05-08-1862

UKK Package
Variation: UKKMA
68-Lead Plastic QFN (7mm × 12mm)
(Reference LTC DWG # 05-08-1862 Rev Ø)
0.70 ± 0.05
7.50 ± 0.05
2.35 ±0.05
0.38 REF
6.10 ± 0.05
5.50 REF
5.60 ±0.05
2.55 ±0.05
5.28 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
10.50 REF
11.10 ± 0.05
12.50 ± 0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
7.00 ± 0.10
PIN 1 NOTCH
R = 0.30 TYP OR
0.35 × 45° CHAMFER
0.75 ± 0.05
5.50 REF
67
0.00 – 0.05
68
0.40 ±0.10
PIN 1
TOP MARK
(SEE NOTE 6)
1
2
2.35 ±0.10
0.38 REF
2.55 ±0.10
12.00 ± 0.10
10.50 REF
5.28 ±0.10
5.60 ±0.10
R = 0.125
TYP
(UKK68MA) QFN 1109 REV Ø
0.200 REF
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
SIDE VIEW
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
R = 0.10
TYP