PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE SSOP Shrink Small Outline TSSOP Thin Shrink Small Outline SIDE BRAZED PACKAGE OUTLINE* DESCRIPTION LTC NSC ADI TI/BURR-BROWN MAXIM 8-Lead Side Brazed (Hermetic) D8 D D — DA 14-, 16-, 18- and 20-Lead Side Brazed (Hermetic) D D D — DD, DE, DN, DP 14-, 20- and 28-Lead TSSOP (4.4mm) F MT U DL, PW UP, UG, UI 48- and 56-Lead TSSOP (6.1mm) FW MT — DGG UM 16-, 20- and 28-Lead TSSOP (4.4mm) Exposed Die Pad FE MH, MT — PWP UP 16-, 20-, 24- and 28-Lead SSOP (Narrow 0.150) GN MQ RS DBQ 16-, 20-, 28- and 36-Lead Plastic SSOP (5.3mm) G MS RS DB AP, AG, AT GW MS — DB AX 8- and 10-Lead TO-5 Metal Can H H H — TV, TW, VS 3- and 4-Lead TO-39 Metal Can H H H — TV, TW, VS 2-, 3- and 4-Lead Standard TO-46 Metal Can or in Thermal Caps H H H — — 3-Lead TO-52 Metal Can H — — — SR 8-Lead Ceramic DIP (Hermetic) J8 J, J8 Q JG JA 14- and 16-Lead Ceramic DIP (Narrow 0.300, Hermetic) J J, J14, J16 D Q J RD, RN, RE, RP LT, LTC LF, LP, LH, MF, LM AD, OP, REF, CMP TL MAX CERDIP Ceramic Dual-In-Line METAL CANS 36- and 44-Lead SSOP (Wide 0.300) Proprietary Device Prefixes *Package Outlines Above Not to Scale 3 PACKAGE CROSS DIMENSIONS REFERENCE PDIP Plastic Dual-In-Line MSOP DD PAK LCC PACKAGE OUTLINE* LTC NSC ADI TI/BURR-BROWN MAXIM 20-Pin Leadless Chip Carrier (Rectangular, Hermetic) DESCRIPTION L E E FN, FK L 20-Pin Leadless Chip Carrier (Square 0.350, Hermetic) LS E E FN, FK L 3-Lead DD Pak M S — — — 5-Lead DD Pak Q S — — — 7-Lead DD Pak R S — — — 8- and 10-Lead, Micro Small Outline Package (MSOP) MS8, MS MM RM DGK UA, UB 8- and 10-Lead Micro Small Outline Package (MSOP), Exposed Die Pad Option MS8E, MSE — — — UA, UB 8-Lead PDIP, Plastic Dual-In-Line N8 N, N8 N P P 14-, 16-, 18-, 20- and 24-Lead PDIP, Plastic Dual-In-Line (Narrow 0.300) N N, N14 N N NE ND, NE, NN, NP, NG NW — N N PI 3-Lead TO-3P (Similar to TO-247) P — — — K 8-Lead SO (Narrow 0.150) S8 M R D SA 14- and 16-Lead Plastic SO (Narrow 0.150) S M R D SD, SE 16-, 18-, 20-, 24- and 28-Lead SO (Wide 0.300) SW M R D WE, WN, WP, WF, WG, WI 3-Lead SOT-223 Small Outline Transistor ST MP — — UR 3-Lead SOT-23 S3, M3 RT, DBZ UR, US S5, S6, TS8 M5, M6 UJ DBV UT, UK SC6, SC8 MG KS DCK XT LT, LTC LF, LP, LH, MF, LM AD, OP, REF, CMP TL MAX SOT and SC70 Small Outline SO Small Outline TO-3P (TO-247) 28-Lead PDIP, Plastic Dual-In-Line (Wide 0.600) 5-, 6- and 8-Lead TSOT 6- and 8-Lead SC70 Proprietary Device Prefixes *Package Outlines Above Not to Scale 4 PACKAGE PACKAGE CROSSDIMENSIONS REFERENCE TO-92 FLATPAK DFN Dual Flat No Lead QFN Quad Flat No Lead TO-220 PACKAGE OUTLINE* LTC NSC ADI TI/BURR-BROWN MAXIM 3- and 5-Lead TO-220 DESCRIPTION T T T T — — KC KV C C 7-Lead TO-220 (Formerly Y Package) T7 — — KC C 16- and 20-Lead QFN (3mm × 3mm) UD — CP** RGT UD 16-, 20-, 24- and 28-Lead QFN (4mm × 4mm) UF LQA CP** RGT, RGF TE, TG 20-, 24- and 28-Lead QFN (4mm × 5mm) UFD — — — — 32-Lead QFN (5mm × 5mm) UH — — RHB** TJ 38-Lead QFN (5mm × 7mm) UHF — — — — 40-Lead QFN (6mm × 6mm) UJ — — — — 48-Lead QFN (7mm × 7mm) UK — CP** RGZ** TM 56-Lead QFN (5mm × 9mm) UHH — — — — 52-Lead QFN (7mm × 8mm) UKG — — — — 64-Lead QFN (9mm × 9mm) UP — CP** RTD** — 8-, 10- and 12-Lead DFN (3mm × 3mm) DD — CP** DRB, DRC TA 8-, 10- and 12-Lead DFN (3mm × 2mm) DDB — CP** — — 3-, 4-, 6- and 8-Lead DFN (2mm × 2mm) DC — — — — 6- and 8-Lead DFN (2mm × 3mm) DCB — — — — 12-Lead DFN (4mm × 3mm) UE — — — — 12- and 14-Lead DFN (4mm × 3mm) DE — — — — 16-Lead DFN (5mm × 5mm) DH — — — — 16-Lead DFN (5mm × 3mm) DHC — — — — 16-Lead DFN (5mm × 4mm) DHD — — — — 22-Lead DFN (6mm × 3mm) DJC — — — — 10- and 14-Lead Flatpak, Glass Sealed (Hermetic) W W L UO10 FB 10- and 14-Lead Flatpak, Metal Sealed, Bottom Brazed (Hermetic) WB F AH-148, LM WO10, WO14 M Z Z — LP ZR LT, LTC LF, LP LH, MF LM AD, OP, REF, CMP TL MAX 3-Lead, TO-92 Package Proprietary Device Prefixes *Package Outlines Above Not to Scale **Closest Package, Comparable Footprint, Higher Height 5