 1.0 10 100 300 TA, AMBIENT TEMPERATURE (°C) FREQUENCY (kHz) Figure 1. NCS2300 Series Supply Current vs. Temperature Figure 2. NCS2300 Series Supply Current vs. Output Transition Frequency 1000 TA = 85°C 8.0 VCC – VOH, OUTPUT VOLTAGE HIGH STATE (V) ICC, SUPPLY CURRENT (µA) 100 1.0 0.01 100 9.0 7.0 6.0 TA = –40°C TA = 25°C 5.0 4.0 3.0 2.0 1.0 0 0 2.0 4.0 6.0 8.0 10 TA = 25°C 100 10 1.0 0.1 0.01 12 0.1 1.0 10 VCC, SUPPLY VOLTAGE (V) Isource, OUTPUT SOURCE CURRENT (mA) Figure 3. NCS2300 Series Supply Current vs. Supply Voltage Figure 4. NCS2300/1 Output Voltage High State vs. Output Source Current VOL, OUTPUT VOLTAGE LOW STATE (mA) VOL, OUTPUT VOLTAGE LOW STATE (mV) TA = 25°C 1000 TA = 25°C 100 10 1.0 0.1 0.01 0.1 1.0 10 450 400 350 300 250 200 150 100 50 0 –50 –25 0 25 50 75 Isink, OUTPUT SINK CURRENT (mA) TA, AMBIENT TEMPERATURE (°C) Figure 5. NCS2300 Series Output Voltage Low State vs. Output Sink Current Figure 6. NCS2300 Series Output Voltage Low State vs. Temperature http://onsemi.com 4 100 4.9 1.4 PROPAGATION DELAY (s) VOH, OUTPUT VOLTAGE HIGH STATE (V) NCS2300 Series 4.8 4.7 4.6 4.5 –50 –25 0 25 50 75 1.2 tPHL 1 tPLH 0.8 0.6 –50 100 –25 TA, AMBIENT TEMPERATURE (°C) 25 50 75 Figure 8. NCS2300 Series Propagation Delay vs. Temperature 1.4 2 tHL PROPAGATION DELAY (s) 1.2 tLH 1 0.8 0.6 0.4 TA = 25°C INPUT OVERDRIVE = 100 mV 0.2 VCC = 5.0 V TA = 25°C tPHL 1.6 1.2 tPLH 0.8 0.4 0 0 2 4 6 8 10 12 0 VCC, SUPPLY VOLTAGE (V) 50 100 150 Figure 10. NCS2300 Series Propagation Delay vs. Input Overdrive 2.5 VCC = 12 V TA = 25°C tPHL 2 VCC 1.5 tPLH 1 Output 0.5 Input Overdrive = 50 mV 0 0 50 100 150 200 INPUT OVERDRIVE (mV) Figure 9. NCS2300 Series Output Response Time vs. Supply Voltage PROPAGATION DELAY (s) 100 TA, AMBIENT TEMPERATURE (°C) Figure 7. NCS2300 Series Output Voltage High State vs. Temperature OUTPUT RESPONSE TIME (s) 0 200 10 µs/Div INPUT OVERDRIVE (mV) Figure 11. NCS2300 Series Propagation Delay vs. Input Overdrive Figure 12. NCS2300 Series Power–Up Delay http://onsemi.com 5 ICCD, DISABLED SUPPLY CURRENT (A) NCS2300 Series VCM, INPUT COMMON MODE VOLTAGE RANGE (V) 15 10 5 0 –5 –10 –15 2 4 6 8 10 12 2.05 2.04 TA = 25°C 2.03 2.02 2.01 2 1.99 1.98 1.97 1.96 1.95 2 4 6 8 10 12 VCC, SUPPLY VOLTAGE (V) VS, SUPPLY VOLTAGE (V) Figure 13. NCS2300 Series Input Common Mode Voltage vs. Supply Voltage Figure 14. NCS2300 Series Disabled Supply Current OPERATING DESCRIPTION The NCS2300 Series are ultra–low power comparators. These devices consume only 11 µA of supply current while achieving a typical propagation delay of 1.1 µs at 10 mV overdrive. They are guaranteed to operate at a low voltage of 1.7 V up to 12 V. This is accomplished by the use of a modified analog CMOS process which implements depletion MOSFET devices. The common–mode input voltage range extends 0.1 V above the upper and lower rail. They are available in SOT23–5 (compatible with the TSOP–5) and SOT23–6 packages. The SOT23–6 has the enable function which can be externally controlled. It allows for lower current consumption of 1.8 µA. This makes the devices suitable for implementation in power sensitive applications such as portable electronics. When the enable pin is at a low level, the output will remain at a high or low level. The output will not respond to any changes at the input pins. Conversely, when the enable pin is at a high level, the output will respond to change at the input pins. The enable pin should be connected to VCC when not in use. In addition, with the added feature of internal hysteresis, this allows for greater noise immunity and clean output switching. Output Stage The NCS2300/1 has a complementary output which drives rail–to–rail output swing. The NCS2302/3 has an open drain N–channel output that can be pulled up to 12 V (max) with an external pull– up resistor. This allows for mixed–voltage system applications These devices can operate up to an 8.0 mA load. The output stage is designed so that shoot through current is minimized while switching. This enhancement eliminates the need for bypass capacitors. There is no output phase reversal when switching in or out of tri–state mode. VCC VCC IN (+) IN (+) Output Output IN (–) IN (–) VEE VEE Figure 15. NCS230xSNxT1 Complementary Output Configuration Figure 16. NCS230xSNxT1 Open Drain Output Configuration http://onsemi.com 6 NCS2300 Series VCC Rx IN (–) EN NCS 2300/1 OUT IN (+) Cx VO R2 R1 The oscillation frequency can be programmed as follows: 1 f1 T 2.2 RxCx Figure 17. Schmitt Trigger Oscillator VCC 1M R1 100 pF t0 R2 1M IN (–) EN NCS 2300/1 OUT IN (+) VCC VO C1 R3 The resistor divider R1 and R2 can be used to set the magnitude of the input pulse. The pulse width is set by adjusting C1 and R3. Figure 18. One–Shot Multivibrator http://onsemi.com 7 t0 t1 0 NCS2300 Series +5 V +3 V 100 K R pull–up IN (–) EN NCS 2302/3 OUT IN (+) 100 K +3 V Logic Output +5 V Logic Input This circuit converts 5 V logic to 3 V logic. In using the NCS2202/3 allows for full 5 V logic swing without creating overvoltage on the 3 V logic input. Figure 19. Logic Level Translator VCC IN (–) EN NCS 2300/1 OUT IN (+) 100 mV Figure 20. Zero–Crossing Detector http://onsemi.com 8 NCS2300 Series - + 500 K Vbat 9.0 V 90 K S1 10 K 1M Vbat IN (–) EN NCS 2301 OUT IN (+) 100 K S2 100 K Vbat 1M Vbat 90 K S3 IN (–) EN NCS 2301 OUT IN (+) 1K 10 K 500 K Figure 21. First–Event Detector http://onsemi.com 9 NCS2300 Series MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.094 2.4 0.037 0.95 0.074 1.9 0.037 0.95 0.028 0.7 0.039 1.0 inches mm SOT23–5 0.094 2.4 0.037 0.95 0.074 1.9 0.037 0.95 0.028 0.7 0.039 1.0 SOT23–6 http://onsemi.com 10 inches mm NCS2300 Series ORDERING INFORMATION Device Pinout Style Output Type Package NCS2300SN1T1 1 Complementary SOT23–5 NCS2300SN2T1 2 Complementary SOT23–5 NCS2301SN1T1 1 Complementary, Enable SOT23–6 NCS2301SN2T1 2 Complementary, Enable SOT23–6 NCS2302SN1T1 1 Open Drain SOT23–5 NCS2302SN2T1 2 Open Drain SOT23–5 NCS2303SN1T1 1 Open Drain, Enable SOT23–6 NCS2303SN2T1 2 Open Drain, Enable SOT23–6 MARKING DIAGRAMS SOT23–5 SN SUFFIX CASE 483 SOT23–6 SN SUFFIX CASE 318G 6 5 CAxYW CAxYW 1 1 x = C for NCS2301SN1T1 D for NCS2301SN2T1 G for NCS2303SN1T1 H for NCS2303SN2T1 Y = Year W = Work Week x = A for NCS2300SN1T1 B for NCS2300SN2T1 E for NCS2302SN1T1 F for NCS2302SN2T1 Y = Year W = Work Week http://onsemi.com 11 Shipping 3000 Tape & Reel NCS2300 Series PACKAGE DIMENSIONS SOT23–5 (TSOP–5, SC59–5) SN SUFFIX PLASTIC PACKAGE CASE 483–01 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. D S 5 4 1 2 3 B L G A J C 0.05 (0.002) H M K http://onsemi.com 12 DIM A B C D G H J K L M S MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0 10 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0 10 0.0985 0.1181 NCS2300 Series PACKAGE DIMENSIONS SOT23–6 (TSOP–6, SC59–6) SN SUFFIX PLASTIC PACKAGE CASE 318G–02 ISSUE H A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. L 6 S 1 5 4 2 3 B D G M J C 0.05 (0.002) H K http://onsemi.com 13 DIM A B C D G H J K L M S MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 0 10 2.50 3.00 INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0 10 0.0985 0.1181 NCS2300 Series Notes http://onsemi.com 14 NCS2300 Series Notes http://onsemi.com 15 NCS2300 Series ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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