T PL IA N M CO *R oH S Features Applications ■ RoHS compliant* ■ HDMI 1.3, 1.4 and 2.0 ■ Low capacitance - 0.04 pF ■ DisplayPort (I/O to I/O) ■ ESD protection to IEC 61000-4-2 (Level 4) ■ Digital Visual Interface (DVI) ■ SATA and eSATA ■ USB 3.0 ■ Memory protection ■ SIM card ports CDDFN10-3324P - Surface Mount TVS Diode Array General Information The Model CDDFN10-3324P device provides ESD, CDE and EFT protection for high-speed data ports, meeting IEC 61000-4-2 (ESD) requirements. The Transient Voltage Suppressor array, protecting up to four data lines, offers a Working Peak Reverse Voltage of 3.3 V and a Minimum Breakdown Voltage of 4.5 V. Pin 1 Pin 2 Pin 4 Pin 5 The DFN10 packaged device has an ultra-low typical capacitance of only 0.04 pF between I/O lines. This allows it to be used for protecting sensitive components used on high-speed interfaces. The small footprint of the device allows for flow-through routing on the PCB, helping to maintain matched impedances of the high-speed data lines. Pins 3, 8 Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol CDDFN10-3324P Unit Peak Pulse Power (tp = 8/20 μS) Ppp 30 W Peak Pulse Current (tp = 8/20 μS) Ipp 4 A Operating Temperature TJ -55 to +85 ºC TSTG -55 to +150 ºC Storage Temperature Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Working Peak Reverse Voltage VWM Breakdown Voltage @ 1 mA VBR Leakage Current @ VWM Min. Typ. Max. Unit 3.3 V 4.5 V IR 0.1 0.5 µA Capacitance @ 1.65 V, f = 1 MHz (I/O to GND) CIN 0.45 0.65 pF Capacitance @ 1.65 V, f = 1 MHz (I/O to I/O) CCROSS 0.04 0.08 pF 7.5 V 12 15 kV Clamping Voltage @ 8/20 µs @ IPP ESD Protection per IEC 6-1000-4-2 Contact Discharge Air Discharge VC *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDDFN10-3324P - Surface Mount TVS Diode Array Product Dimensions Recommended Footprint This is a molded DFN10 package with lead free 100 % Matte sn on the lead frame. It weighs approximately 7 mg and has a flammability rating of UL 94V-0. PIN 1 MARKING 0.4 (.016) 0.25 (.010) 1.000 ± 0.050 (.039 ± .002) 1.55 (.061) 0.20 (.008) 0.875 (.034) 2.500 ± 0.050 (.098 ± .002) 0.675 (.027) 0.400 ± 0.050 (.016 ± .002) 0.500 BSC (.020) 1.00 (.039) Typical Part Marking 0.100 (.039) R 0.400 ± 0.050 (.016 ± .002) TYP. 0.50 (.020) PIN 1 IDENTIFICATION CHAMFER 0.100 X 45 ° (.039) CDDFN10-3324P ........................................................................324 1.950 (.077) REF. 0.075 (.003) How to Order CD DFN10 - 33 24 P 0.250 ± 0.050 (.010 ± .002) Common Code Chip Diode 0.200 ± 0.050 (.008 ± .002) Package DFN10 = DFN-10 Package Working Peak Reverse Voltage 33 = 3.3 VRWM (Volts) 0.40 - 0.50 (0.016 - 0.020) Number of Lines 24 = 2 Ground / 4 Data Lines Suffix P = Ultra-low Capacitance 0.152 (.006) REF. 0.000 - 0.050 (.000 - .002) DIMENSIONS: MM (INCHES) Device Pinout 1 10 2 9 3 8 4 7 5 6 Pin Function 1,2,4,5 Input Lines 6,7,9,10 Output Lines (No Internal Connection) 3,8 GND TOP VIEW Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDDFN10-3324P - Surface Mount TVS Diode Array Rating & Characteristic Curves Typical Voltage vs. Capacitance CCROSS 0.8 0.10 0.7 0.09 0.08 0.6 Input Capacitance (pF) Input Capacitance (pF) Typical Voltage vs. Capacitance CIN 0.5 0.4 0.3 0.2 0.06 0.05 0.04 0.03 0.02 f = 1 MHz, T = 25 °C 0.1 0.07 f = 1 MHz, T = 25 °C 0.01 0.0 0.00 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 Input Voltage (V) Input Voltage (V) Typical Insertion Loss S21 Typical Analog Cross Talk 20 0 10 Analog Cross Talk (dB) Insertion Loss (dB) -3 -6 -9 -12 -15 -18 -21 -24 -27 3 GHz: 0.535 dB 0 -10 -20 -30 -40 -50 -60 -70 -30 -80 1e+8 1e+9 1e+8 Frequency (Hz) 1e+9 Frequency (Hz) Transmission Line Pulsing (TLP) Current (A) Typical Transmission Line Pulsing (TLP) 18 16 V_pulse 14 Pulse from a transmission line 12 TLP_I + 100 ns 10 TLP_V - 8 6 4 VCLAMP @ 16 A = 10 V VCLAMP @ 8 A = 7.5 V I/O to GND 2 0 0 1 2 3 4 5 6 7 8 9 10 11 12 Transmission Line Pulsing (TLP) Voltage (V) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDDFN10-3324P - Surface Mount TVS Diode Array Reference Application The Bourns® Model CDDFN10-3324P is designed to protect high-speed data ports from ESD transients. For high-speed ports above 5 Gbps such as HDMI 2.0 and USB 3.0, maintaining signal line impedance is a critical requirement. The use of a DFN10 package using a “feedthrough” layout provides minimal impedance change on the high-speed data line, while the ultra-low capacitance performance of the device limits signal degradation on each channel. HDMI CONNECTOR TMDS_D2+ TMDS_GND TMDS_D2TMDS_D1+ TMDS_GND TMDS_D1- LINE-1 1 10 LINE-2 2 9 TMDS_D0- GND 3 8 4 7 LINE-4 5 6 TO I/O PORT CONNECTOR 1 2 10 9 TO PROTECTED IC TMDS_CK- TMDS_D1+ LINE-1 1 10 LINE-2 2 9 GND 3 8 TO I/O PORT CONNECTOR 4 5 8 7 6 TMDS_D1- LINE-3 4 7 LINE-4 5 6 TMDS_D0+ TMDS_D0GND TMDS_CK+ TMDS_CK- CDDFN10-3324P CE_REMOTE N/C GND Via hole to GND 3 2 1 4 5 6 DDC_CLK 3 GND CDDFN10-3324P TMDS_CK+ TMDS_GND TMDS_D2- LINE-3 TMDS_D0+ TMDS_GND TMDS_D2+ CE_REMOTE DDC_CLK CDSOT236-0504C DDC_DAT GND TO PROTECTED IC Model CDDFN10-3324P Layout on HDMI Port HDMI 2.0 Eye Diagram Test Without Model CDDFN10-3324P (PCB Only) +5 V Via hole to +5 V DDC_DAT +5 V OUT Via hole to GND HOTPLUG_DET C = 100 nF (OPTIONAL) HOTPLUG_DET Feed-Through Layout Model CDDFN10-3324P in HDMI Application HDMI 2.0 Eye Diagram Test With Model CDDFN10-3324P Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 3312 - 2 mm SMD Trimming Potentiometer CDDFN10-3324P - Surface Mount TVS Diode Array Packaging Information The product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481-D standard. P 0 P 1 d T E Index Hole Pin 1 Location 120 ° F D2 W B D1 D P A Trailer ....... ....... End C Device ....... ....... Leader ....... ....... ....... ....... W1 Start DIMENSIONS: 10 pitches (min.) MM (INCHES) 10 pitches (min.) Direction of Feed Item Symbol DFN-10 Carrier Width A 1.70 ± 0.08 (0.067 ± 0.003) Carrier Length B 2.30 ± 0.08 (0.091 ± 0.003) Carrier Depth C 0.75 ± 0.05 (0.030 ± 0.002) Sprocket Hole d 1.15 ± 0.10 (0.045 ± 0.004) Reel Outside Diameter D 178 (7.008) Reel Inner Diameter D1 54.40 ± 0.40 (2.142 ± 0.016) Feed Hole Diameter D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 4.00 ± 0.10 (0.157 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.30 (0.008 ± 0.012) Tape Width W 8.00 +0.30/-0.10 (0.315 +0.012/- 0.004) Reel Width W1 12.30 ± 1.00 (0.484 ± 0.039) -- 3000 Quantity per Reel Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com REV. 12/15 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.