LGA Package 35-Lead (11.25mm × 6.25mm × 2.82mm) (Reference LTC DWG # 05-08-1805 Rev B) 11.250 BSC aaa Z X 8.890 BSC 0.605 – 0.665 PADS SEE NOTES 2.72 – 2.92 Y SEE NOTES 7 3 5 4 0.605 – 0.665 MOLD CAP 6.250 BSC SUBSTRATE Z bbb Z 3 0.27 – 0.37 2.40 – 2.60 PAD 1 CORNER 5.080 BSC DETAIL A 2 1.270 BSC 1 aaa Z PACKAGE TOP VIEW 4 H 4.445 3.175 1.905 0.635 0.0000 0.635 1.905 3.175 4.445 DETAIL A PACKAGE SIDE VIEW G F E D C B A PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 2.540 1.270 0.0000 3 LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR A MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 0.9525 1.270 1.5875 6. THE TOTAL NUMBER OF PADS: 35 7 0.9525 0.635 0.3175 2.540 SUGGESTED PCB LAYOUT TOP VIEW ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 35 0113 REV B PAD 1 C (0.30)