LGA Package 68-Lead (15mm × 9mm × 2.82mm) (Reference LTC DWG # 05-08-1821 Rev A) SEE NOTES DETAIL A 2.72 – 2.92 G aaa Z 7 F E D C B A PAD 1 1 PAD “A1” CORNER 2 4 3 4 5 15.00 BSC MOLD CAP 12.70 BSC SUBSTRATE 6 7 0.290 – 0.350 2.200 – 2.600 8 9 Z // bbb Z DETAIL B 10 11 0.630 ±0.025 SQ. 68x X aaa Z 9.00 BSC eee S X Y DETAIL B 3.810 2.540 1.270 0.000 1.270 2.540 PACKAGE TOP VIEW 3.810 7.620 BSC Y PADS SEE NOTES 3 PACKAGE BOTTOM VIEW DETAIL A 6.350 5.080 3.810 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 2. ALL DIMENSIONS ARE IN MILLIMETERS 3 LAND DESIGNATION PER JESD MO-222 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 2.540 1.270 0.000 1.270 2.540 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. THE TOTAL NUMBER OF PADS: 68 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY 3.810 5.080 6.350 SUGGESTED PCB LAYOUT TOP VIEW 1.27 BSC SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 COMPONENT PIN “A1” TRAY PIN 1 BEVEL LTMXXXXXX µModule PACKAGE IN TRAY LOADING ORIENTATION LGA 68 1212 REV A