cddfn10 3324p

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PL
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Features
Applications
■ RoHS compliant*
■ HDMI 1.3, 1.4 and 2.0
■ Low capacitance - 0.04 pF
■ DisplayPort
(I/O to I/O)
■ ESD protection to IEC 61000-4-2 (Level 4)
■ Digital Visual Interface (DVI)
■ SATA and eSATA
■ USB 3.0
■ Memory protection
■ SIM card ports
CDDFN10-3324P - Surface Mount TVS Diode Array
General Information
The Model CDDFN10-3324P device provides ESD, CDE and EFT protection for
high-speed data ports, meeting IEC 61000-4-2 (ESD) requirements. The Transient
Voltage Suppressor array, protecting up to four data lines, offers a Working Peak
Reverse Voltage of 3.3 V and a Minimum Breakdown Voltage of 4.5 V.
Pin
1
Pin
2
Pin
4
Pin
5
The DFN10 packaged device has an ultra-low typical capacitance of only 0.04 pF
between I/O lines. This allows it to be used for protecting sensitive components used on
high-speed interfaces. The small footprint of the device allows for flow-through routing
on the PCB, helping to maintain matched impedances of the high-speed data lines.
Pins
3, 8
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
CDDFN10-3324P
Unit
Peak Pulse Power (tp = 8/20 μS)
Ppp
30
W
Peak Pulse Current (tp = 8/20 μS)
Ipp
4
A
Operating Temperature
TJ
-55 to +85
ºC
TSTG
-55 to +150
ºC
Storage Temperature
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Working Peak Reverse Voltage
VWM
Breakdown Voltage @ 1 mA
VBR
Leakage Current @ VWM
Min.
Typ.
Max.
Unit
3.3
V
4.5
V
IR
0.1
0.5
µA
Capacitance @ 1.65 V, f = 1 MHz
(I/O to GND)
CIN
0.45
0.65
pF
Capacitance @ 1.65 V, f = 1 MHz
(I/O to I/O)
CCROSS
0.04
0.08
pF
7.5
V
12
15
kV
Clamping Voltage @ 8/20 µs @ IPP
ESD Protection per IEC 6-1000-4-2
Contact Discharge
Air Discharge
VC
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CDDFN10-3324P - Surface Mount TVS Diode Array
Product Dimensions
Recommended Footprint
This is a molded DFN10 package with lead free 100 % Matte sn on
the lead frame. It weighs approximately 7 mg and has a flammability
rating of UL 94V-0.
PIN 1
MARKING
0.4
(.016)
0.25
(.010)
1.000 ± 0.050
(.039 ± .002)
1.55
(.061)
0.20
(.008)
0.875
(.034)
2.500 ± 0.050
(.098 ± .002)
0.675
(.027)
0.400 ± 0.050
(.016 ± .002)
0.500
BSC
(.020)
1.00
(.039)
Typical Part Marking
0.100
(.039)
R
0.400 ± 0.050
(.016 ± .002)
TYP.
0.50
(.020)
PIN 1
IDENTIFICATION
CHAMFER
0.100
X 45 °
(.039)
CDDFN10-3324P ........................................................................324
1.950
(.077)
REF.
0.075
(.003)
How to Order
CD DFN10 - 33 24 P
0.250 ± 0.050
(.010 ± .002)
Common Code
Chip Diode
0.200 ± 0.050
(.008 ± .002)
Package
DFN10 = DFN-10 Package
Working Peak Reverse Voltage
33 = 3.3 VRWM (Volts)
0.40 - 0.50
(0.016 - 0.020)
Number of Lines
24 = 2 Ground / 4 Data Lines
Suffix
P = Ultra-low Capacitance
0.152
(.006)
REF.
0.000 - 0.050
(.000 - .002)
DIMENSIONS:
MM
(INCHES)
Device Pinout
1
10
2
9
3
8
4
7
5
6
Pin
Function
1,2,4,5
Input Lines
6,7,9,10
Output Lines
(No Internal Connection)
3,8
GND
TOP VIEW
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CDDFN10-3324P - Surface Mount TVS Diode Array
Rating & Characteristic Curves
Typical Voltage vs. Capacitance CCROSS
0.8
0.10
0.7
0.09
0.08
0.6
Input Capacitance (pF)
Input Capacitance (pF)
Typical Voltage vs. Capacitance CIN
0.5
0.4
0.3
0.2
0.06
0.05
0.04
0.03
0.02
f = 1 MHz,
T = 25 °C
0.1
0.07
f = 1 MHz,
T = 25 °C
0.01
0.0
0.00
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
Input Voltage (V)
Input Voltage (V)
Typical Insertion Loss S21
Typical Analog Cross Talk
20
0
10
Analog Cross Talk (dB)
Insertion Loss (dB)
-3
-6
-9
-12
-15
-18
-21
-24
-27
3 GHz: 0.535 dB
0
-10
-20
-30
-40
-50
-60
-70
-30
-80
1e+8
1e+9
1e+8
Frequency (Hz)
1e+9
Frequency (Hz)
Transmission Line Pulsing (TLP) Current (A)
Typical Transmission Line Pulsing (TLP)
18
16
V_pulse
14
Pulse from a
transmission line
12
TLP_I
+
100 ns
10
TLP_V
-
8
6
4
VCLAMP @ 16 A = 10 V
VCLAMP @ 8 A = 7.5 V
I/O to GND
2
0
0
1
2
3
4
5
6
7
8
9
10 11 12
Transmission Line Pulsing (TLP) Voltage (V)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CDDFN10-3324P - Surface Mount TVS Diode Array
Reference Application
The Bourns® Model CDDFN10-3324P is designed to protect high-speed data ports from ESD transients. For high-speed ports above 5 Gbps
such as HDMI 2.0 and USB 3.0, maintaining signal line impedance is a critical requirement. The use of a DFN10 package using a “feedthrough” layout provides minimal impedance change on the high-speed data line, while the ultra-low capacitance performance of the device
limits signal degradation on each channel.
HDMI
CONNECTOR
TMDS_D2+
TMDS_GND
TMDS_D2TMDS_D1+
TMDS_GND
TMDS_D1-
LINE-1
1
10
LINE-2
2
9
TMDS_D0-
GND
3
8
4
7
LINE-4
5
6
TO
I/O PORT
CONNECTOR
1
2
10
9
TO
PROTECTED
IC
TMDS_CK-
TMDS_D1+
LINE-1
1
10
LINE-2
2
9
GND
3
8
TO
I/O PORT
CONNECTOR
4
5
8
7
6
TMDS_D1-
LINE-3
4
7
LINE-4
5
6
TMDS_D0+
TMDS_D0GND
TMDS_CK+
TMDS_CK-
CDDFN10-3324P
CE_REMOTE
N/C
GND
Via hole to GND
3
2
1
4
5
6
DDC_CLK
3
GND
CDDFN10-3324P
TMDS_CK+
TMDS_GND
TMDS_D2-
LINE-3
TMDS_D0+
TMDS_GND
TMDS_D2+
CE_REMOTE
DDC_CLK
CDSOT236-0504C
DDC_DAT
GND
TO
PROTECTED
IC
Model CDDFN10-3324P Layout on HDMI Port
HDMI 2.0 Eye Diagram Test
Without Model CDDFN10-3324P
(PCB Only)
+5 V
Via hole to +5 V
DDC_DAT
+5 V OUT
Via hole to GND
HOTPLUG_DET
C = 100 nF
(OPTIONAL)
HOTPLUG_DET
Feed-Through Layout Model CDDFN10-3324P in HDMI Application
HDMI 2.0 Eye Diagram Test
With Model CDDFN10-3324P
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
3312 - 2 mm SMD
Trimming
Potentiometer
CDDFN10-3324P
- Surface
Mount
TVS Diode Array
Packaging Information
The product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481-D standard.
P
0
P
1
d
T
E
Index Hole
Pin 1
Location
120 °
F
D2
W
B
D1 D
P
A
Trailer
.......
.......
End
C
Device
.......
.......
Leader
.......
.......
.......
.......
W1
Start
DIMENSIONS:
10 pitches (min.)
MM
(INCHES)
10 pitches (min.)
Direction of Feed
Item
Symbol
DFN-10
Carrier Width
A
1.70 ± 0.08
(0.067 ± 0.003)
Carrier Length
B
2.30 ± 0.08
(0.091 ± 0.003)
Carrier Depth
C
0.75 ± 0.05
(0.030 ± 0.002)
Sprocket Hole
d
1.15 ± 0.10
(0.045 ± 0.004)
Reel Outside Diameter
D
178
(7.008)
Reel Inner Diameter
D1
54.40 ± 0.40
(2.142 ± 0.016)
Feed Hole Diameter
D2
13.0 ± 0.20
(0.512 ± 0.008)
Sprocket Hole Position
E
1.75 ± 0.10
(0.069 ± 0.004)
Punch Hole Position
F
3.50 ± 0.05
(0.138 ± 0.002)
Punch Hole Pitch
P
4.00 ± 0.10
(0.157 ± 0.004)
Sprocket Hole Pitch
P0
4.00 ± 0.10
(0.157 ± 0.004)
Embossment Center
P1
2.00 ± 0.05
(0.079 ± 0.002)
Overall Tape Thickness
T
0.20 ± 0.30
(0.008 ± 0.012)
Tape Width
W
8.00 +0.30/-0.10
(0.315 +0.012/- 0.004)
Reel Width
W1
12.30 ± 1.00
(0.484 ± 0.039)
--
3000
Quantity per Reel
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
EMEA:
Tel: +36 88 520 390
Fax: +36 88 520 211
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
REV. 12/15
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in
different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.