UFF Package Variation: UFF44MA 44-Lead Plastic QFN (4mm × 7mm) (Reference LTC DWG # 05-08-1762 Rev A) 1.48 ±0.05 0.70 ±0.05 4.50 ±0.05 3.10 ±0.05 2.40 REF 1.70 ±0.05 2.56 ±0.05 2.02 ±0.05 2.76 ±0.05 2.64 ±0.05 0.98 ±0.05 PACKAGE OUTLINE 0.20 ±0.05 5.60 REF 6.10 ±0.05 7.50 ±0.05 0.40 BSC RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 ±0.10 0.75 ±0.05 PIN 1 NOTCH R = 0.30 TYP OR 0.35 × 45° CHAMFER 2.40 REF 43 0.00 – 0.05 44 0.40 ±0.10 1 2 PIN 1 TOP MARK (SEE NOTE 6) 2.64 ±0.10 2.56 ±0.10 7.00 ±0.10 5.60 REF 1.70 ±0.10 2.76 ±0.10 R = 0.10 TYP 0.74 ±0.10 R = 0.10 TYP 0.74 ±0.10 (UFF44MA) QFN REV A 0410 0.200 REF R = 0.10 TYP 0.98 ±0.10 0.20 ±0.05 0.40 BSC BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE