LGA Package 56-Lead (11.25mm × 9.00mm × 2.82mm) (Reference LTC DWG # 05-08-1825 Rev A) aaa Z 9.00 BSC Y PADS SEE NOTES 2.72 – 2.92 X SEE NOTES DETAIL A 7.62 BSC 7 3 A 0.605 – 0.665 PAD 1 CORNER MOLD CAP 4 11.25 BSC B SUBSTRATE C D 8.89 BSC 0.27 – 0.37 2.45 – 2.55 E Z DETAIL B bbb Z DIA (0.635) PAD 1 F 1.27 BSC G H aaa Z 7 PACKAGE TOP VIEW 0.630 ±0.025 SQ. 56x 5 4 3 2 1 DETAIL B 3.810 2.540 1.270 0.3175 0.3175 1.270 2.540 3.810 0.000 eee S X Y 6 PACKAGE BOTTOM VIEW DETAIL A 4.445 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 3.175 1.905 2. ALL DIMENSIONS ARE IN MILLIMETERS 0.635 0.000 0.635 3 LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 1.905 3.175 5. PRIMARY DATUM -Z- IS SEATING PLANE 4.445 LTMXXXXXX µModule COMPONENT PIN “A1” 6. THE TOTAL NUMBER OF PADS: 56 SUGGESTED PCB LAYOUT TOP VIEW 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 56 0113 REV A