Low Power Bluetooth Module (supporting CSRmesh) (supporting CS LLC ABBTM- NVC-MDCS71-MESH FCC ID: OC3BM1871 DC: 1508 ABBTM-NVC-MDCS71-MESH FEATURES: Pb RoHS/RoHS II compliant RoHS 19.5 x 12.5 x 2.4 mm SMT Moisture Sensitivity Level (MSL) – Level 3 | | | | | | | | | | | | | | | APPLICATIONS: • Single mode Bluetooth v4.1 low energy Typical Bluetooth low energy applications: • 4dBm maximum TX power/ -92.5dBm RX sensitivity, • IoT applications RSSI monitoring for proximity applications • Smart Home applications • Support CSRmesh. • UART/I2C master/SPI master interfaces • 9 digital PIOs/3 analog IOs • 10bit ADC IOs • Wakeup interrupt and watchdog timer • SMT pads for easy and reliable PCB mounting, Internal chip antenna • 19.50x12.50x2.4mm • FCC ID: OC3BM1871* • QDID: B020997* *Note: ABBTM-NVC-MDCS71-MESH crosses to NovaComm P/N: NVC-MDCS71. BQB/FCC certification documentation is under P/N: NVC-MDCS71. GENERAL DESCRIPTION ABBTM-NVC-MDCS71-MESH is a single-mode Bluetooth v4.1 low power module based on CSR’s CSR1010. By integrating CSRmesh and Novacomm’s proprietary technologies into the single module, it provides a simple solution for building intelligent network so devices can communicate with each other directly. CSRmesh supports different device models. Current firmware combines light model (e.g. LED lights) and data model together. It allows the module to be used in a color LED light, or as a network endpoint to transmit data to each other. The module uses an ASCII command interface over its 2 wire UART port. The command details can be found in the Software Interface for Mesh Application Manual. Current firmware allows the module to scan for data packets from nearby devices and relay the data if needed. It consumes approximately 20mA @3V, so it is suitable for applications with power supply connected. If low power consumption operation mode is needed, please contact Abracon for custom firmware. PIN CONFIGURATION: Figure 1. Pinout (Topview) ABRACON IS ISO 9001:2008 CERTIFIED LLC 2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15 Ph. 949.546.8000 | Fax. 949.546.8001 Visit www.abracon.com for Terms and Conditions of Sale Rmesh) Low Power Bluetooth Module (supporting CSRmesh) (supporting CS LLC ABBTM- NVC-MDCS71-MESH FCC ID: OC3BM1871 DC: 1508 ABBTM-NVC-MDCS71-MESH Pb RoHS RoHS/RoHS II compliant 19.5 x 12.5 x 2.4 mm SMT | | | | | | | | | | | | | | | PIN DESCRIPTION Pin Symbol 1 2 3 4 GND AIO2 AIO1 AIO0 5 UART_TX 6 UART_RX 7 PIO3 8 PIO4 9 GND 10 PIO5/SPI_CLK Bi-directional with programmable strength internal pull-up/down Programmable input/output line Or debug SPI_CLK select by SPI_PIO_SEL 11 PIO6/SPI_CSB Bi-directional with programmable strength internal pull-up/down Programmable input/output line Or debug chip select, selected by SPI_PIO_SEL 12 PIO7/SPI_MOSI Bi-directional with programmable strength internal pull-up/down Programmable input/output line Or debug SPI_MOSI, selected by SPI_PIO_SEL 13 VDD_PIO Powered PIO power supply Bi-directional with programmable strength internal pull-up/down Bi-directional tri-state with weak internal pull-up Programmable input/output line Or debug SPI_MISO, selected by SPI_PIO_SEL I2C data input/output or SPI serial flash data output(SF_OUT) I2C clock or SPI serial flash clock output (SF_CLK) Ground Programmable input/output line PWM or LED Controls Programmable input/output line PWM or LED Controls 14 PIO8/SPI_MISO 15 I2C_SDA 16 I2C_SCL 17 GND 18 PIO9 19 PIO10 20 PIO11 21 22 23 SPI_PIO_SEL VDD_BAT GND 24 WAKE 25 GND ABRACON IS ISO 9001:2008 CERTIFIED I/O Type Description Ground Bidirectional analogue Bidirectional analogue Bidirectional analogue CMOS output, tri-state, with weak internal pull-up CMOS input with weak internal pulldown Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Ground Ground 10bit Analogue programmable I/O line 10bit Analogue programmable I/O line 10bit Analogue programmable I/O line UART data output UART data input Programmable input/output line PWM or LED Controls Programmable input/output line PWM or LED Controls Ground Input with weak internal pull-up Ground Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down Input with strong internal pull-down Power supply Ground Input has no internal pull-up or pull-down use external pull-down Ground LLC Programmable input/output line Selects SPI debug on (8:5) Button cell battery or DC 1.8V to 3.6V Ground Set high to wake the module from hibernate. Use an external pull-down for this pin. Ground 2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15 Ph. 949.546.8000 | Fax. 949.546.8001 Visit www.abracon.com for Terms and Conditions of Sale Rmesh) Low(supporting Power Bluetooth CSRmesh) Module (supporting CSRmesh) ABBTM-NVC-MDCS71-MESH Pb LLC ABBTM- NVC-MDCS71-MESH FCC ID: OC3BM1871 DC: 1508 RoHS RoHS/RoHS II compliant 19.5 x 12.5 x 2.4 mm SMT | | | | | | | | | | | | | | | ELECTRICAL CHARACTERISTICS Absolute Maximum Rating Rating Min Max Unit Storage Temperature -40 +85 °C Battery (VDD_BAT) operation* 1.8 3.6 V I/O supply voltage -0.4 +3.6 V Vss-0.4 VDD+0.4 V Other Terminal Voltages except RF * Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V. Recommended Operating Conditions Operating Condition Operating Temperature Range Min -30 Battery (VDD_BAT) operation I/O Supply Voltage (VDD_PIO) Typ Max +85 Unit °C 1.8 +3.6 V 1.2 +3.6 V Power Consumptions The current consumption are measured at the VDD_BAT. Mode Description Total typical current at 3V (average) Fast Advertising All functions are shutdown. To wake up toggle the WAKE pin All functions are shutdown except for the sleep clock. The module can wake up on a timer on the sleep clock. In 30 second after Power on VDD=3.3V Slow Advertising In 3 minutes after fast advertising VDD=3.3V 6uA Standby (no connect) VDD=3.3V ,VDD_PIO=3.3v 5uA Standby (connect) VDD=3.3V ,VDD_PIO=3.3v 8uA Transmit data VDD=3.3V VDD_PIO=3.3V 1mA RF RX /TX active (0dBm) * VDD=3.3V VDD_PIO=3.3V ~16mA peak Dormant Hibernate <600nA <1.5uA 0.8mA * Note: The TX power of the module can be increased by firmware to a maximum of 4dBm and the peak current is around 28mA. ABRACON IS ISO 9001:2008 CERTIFIED LLC 2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15 Ph. 949.546.8000 | Fax. 949.546.8001 Visit www.abracon.com for Terms and Conditions of Sale Low Power Bluetooth Module (supporting CSRmesh) ABBTM-NVC-MDCS71-MESH Pb LLC ABBTM- NVC-MDCS71-MESH FCC ID: OC3BM1871 DC: 1508 RoHS RoHS/RoHS II compliant 19.5 x 12.5 x 2.4 mm SMT | | | | | | | | | | | | | | | I/O CHARACTERISTICS Digital I/O Characteristics Supply Voltage Levels Min Typ Max Unit Input Voltage Levels VIL input logic level low -0.4 0.4 V VIH input logic level high 0.7*VDD VDD + 0.4 V 25 ns 0.4 V Tr/Tf Output Voltage Levels VOL output logic level low, IOL = 4.0mA VOH output logic level high, IOH = -4.0mA 0.75*VDD V Tr/Tf 5 ns Input and Tri-state Current With strong pull-up -150 -40 -10 μA With strong pull-down 10 40 150 μA With weak pull-up -5.0 -1.0 -0.33 μA With weak pull-down 0.33 +1.0 5.0 μA CI Input Capacitance 1.0 5.0 pF Max 1.3 Unit V AIO Characteristics Input Voltage Levels AIO Min 0 Typ ESD Protection Condition Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114 Class 2 Max Rating 2000V (all pins) Machine Model Contact Discharge per JEDEC EIA/JESD22-A115 200V 200V (all pins) III 500V (all pins) Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 ABRACON IS ISO 9001:2008 CERTIFIED LLC 2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15 Ph. 949.546.8000 | Fax. 949.546.8001 Visit www.abracon.com for Terms and Conditions of Sale Low Power Bluetooth Module (supporting CSRmesh) Pb LLC ABBTM- NVC-MDCS71-MESH FCC ID: OC3BM1871 DC: 1508 RoHS RoHS/RoHS II compliant 19.5 x 12.5 x 2.4 mm SMT | | | | | | | | | | | | | | | PHYSICAL INTERFACES Power Supply The m le integrates internal reg lators. It can be easil powered capacitor at pin VDD_BAT. Internal Antenna connecting a 3V coin batter with a >100 F Figure 2. Capacitor at pin VDD_BAT The m le integrates an on-board chip antenna. There s no need to se external antenna on ta e preca tion to lea e ample clearance for the antenna PIO IOs are pro ided 4 are m ltiplexed with S I deb g interface . The are powered from VDD IO lines are software-config rable as wea ll- ll-down, strong wea ll- or strong stomer s CB. ease IO. ll-down. AIO 3 AIOs are pro ided. The can be connected to internal 10 bits ADC. Depending on the software, the can be sed to read or o tp t a oltage between 0V to 1.3V. Each of them can be also sed as a digital o t t with special firmware. PWM IO3, IO4, IO9, IO10 can be dri en b internal M m le. The M m le also wor s while the m is sleep. Therefore it can be sed as a ED flasher. These f ctions are controlled b special firmwares. le UART This m le has a standard. UART interface which pro ides a simple mechanism for comm icating with other serial de ices sing the RS232 protocol. The UART CTS and RTS signals can be assigned to an IO pin b the on-chip firmware. Possible UART Settings Parameter B te Possible Values Minim m Maxim Flow Control rit N mber of Stop Bits Bits per B te ABRACON IS ISO 9001:2008 CERTIFIED LLC 1200 ba d 2%Error 9600 ba d 1%Error 2M ba d 1%Error RT CTS or None None, Odd or E en 1 or 2 8 2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15 Ph. 949.546.8000 | Fax. 949.546.8001 Visit www.abracon.com for Terms and Conditions of Sale Low Power Bluetooth Module (supporting CSRmesh) Pb LLC ABBTM- NVC-MDCS71-MESH FCC ID: OC3BM1871 DC: 1508 RoHS RoHS/RoHS II compliant 19.5 x 12.5 x 2.4 mm SMT | | | | | | | | | | | | | | | PHYSICAL INTERFACES I2C Master The m le can act as an I2C master when config red b software. An two IOs can be config red as I2C_SC and I2C_SDA. SPI Master The m le can act as an S I master mode 0 when config red b software. An f S I_C K, S I_CS#, S I_DIN and S I_DOUT. The cloc rate of the software S I is ar SPI Debug r IOs can be config red as z. The S I D g interface is chosen when S I_ IO_SE is high. The interface is sed to program and So alwa s place test points or header CB for this interface and S I_ IO_SE . g the m le. SOFTWARE STACK ABBTM-NVC-MDCS71is a single mode Bl tooth 4.1 m le. It integrates CSRmesh and acomm s sers can access mesh f nctions easil ia the UART interface of the m le. proprietar control interface together iNovaMESH Stack No a comm Control Inte rfa ce CS Rme sh ight Mode l Da ta Mode l Mesh Association Mes h Control rotocol Mesh Tra ns port a e r Bl e tooth S ma rt Figure 3. iNovaMESH Stack REFERENCE DESIGN Figure 4. Reference Design ABRACON IS ISO 9001:2008 CERTIFIED LLC 2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15 Ph. 949.546.8000 | Fax. 949.546.8001 Visit www.abracon.com for Terms and Conditions of Sale Low Power Bluetooth Module (supporting CSRmesh) ABBTM-NVC-MDCS71-MESH Pb LLC ABBTM- NVC-MDCS71-MESH FCC ID: OC3BM1871 DC: 1508 RoHS RoHS/RoHS II compliant 19.5 x 12.5 x 2.4 mm SMT | | | | | | | | | | | | | | | LAYOUT AND SOLDERING Soldering Recommendations . ABBTM-NVC-MDCS71 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Please refer to the datasheet of the particular solder paste for profile configurations. The following are recommended for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as reference only. • Refer to technical documentations of particular solder paste for profile configurations • Avoid using more than one flow. • Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150µm stencil thickness is recommended. • Aperture size of the stencil should be 1:1 with the pad size. • A low residue, “no clean” solder paste should be used due to low mounted height of the component. REFLOW PROFILE Figure 5. Typical Lead-Free Reflow Solder Profile for ABBTM-NVC-MDCS71 Key features of the profile: ABRACON IS ISO 9001:2008 CERTIFIED • Initial Ramp = 1-2.5°C/sec to 175°C ±25°C equilibrium • Equilibrium time = 60 to 180 seconds • Ramp to Maximum temperature (250°C) = 3°C/sec max. • Time above liquidus temperature (217°C): 45-90 seconds • Device absolute maximum reflow temperature: 255°C LLC 2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15 Ph. 949.546.8000 | Fax. 949.546.8001 Visit www.abracon.com for Terms and Conditions of Sale Low Power Bluetooth Module (supporting CSRmesh) ABBTM-NVC-MDCS71-MESH Pb RoHS/RoHS II compliant LLC ABBTM- NVC-MDCS71-MESH FCC ID: OC3BM1871 DC: 1508 RoHS 19.5 x 12.5 x 2.4 mm SMT | | | | | | | | | | | | | | | PHYSICAL INTERFACES Layout Guideline . It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias separated maximum 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an unintentional resonator. Use GND vias all around the PCB edges. Figure 4 illustrates recommended PCB design around the antenna of ABBTM-NVC-MDCS71 when the module is placed at the edge of a PCB. Do not place copper on the top layer under the module, as shown in Figure 6. The module has vias on the area shown, which can cause short circuit if there is copper underneath. Any metal placed closer than 20 mm in any direction from the antenna changes the matching properties and thus will considerably deteriorate the RF performance of the module. Figure 6. Placement of the Module on a Main Board ABRACON IS ISO 9001:2008 CERTIFIED LLC 2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15 Ph. 949.546.8000 | Fax. 949.546.8001 Visit www.abracon.com for Terms and Conditions of Sale Low Power Bluetooth Module (supporting CSRmesh) Pb LLC ABBTM- NVC-MDCS71-MESH FCC ID: OC3BM1871 DC: 1508 RoHS RoHS/RoHS II compliant 19.5 x 12.5 x 2.4 mm SMT | | | | | | | | | | | | | | | OUTLINE DIMENSIONS Recommended Land Pattern in 1 . in 1 in 25 in 25 Dimensions: mm TAPE & REEL: 80pcs/tray Dimensions: mm ATTENTION: Abracon Corporation s prod s are COTS – Commercial-Off-The-Shelf prod s; itable for Commercial, trial and, where designated, tomo Applicadesigned for Militar , A on, Aerospace, fe-dependant Medical applications or an application re iring high reliab where tions. Abracon s prod cts are not specif component fail e res in loss of life r propert . For applications re iring high reliabilit and or presenting an extreme operating ronment, written consent and rization from Abracon Corporation is req ire lease contact Abracon Corporation for more information. ABRACON IS ISO 9001:2008 CERTIFIED LLC 2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15 Ph. 949.546.8000 | Fax. 949.546.8001 Visit www.abracon.com for Terms and Conditions of Sale