LGA Package 28-Lead (15mm × 9mm × 2.82mm) (Reference LTC DWG # 05-08-1824 Rev A) SEE NOTES DETAIL A 2.69 – 2.95 7 aaa Z 7 6 5 4 3 2 1 PAD 1 A PAD “A1” CORNER B 4 C D E 15.00 BSC 12.70 BSC MOLD CAP F G SUBSTRATE H 0.290 – 0.350 2.400 – 2.600 J Z bbb Z DETAIL B K L aaa Z 0.630 ±0.025 Ø 28x X 9.00 BSC eee S X Y Y DETAIL B 3.810 2.540 1.270 0.000 1.270 2.540 PACKAGE TOP VIEW 3.810 7.620 BSC 1.27 BSC PADS SEE NOTES 3 PACKAGE BOTTOM VIEW DETAIL A 6.350 5.080 0.000 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 LAND DESIGNATION PER JESD MO-222 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE COMPONENT PIN “A1” LTMXXXXXX µModule 6. THE TOTAL NUMBER OF PADS: XX 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SUGGESTED PCB LAYOUT TOP VIEW PACKAGE IN TRAY LOADING ORIENTATION LGA 28 0113 REV A 5.080 6.350 TRAY PIN 1 BEVEL SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05