Data Sheet

74LVC2G66-Q100
Bilateral switch
Rev. 1 — 16 April 2013
Product data sheet
1. General description
The 74LVC2G66-Q100 is a low-power, low-voltage, high-speed Si-gate CMOS device.
The 74LVC2G66-Q100 provides two single pole, single-throw analog switch functions.
Each switch has two input/output terminals (nY and nZ) and an active HIGH enable input
(nE). When nE is LOW, the analog switch is turned off.
Schmitt trigger action at the enable inputs makes the circuit tolerant of slower input rise
and fall times across the entire VCC range from 1.65 V to 5.5 V.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 Wide supply voltage range from 1.65 V to 5.5 V
 Very low ON resistance:
 7.5  (typical) at VCC = 2.7 V
 6.5  (typical) at VCC = 3.3 V
 6  (typical) at VCC = 5 V
 Switch current capability of 32 mA
 High noise immunity
 CMOS low power consumption
 TTL interface compatibility at 3.3 V
 Latch-up performance meets requirements of JESD78 Class I
 ESD protection:
 MIL-STD-883, method 3015 exceeds 2000 V
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
 Enable input accepts voltages up to 5.5 V
 Multiple package options
74LVC2G66-Q100
NXP Semiconductors
Bilateral switch
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74LVC2G66DP-Q100
40 C to +125 C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74LVC2G66DC-Q100
40 C to +125 C
VSSOP8 plastic very thin shrink small outline package; 8
leads; body width 2.3 mm
SOT765-1
4. Marking
Table 2.
Marking codes
Type number
Marking code[1]
74LVC2G66DP-Q100
V66
74LVC2G66DC-Q100
V66
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
1
#
1
X1
1
#
1
X1
001aah808
001aah807
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
nZ
nY
nE
VCC
Fig 3.
mna658
Logic diagram (one switch)
74LVC2G66_Q100
Product data sheet
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6. Pinning information
6.1 Pinning
/9&*4
<
9&&
=
(
(
=
*1'
<
DDD
Fig 4.
Pin configuration SOT505-2 and SOT765-1
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Symbol
1Y
1
independent input or output
1Z
2
independent input or output
2E
3
enable input (active HIGH)
GND
4
ground (0 V)
2Y
5
independent input or output
2Z
6
independent input or output
1E
7
enable input (active HIGH)
VCC
8
supply voltage
7. Functional description
Table 4.
Function table[1]
Input nE
Switch
L
OFF-state
H
ON-state
[1]
H = HIGH voltage level; L = LOW voltage level.
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Product data sheet
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Bilateral switch
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
[1]
VI
input voltage
IIK
input clamping current
VI < 0.5 V or VI > VCC + 0.5 V
ISK
switch clamping current
VI < 0.5 V or VI > VCC + 0.5 V
[2]
Min
Max
Unit
0.5
+6.5
V
0.5
+6.5
V
50
-
mA
-
50
mA
0.5
VCC + 0.5
V
-
50
mA
VSW
switch voltage
enable and disable mode
ISW
switch current
VSW > 0.5 V or
VSW < VCC + 0.5 V
ICC
supply current
-
100
mA
IGND
ground current
100
-
mA
Tstg
storage temperature
Ptot
total power dissipation
Tamb = 40 C to +125 C
[3]
65
+150
C
-
250
mW
[1]
The minimum input voltage rating may be exceeded if the input current rating is observed.
[2]
The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.
[3]
For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K.
For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K.
9. Recommended operating conditions
Table 6.
Operating conditions
Symbol
Parameter
VCC
supply voltage
VI
input voltage
VSW
switch voltage
Tamb
ambient temperature
t/V
Conditions
Min
Max
Unit
1.65
5.5
V
0
5.5
V
0
VCC
V
40
+125
C
VCC = 1.65 V to 2.7 V
[2]
-
20
ns/V
VCC = 2.7 V to 5.5 V
[2]
-
10
ns/V
[1]
input transition rise and fall rate
[1]
To avoid sinking GND current from terminal nZ when switch current flows in terminal nY, the voltage drop across the bidirectional switch
must not exceed 0.4 V. If the switch current flows into terminal nZ, no GND current flows from terminal nY. In this case, there is no limit
for the voltage drop across the switch.
[2]
Applies to control signal levels.
74LVC2G66_Q100
Product data sheet
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10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
HIGH-level
input voltage
VIH
LOW-level
input voltage
VIL
40 C to +85 C
Conditions
40 C to +125 C
Min
Typ[1]
Max
Min
Unit
Max
0.65  VCC
-
-
0.65  VCC
-
V
VCC = 2.3 V to 2.7 V
1.7
-
-
1.7
-
V
VCC = 2.7 V to 3.6 V
2.0
-
-
2.0
-
V
VCC = 4.5 V to 5.5 V
0.7  VCC
-
-
0.7  VCC
-
V
VCC = 1.65 V to 1.95 V
-
-
0.35  VCC
-
VCC = 2.3 V to 2.7 V
-
-
0.7
-
0.7
V
VCC = 2.7 V to 3.6 V
-
-
0.8
-
0.8
V
VCC = 1.65 V to 1.95 V
VCC = 4.5 V to 5.5 V
0.35  VCC V
-
-
0.3  VCC
-
0.3  VCC
V
-
0.1
5
-
100
A
II
input leakage
current
pin nE; VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
[2]
IS(OFF)
OFF-state
leakage
current
VCC = 5.5 V; see Figure 5
[2]
-
0.1
5
-
200
A
IS(ON)
ON-state
leakage
current
VCC = 5.5 V; see Figure 6
[2]
-
0.1
5
-
200
A
ICC
supply current
VI = 5.5 V or GND;
VSW = GND or VCC;
VCC = 1.65 V to 5.5 V
[2]
-
0.1
10
-
200
A
ICC
additional
supply current
pin nE; VI = VCC  0.6 V;
VSW = GND or VCC;
VCC = 5.5 V
[2]
-
5
500
-
5000
A
CI
input
capacitance
-
2.0
-
-
-
pF
CS(OFF)
OFF-state
capacitance
-
5.0
-
-
-
pF
CS(ON)
ON-state
capacitance
-
9.5
-
-
-
pF
[1]
All typical values are measured at Tamb = 25 C.
[2]
These typical values are measured at VCC = 3.3 V.
74LVC2G66_Q100
Product data sheet
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Bilateral switch
10.1 Test circuits
VCC
VCC
nE
VIL
nZ
VI
nE
VIH
nY
IS
GND
IS
nZ
nY
GND
VI
VO
VO
001aag488
001aag489
VI = VCC or GND and VO = GND or VCC.
Fig 5.
VI = VCC or GND and VO = open circuit.
Test circuit for measuring OFF-state leakage
current
Fig 6.
Test circuit for measuring ON-state leakage
current
10.2 ON resistance
Table 8.
ON resistance
At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graphs see Figure 8 to Figure 13.
Symbol
Parameter
RON(peak) ON resistance
(peak)
RON(rail)
ON resistance
(rail)
40 C to +85 C
Conditions
40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
ISW = 4 mA;
VCC = 1.65 V to 1.95 V
-
34.0
130
-
195

ISW = 8 mA; VCC = 2.3 V to 2.7 V
-
12.0
30
-
45

VI = GND to VCC; see Figure 7
ISW = 12 mA; VCC = 2.7 V
-
10.4
25
-
38

ISW = 24 mA; VCC = 3.0 V to 3.6 V
-
7.8
20
-
30

ISW = 32 mA; VCC = 4.5 V to 5.5 V
-
6.2
15
-
23

ISW = 4 mA;
VCC = 1.65 V to 1.95 V
-
8.2
18
-
27

ISW = 8 mA; VCC = 2.3 V to 2.7 V
-
7.1
16
-
24

ISW = 12 mA; VCC = 2.7 V
-
6.9
14
-
21

ISW = 24 mA; VCC = 3.0 V to 3.6 V
-
6.5
12
-
18

ISW = 32 mA; VCC = 4.5 V to 5.5 V
-
5.8
10
-
15

ISW = 4 mA;
VCC = 1.65 V to 1.95 V
-
10.4
30
-
45

ISW = 8 mA; VCC = 2.3 V to 2.7 V
-
7.6
20
-
30

ISW = 12 mA; VCC = 2.7 V
-
7.0
18
-
27

ISW = 24 mA; VCC = 3.0 V to 3.6 V
-
6.1
15
-
23

ISW = 32 mA; VCC = 4.5 V to 5.5 V
-
4.9
10
-
15

VI = GND; see Figure 7
VI = VCC; see Figure 7
74LVC2G66_Q100
Product data sheet
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Bilateral switch
Table 8.
ON resistance …continued
At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graphs see Figure 8 to Figure 13.
Symbol
Parameter
RON(flat)
ON resistance
(flatness)
40 C to +85 C
Conditions
40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
ISW = 4 mA;
VCC = 1.65 V to 1.95 V
-
26.0
-
-
-

ISW = 8 mA; VCC = 2.3 V to 2.7 V
-
5.0
-
-
-

ISW = 12 mA; VCC = 2.7 V
-
3.5
-
-
-

ISW = 24 mA; VCC = 3.0 V to 3.6 V
-
2.0
-
-
-

ISW = 32 mA; VCC = 4.5 V to 5.5 V
-
1.5
-
-
-

[2]
VI = GND to VCC
[1]
Typical values are measured at Tamb = 25 C and nominal VCC.
[2]
Flatness is defined as the difference between the maximum and minimum value of ON resistance measured at identical VCC and
temperature.
10.3 ON resistance test circuit and graphs
mna673
40
RON
(Ω)
30
VSW
(1)
20
VCC
nE
VIH
(2)
(3)
nY
10
nZ
(4)
VI
GND
(5)
ISW
0
0
1
2
3
4
5
VI (V)
001aag490
RON = VSW/ISW.
(1) VCC = 1.8 V.
(2) VCC = 2.5 V.
(3) VCC = 2.7 V.
(4) VCC = 3.3 V.
(5) VCC = 5.0 V.
Fig 7.
Test circuit for measuring ON resistance
74LVC2G66_Q100
Product data sheet
Fig 8.
Typical ON resistance as a function of input
voltage; Tamb = 25 C
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Bilateral switch
001aaa712
55
001aaa708
15
RON
(Ω)
RON
(Ω)
45
13
35
11
(4)
(3)
(2)
(1)
(1)
(2)
25
9
(3)
(4)
15
7
5
5
0
0.4
0.8
1.2
1.6
2.0
0
0.5
1.0
1.5
2.0
VI (V)
(1) Tamb = 125 C.
(1) Tamb = 125 C.
(2) Tamb = 85 C.
(2) Tamb = 85 C.
(3) Tamb = 25 C.
(3) Tamb = 25 C.
(4) Tamb = 40 C.
(4) Tamb = 40 C.
Fig 9.
ON resistance as a function of input voltage;
VCC = 1.8 V
001aaa709
13
2.5
VI (V)
Fig 10. ON resistance as a function of input voltage;
VCC = 2.5 V
001aaa710
10
RON
(Ω)
RON
(Ω)
11
8
(1)
(1)
9
(2)
(2)
6
(3)
(3)
7
(4)
(4)
5
4
0
0.5
1.0
1.5
2.0
2.5
3.0
VI (V)
0
1
(1) Tamb = 125 C.
(2) Tamb = 85 C.
(2) Tamb = 85 C.
(3) Tamb = 25 C.
(3) Tamb = 25 C.
(4) Tamb = 40 C.
(4) Tamb = 40 C.
74LVC2G66_Q100
Product data sheet
3
4
VI (V)
(1) Tamb = 125 C.
Fig 11. ON resistance as a function of input voltage;
VCC = 2.7 V
2
Fig 12. ON resistance as a function of input voltage;
VCC = 3.3 V
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Bilateral switch
001aaa711
7
RON
(Ω)
6
5
(1)
(2)
(3)
4
(4)
3
0
1
2
3
4
5
VI (V)
(1) Tamb = 125 C.
(2) Tamb = 85 C.
(3) Tamb = 25 C.
(4) Tamb = 40 C.
Fig 13. ON resistance as a function of input voltage; VCC = 5.0 V
11. Dynamic characteristics
Table 9.
Dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Figure 16.
Symbol Parameter
tpd
40 C to +85 C
Conditions
Min
Max
Min
Max
VCC = 1.65 V to 1.95 V
-
0.8
2.0
-
3.0
ns
VCC = 2.3 V to 2.7 V
-
0.4
1.2
-
2.0
ns
VCC = 2.7 V
-
0.4
1.0
-
1.5
ns
VCC = 3.0 V to 3.6 V
-
0.3
0.8
-
1.5
ns
-
0.2
0.6
-
1.0
ns
VCC = 1.65 V to 1.95 V
1.0
4.6
10
1.0
13.0
ns
VCC = 2.3 V to 2.7 V
1.0
2.7
5.6
1.0
7.5
ns
VCC = 2.7 V
1.0
2.7
5.0
1.0
6.5
ns
VCC = 3.0 V to 3.6 V
1.0
2.4
4.4
1.0
6.0
ns
VCC = 4.5 V to 5.5 V
1.0
1.8
3.9
1.0
5.0
ns
propagation delay nY to nZ or nZ to nY;
see Figure 14
enable time
74LVC2G66_Q100
Product data sheet
Unit
[2][3]
VCC = 4.5 V to 5.5 V
ten
40 C to +125 C
Typ[1]
[4]
nE to nY or nZ;
see Figure 15
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Bilateral switch
Table 9.
Dynamic characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Figure 16.
Symbol Parameter
tdis
CPD
disable time
power dissipation
capacitance
40 C to +85 C
Conditions
40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
VCC = 1.65 V to 1.95 V
1.0
3.8
9.0
1.0
11.5
ns
VCC = 2.3 V to 2.7 V
1.0
2.1
5.5
1.0
7.0
ns
VCC = 2.7 V
1.0
3.5
6.5
1.0
8.5
ns
VCC = 3.0 V to 3.6 V
1.0
3.0
6.0
1.0
8.0
ns
VCC = 4.5 V to 5.5 V
1.0
2.2
5.0
1.0
6.5
ns
[5]
nE to nY or nZ; see
Figure 15
[6]
CL = 50 pF; fi = 10 MHz;
VI = GND to VCC
VCC = 2.5 V
-
9.0
-
-
-
pF
VCC = 3.3 V
-
11.0
-
-
-
pF
VCC = 5.0 V
-
15.7
-
-
-
pF
[1]
Typical values are measured at Tamb = 25 C and nominal VCC.
[2]
tpd is the same as tPLH and tPHL.
[3]
Propagation delay is the calculated RC time constant of the typical ON resistance of the switch and the specified capacitance when
driven by an ideal voltage source (zero output impedance).
[4]
ten is the same as tPZH and tPZL.
[5]
tdis is the same as tPLZ and tPHZ.
[6]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + {(CL + CS(ON)) VCC2  fo} where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
CS(ON) = maximum ON-state switch capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
{(CL + CS(ON)) VCC2  fo} = sum of the outputs.
11.1 Waveforms and test circuit
VI
nY or nZ
input
VM
VM
GND
t PLH
t PHL
VOH
nZ or nY
output
VM
VM
VOL
001aaa541
Measurement points are given in Table 10.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 14. Input (nY or nZ) to output (nZ or nY) propagation delays
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Bilateral switch
VI
nE input
VM
GND
t PLZ
t PZL
VCC
output
LOW-to-OFF
OFF-to-LOW
nY or nZ
VM
VX
VOL
t PZH
t PHZ
nY or nZ
output
HIGH-to-OFF
OFF-to-HIGH
VOH
VY
VM
GND
switch
enabled
switch
disabled
switch
enabled
001aaa542
Measurement points are given in Table 10.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 15. Enable and disable times
Table 10.
Measurement points
Supply voltage
Input
Output
VCC
VM
VM
VX
VY
1.65 V to 1.95 V
0.5  VCC
0.5  VCC
VOL + 0.15 V
VOH  0.15 V
2.3 V to 2.7 V
0.5  VCC
0.5  VCC
VOL + 0.15 V
VOH  0.15 V
2.7 V
1.5 V
1.5 V
VOL + 0.3 V
VOH  0.3 V
3.0 V to 3.6 V
1.5 V
1.5 V
VOL + 0.3 V
VOH  0.3 V
4.5 V to 5.5 V
0.5  VCC
0.5  VCC
VOL + 0.3 V
VOH  0.3 V
74LVC2G66_Q100
Product data sheet
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Bilateral switch
tW
VI
90 %
negative
pulse
VM
VM
10 %
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
VM
VM
10 %
0V
tW
VEXT
VCC
PULSE
GENERATOR
VI
RL
VO
DUT
RT
CL
RL
001aae235
Test data is given in Table 11.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = Test voltage for switching times.
Fig 16. Test circuit for measuring switching times
Table 11.
Test data
Supply voltage
Input
VCC
VI
tr, tf
CL
RL
tPLH, tPHL
tPZH, tPHZ
tPZL, tPLZ
1.65 V to 1.95 V
VCC
 2.0 ns
30 pF
1 k
open
GND
2  VCC
2.3 V to 2.7 V
VCC
 2.0 ns
30 pF
500 
open
GND
2  VCC
2.7 V
2.7 V
 2.5 ns
50 pF
500 
open
GND
6V
3.0 V to 3.6 V
2.7 V
 2.5 ns
50 pF
500 
open
GND
6V
4.5 V to 5.5 V
VCC
 2.5 ns
50 pF
500 
open
GND
2  VCC
74LVC2G66_Q100
Product data sheet
Load
VEXT
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11.2 Additional dynamic characteristics
Table 12. Additional dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 C.
Symbol Parameter
Conditions
THD
RL = 10 k; CL = 50 pF; fi = 1 kHz; see Figure 17
total harmonic distortion
Min
Typ
Max
Unit
VCC = 1.65 V
-
0.032
-
%
VCC = 2.3 V
-
0.008
-
%
VCC = 3.0 V
-
0.006
-
%
VCC = 4.5 V
-
0.005
-
%
VCC = 1.65 V
-
0.068
-
%
VCC = 2.3 V
-
0.009
-
%
VCC = 3.0 V
-
0.008
-
%
VCC = 4.5 V
-
0.006
-
%
VCC = 1.65 V
-
135
-
MHz
VCC = 2.3 V
-
145
-
MHz
VCC = 3.0 V
-
150
-
MHz
VCC = 4.5 V
-
155
-
MHz
VCC = 1.65 V
-
200
-
MHz
VCC = 2.3 V
-
350
-
MHz
VCC = 3.0 V
-
410
-
MHz
VCC = 4.5 V
-
440
-
MHz
RL = 10 k; CL = 50 pF; fi = 10 kHz; see Figure 17
f(3dB)
3 dB frequency response
RL = 600 ; CL = 50 pF; see Figure 18
RL = 50 ; CL = 10 pF; see Figure 18
RL = 50 ; CL = 5 pF; see Figure 18
iso
isolation (OFF-state)
VCC = 1.65 V
-
> 500
-
MHz
VCC = 2.3 V
-
> 500
-
MHz
VCC = 3.0 V
-
> 500
-
MHz
VCC = 4.5 V
-
> 500
-
MHz
VCC = 1.65 V
-
46
-
dB
VCC = 2.3 V
-
46
-
dB
VCC = 3.0 V
-
46
-
dB
VCC = 4.5 V
-
46
-
dB
VCC = 1.65 V
-
37
-
dB
VCC = 2.3 V
-
37
-
dB
VCC = 3.0 V
-
37
-
dB
VCC = 4.5 V
-
37
-
dB
RL = 600 ; CL = 50 pF; fi = 1 MHz; see Figure 19
RL = 50 ; CL = 5 pF; fi = 1 MHz; see Figure 19
74LVC2G66_Q100
Product data sheet
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Table 12. Additional dynamic characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 C.
Symbol Parameter
Conditions
Vct
between digital inputs and switch; RL = 600 ;
CL = 50 pF; fi = 1 MHz; tr = tf = 2 ns; see Figure 20
Xtalk
crosstalk voltage
crosstalk
Min
Typ
Max
Unit
VCC = 1.65 V
-
-
-
mV
VCC = 2.3 V
-
91
-
mV
VCC = 3.0 V
-
119
-
mV
VCC = 4.5 V
-
205
-
mV
VCC = 1.65 V
-
-
-
dB
VCC = 2.3 V
-
56
-
dB
VCC = 3 V
-
56
-
dB
VCC = 4.5 V
-
56
-
dB
between switches; RL = 600 ; CL = 50 pF;
fi = 1 MHz; see Figure 21
between switches; RL = 50 ; CL = 5 pF;
fi = 1 MHz; see Figure 21
Qinj
charge injection
74LVC2G66_Q100
Product data sheet
VCC = 1.65 V
-
-
-
dB
VCC = 2.3 V
-
29
-
dB
VCC = 3 V
-
28
-
dB
VCC = 4.5 V
-
28
-
dB
VCC = 1.8 V
-
3.3
-
pC
VCC = 2.5 V
-
4.1
-
pC
VCC = 3.3 V
-
5.0
-
pC
VCC = 4.5 V
-
6.4
-
pC
VCC = 5.5 V
-
7.5
-
pC
CL = 0.1 nF; Vgen = 0 V; Rgen = 0 ; fi = 1 MHz;
RL = 1 M; see Figure 22
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11.3 Test circuits
VCC
0.5VCC
nE
VIH
RL
nY/nZ
10 μF
nZ/nY
VO
600 Ω
fi
D
CL
001aag492
Test conditions:
VCC = 1.65 V: Vi = 1.4 V (p-p).
VCC = 2.3 V: Vi = 2 V (p-p).
VCC = 3 V: Vi = 2.5 V (p-p).
VCC = 4.5 V: Vi = 4 V (p-p).
Fig 17. Test circuit for measuring total harmonic distortion
VCC
nE
VIH
0.1 μF
fi
0.5VCC
RL
nY/nZ
nZ/nY
VO
50 Ω
CL
dB
001aag491
To obtain 0 dBm level at output, adjust fi voltage. Increase fi frequency until dB meter reads 3 dB.
Fig 18. Test circuit for measuring the frequency response when switch is in ON-state
0.5VCC
VCC
RL VIL
0.1 μF
fi
0.5VCC
nE
nY/nZ
RL
nZ/nY
50 Ω
VO
CL dB
001aag493
To obtain 0 dBm level at intput, adjust fi voltage.
Fig 19. Test circuit for measuring isolation (OFF-state)
74LVC2G66_Q100
Product data sheet
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Bilateral switch
VCC
nE
nY/nZ
G
logic
input
50 Ω
nZ/nY
600 Ω
VO
RL
0.5VCC
CL
0.5VCC
001aag494
Fig 20. Test circuit for measuring crosstalk voltage (between digital inputs and switch)
0.5VCC
1E
VIH
0.1 μF
Ri
1Y or 1Z
600 Ω
fi
RL
1Z or 1Y
CHANNEL
ON
50 Ω
CL
50 pF
VO1
0.5VCC
2E
VIL
RL
2Y or 2Z
2Z or 2Y
CHANNEL
OFF
Ri
600 Ω
CL
50 pF
VO2
001aag496
20 log10 (VO2 / VO1) or 20 log10 (VO1 / VO2).
Fig 21. Test circuit for measuring crosstalk between switches
74LVC2G66_Q100
Product data sheet
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Bilateral switch
VCC
nE
Rgen
G
logic
input
nY/nZ
nZ/nY
VO
RL
1 MΩ
Vgen
CL
0.1 nF
001aag495
a. Test circuit
logic
input (nE)
off
on
off
ΔVO
VO
mna675
b. Input and output pulse definitions
Qinj = VO  CL.
VO = output voltage variation.
Rgen = generator resistance.
Vgen = generator voltage.
Fig 22. Test circuit for measuring charge injection
74LVC2G66_Q100
Product data sheet
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Bilateral switch
12. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
D
E
A
SOT505-2
X
c
HE
y
v M A
Z
5
8
A
A2
(A3)
A1
pin 1 index
θ
Lp
L
1
4
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.15
0.00
0.95
0.75
0.25
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
0.65
4.1
3.9
0.5
0.47
0.33
0.2
0.13
0.1
0.70
0.35
8°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT505-2
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-01-16
---
Fig 23. Package outline SOT505-2 (TSSOP8)
74LVC2G66_Q100
Product data sheet
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Bilateral switch
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
D
E
SOT765-1
A
X
c
y
HE
v M A
Z
5
8
Q
A
A2
A1
pin 1 index
(A3)
θ
Lp
1
4
e
L
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(2)
e
HE
L
Lp
Q
v
w
y
Z(1)
θ
mm
1
0.15
0.00
0.85
0.60
0.12
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
0.4
0.40
0.15
0.21
0.19
0.2
0.13
0.1
0.4
0.1
8°
0°
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT765-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
02-06-07
MO-187
Fig 24. Package outline SOT765-1 (VSSOP8)
74LVC2G66_Q100
Product data sheet
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Bilateral switch
13. Abbreviations
Table 13.
Abbreviations
Acronym
Description
CMOS
Complementary Metal-Oxide Semiconductor
TTL
Transistor-Transistor Logic
HBM
Human Body Model
ESD
ElectroStatic Discharge
MIL
Military
MM
Machine Model
DUT
Device Under Test
14. Revision history
Table 14.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVC2G66_Q100 v.1
20130416
Product data sheet
-
-
74LVC2G66_Q100
Product data sheet
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15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74LVC2G66_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 16 April 2013
© NXP B.V. 2013. All rights reserved.
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No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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Product data sheet
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Bilateral switch
17. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
10.1
10.2
10.3
11
11.1
11.2
11.3
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 6
ON resistance test circuit and graphs. . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms and test circuit . . . . . . . . . . . . . . . 10
Additional dynamic characteristics . . . . . . . . . 13
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 21
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 21
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Contact information. . . . . . . . . . . . . . . . . . . . . 22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 16 April 2013
Document identifier: 74LVC2G66_Q100