Package Cross Reference

PACKAGE
PACKAGE
CROSSDIMENSIONS
REFERENCE
SSOP
Shrink Small Outline
TSSOP
Thin Shrink
Small Outline
SIDE BRAZED
PACKAGE OUTLINE*
DESCRIPTION
LTC
NSC
ADI
TI/BURR-BROWN
MAXIM
8-Lead Side Brazed (Hermetic)
D8
D
D
—
DA
14-, 16-, 18- and 20-Lead
Side Brazed (Hermetic)
D
D
D
—
DD, DE,
DN, DP
14-, 20- and 28-Lead TSSOP
(4.4mm)
F
MT
U
DL,
PW
UP,
UG,
UI
48- and 56-Lead TSSOP (6.1mm)
FW
MT
—
DGG
UM
16-, 20- and 28-Lead TSSOP
(4.4mm) Exposed Die Pad
FE
MH,
MT
—
PWP
UP
16-, 20-, 24- and 28-Lead
SSOP (Narrow 0.150)
GN
MQ
RS
DBQ
16-, 20-, 28- and 36-Lead
Plastic SSOP (5.3mm)
G
MS
RS
DB
AP,
AG,
AT
GW
MS
—
DB
AX
8- and 10-Lead TO-5 Metal Can
H
H
H
—
TV,
TW,
VS
3- and 4-Lead TO-39 Metal Can
H
H
H
—
TV,
TW,
VS
2-, 3- and 4-Lead Standard TO-46
Metal Can or in Thermal Caps
H
H
H
—
—
3-Lead TO-52
Metal Can
H
—
—
—
SR
8-Lead Ceramic DIP (Hermetic)
J8
J,
J8
Q
JG
JA
14- and 16-Lead Ceramic DIP
(Narrow 0.300, Hermetic)
J
J,
J14,
J16
D
Q
J
RD, RN,
RE, RP
LT,
LTC
LF, LP,
LH, MF,
LM
AD,
OP,
REF,
CMP
TL
MAX
CERDIP
Ceramic
Dual-In-Line
METAL CANS
36- and 44-Lead
SSOP (Wide 0.300)
Proprietary Device Prefixes
*Package Outlines Above Not to Scale
3
PACKAGE CROSS
DIMENSIONS
REFERENCE
PDIP
Plastic Dual-In-Line
MSOP
DD PAK
LCC
PACKAGE OUTLINE*
LTC
NSC
ADI
TI/BURR-BROWN
MAXIM
20-Pin Leadless Chip Carrier
(Rectangular, Hermetic)
DESCRIPTION
L
E
E
FN,
FK
L
20-Pin Leadless Chip Carrier
(Square 0.350, Hermetic)
LS
E
E
FN,
FK
L
3-Lead DD Pak
M
S
—
—
—
5-Lead DD Pak
Q
S
—
—
—
7-Lead DD Pak
R
S
—
—
—
8- and 10-Lead, Micro Small
Outline Package (MSOP)
MS8,
MS
MM
RM
DGK
UA,
UB
8- and 10-Lead Micro Small Outline
Package (MSOP), Exposed Die Pad Option
MS8E,
MSE
—
—
—
UA,
UB
8-Lead PDIP, Plastic Dual-In-Line
N8
N,
N8
N
P
P
14-, 16-, 18-, 20- and 24-Lead
PDIP, Plastic Dual-In-Line
(Narrow 0.300)
N
N,
N14
N
N
NE
ND, NE, NN,
NP, NG
NW
—
N
N
PI
3-Lead TO-3P
(Similar to TO-247)
P
—
—
—
K
8-Lead SO
(Narrow 0.150)
S8
M
R
D
SA
14- and 16-Lead Plastic SO
(Narrow 0.150)
S
M
R
D
SD,
SE
16-, 18-, 20-, 24- and 28-Lead
SO (Wide 0.300)
SW
M
R
D
WE, WN,
WP, WF,
WG, WI
3-Lead SOT-223
Small Outline Transistor
ST
MP
—
—
UR
3-Lead SOT-23
S3,
M3
RT,
DBZ
UR, US
S5, S6,
TS8
M5,
M6
UJ
DBV
UT, UK
SC6, SC8
MG
KS
DCK
XT
LT,
LTC
LF, LP,
LH, MF,
LM
AD,
OP,
REF,
CMP
TL
MAX
SOT and SC70
Small Outline
SO
Small Outline
TO-3P
(TO-247)
28-Lead PDIP, Plastic Dual-In-Line
(Wide 0.600)
5-, 6- and 8-Lead TSOT
6- and 8-Lead SC70
Proprietary Device Prefixes
*Package Outlines Above Not to Scale
4
PACKAGE
PACKAGE
CROSSDIMENSIONS
REFERENCE
TO-92
FLATPAK
DFN
Dual Flat
No Lead
QFN
Quad Flat
No Lead
TO-220
PACKAGE OUTLINE*
LTC
NSC
ADI
TI/BURR-BROWN
MAXIM
3- and 5-Lead TO-220
DESCRIPTION
T
T
T
T
—
—
KC
KV
C
C
7-Lead TO-220
(Formerly Y Package)
T7
—
—
KC
C
16- and 20-Lead QFN (3mm × 3mm)
UD
—
CP**
RGT
UD
16-, 20-, 24- and 28-Lead QFN
(4mm × 4mm)
UF
LQA
CP**
RGT, RGF
TE, TG
20-, 24- and 28-Lead QFN
(4mm × 5mm)
UFD
—
—
—
—
32-Lead QFN (5mm × 5mm)
UH
—
—
RHB**
TJ
38-Lead QFN (5mm × 7mm)
UHF
—
—
—
—
40-Lead QFN (6mm × 6mm)
UJ
—
—
—
—
48-Lead QFN (7mm × 7mm)
UK
—
CP**
RGZ**
TM
56-Lead QFN (5mm × 9mm)
UHH
—
—
—
—
52-Lead QFN (7mm × 8mm)
UKG
—
—
—
—
64-Lead QFN (9mm × 9mm)
UP
—
CP**
RTD**
—
8-, 10- and 12-Lead DFN (3mm × 3mm)
DD
—
CP**
DRB, DRC
TA
8-, 10- and 12-Lead DFN (3mm × 2mm)
DDB
—
CP**
—
—
3-, 4-, 6- and 8-Lead DFN (2mm × 2mm)
DC
—
—
—
—
6- and 8-Lead DFN (2mm × 3mm)
DCB
—
—
—
—
12-Lead DFN (4mm × 3mm)
UE
—
—
—
—
12- and 14-Lead DFN (4mm × 3mm)
DE
—
—
—
—
16-Lead DFN (5mm × 5mm)
DH
—
—
—
—
16-Lead DFN (5mm × 3mm)
DHC
—
—
—
—
16-Lead DFN (5mm × 4mm)
DHD
—
—
—
—
22-Lead DFN (6mm × 3mm)
DJC
—
—
—
—
10- and 14-Lead Flatpak, Glass Sealed
(Hermetic)
W
W
L
UO10
FB
10- and 14-Lead Flatpak, Metal
Sealed, Bottom Brazed
(Hermetic)
WB
F
AH-148,
LM
WO10,
WO14
M
Z
Z
—
LP
ZR
LT,
LTC
LF, LP
LH, MF
LM
AD,
OP,
REF,
CMP
TL
MAX
3-Lead, TO-92 Package
Proprietary Device Prefixes
*Package Outlines Above Not to Scale
**Closest Package, Comparable Footprint, Higher Height
5