LGA Package 21-Lead (6.25mm × 6.25mm × 2.32mm) (Reference LTC DWG # 05-08-1803 Rev B) 6.250 BSC aaa Z X 5.080 2.22 – 2.42 Y SEE NOTES 7 0.605 – 0.665 5 4 0.605 – 0.665 6.250 BSC MOLD CAP SUBSTRATE 0.27 – 0.37 3 DETAIL A PACKAGE SIDE VIEW 2.5400 1.2700 0.0000 1.2700 C(0.30) PAD 1 1 PADS SEE NOTES PACKAGE TOP VIEW 2.5400 1.27O BSC DETAIL A aaa Z 4 2 Z bbb Z 1.95 – 2.05 PAD 1 CORNER 3 5.080 BSC E D C B A BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2.5400 2. ALL DIMENSIONS ARE IN MILLIMETERS 1.5875 1.2700 0.9525 0.0000 3 LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE LTMXXXXXX µModule 6. THE TOTAL NUMBER OF PADS: 21 7 1.2700 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 0.3175 0.0000 0.3175 2.5400 SUGGESTED PCB LAYOUT TOP VIEW COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 21 0113 REV B