UHF Package 38-Lead Plastic QFN (5mm × 7mm) (Reference LTC DWG # 05-08-1701 Rev C) 0.70 ± 0.05 5.50 ± 0.05 5.15 ± 0.05 4.10 ± 0.05 3.00 REF 3.15 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.50 BSC 5.5 REF 6.10 ± 0.05 7.50 ± 0.05 RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 ± 0.10 0.75 ± 0.05 PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° CHAMFER 3.00 REF 37 0.00 – 0.05 38 0.40 ±0.10 PIN 1 TOP MARK (SEE NOTE 6) 1 2 5.15 ± 0.10 5.50 REF 7.00 ± 0.10 3.15 ± 0.10 (UH) QFN REF C 1107 0.200 REF 0.25 ± 0.05 0.50 BSC R = 0.125 TYP R = 0.10 TYP BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE M0-220 VARIATION WHKD 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE