LGA Package 113-Lead (15mm × 15mm × 4.32mm) (Reference LTC DWG # 05-08-1756 Rev A) aaa Z 15 BSC X 4.22 – 4.42 Y SEE NOTES DETAIL A 11 10 9 8 7 6 5 4 3 2 7 1 A C(0.30) PAD 1 B C PAD 1 CORNER D 4 E 15 BSC MOLD CAP 12.70 BSC SUBSTRATE F G 0.27 – 0.37 H Z // bbb Z 3.95 – 4.05 J 1.27 BSC K DETAIL B L aaa Z PADS SEE NOTES PACKAGE TOP VIEW 3 0.635 ±0.025 SQ. 113x DETAIL A 6.350 5.080 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 3.810 2. ALL DIMENSIONS ARE IN MILLIMETERS 2.540 3 LAND DESIGNATION PER JESD MO-222, SPP-010 1.270 4 DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 0.000 1.270 6. THE TOTAL NUMBER OF PADS: 113 3.810 7 6.350 LTMXXXXXX µModule 5. PRIMARY DATUM -Z- IS SEATING PLANE 2.540 5.080 SUGGESTED PCB LAYOUT TOP VIEW PACKAGE BOTTOM VIEW DETAIL B 6.350 5.080 3.810 2.540 1.270 0.000 1.270 2.540 3.810 5.080 6.350 eee S X Y 12.70 BSC ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY SYMBOL TOLERANCE aaa 0.15 bbb 0.10 eee 0.05 COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION LGA 113 1212 REV A